PL2638118T3 - Przyczepna masa klejąca i metoda uszczelniania układu elektronicznego - Google Patents

Przyczepna masa klejąca i metoda uszczelniania układu elektronicznego

Info

Publication number
PL2638118T3
PL2638118T3 PL11779146T PL11779146T PL2638118T3 PL 2638118 T3 PL2638118 T3 PL 2638118T3 PL 11779146 T PL11779146 T PL 11779146T PL 11779146 T PL11779146 T PL 11779146T PL 2638118 T3 PL2638118 T3 PL 2638118T3
Authority
PL
Poland
Prior art keywords
encapsulating
electronic assembly
adhesive compound
adhesive
compound
Prior art date
Application number
PL11779146T
Other languages
English (en)
Inventor
Thorsten Krawinkel
KLAUS KEITE-TELGENBüSCHER
Judith Grünauer
Jan Ellinger
Alexander Steen
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2638118T3 publication Critical patent/PL2638118T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/44—Preparation of metal salts or ammonium salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
PL11779146T 2010-11-12 2011-10-27 Przyczepna masa klejąca i metoda uszczelniania układu elektronicznego PL2638118T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010043866A DE102010043866A1 (de) 2010-11-12 2010-11-12 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
EP11779146.7A EP2638118B1 (de) 2010-11-12 2011-10-27 Klebmasse und verfahren zur kapselung einer elektronischen anordnung
PCT/EP2011/068821 WO2012062586A1 (de) 2010-11-12 2011-10-27 Klebmasse und verfahren zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
PL2638118T3 true PL2638118T3 (pl) 2018-03-30

Family

ID=44907848

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11779146T PL2638118T3 (pl) 2010-11-12 2011-10-27 Przyczepna masa klejąca i metoda uszczelniania układu elektronicznego

Country Status (8)

Country Link
EP (1) EP2638118B1 (pl)
KR (1) KR101939134B1 (pl)
CN (1) CN103347970B (pl)
DE (1) DE102010043866A1 (pl)
ES (1) ES2657711T3 (pl)
PL (1) PL2638118T3 (pl)
TW (1) TW201229179A (pl)
WO (1) WO2012062586A1 (pl)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9419065B2 (en) 2012-08-07 2016-08-16 Apple Inc. Flexible displays
TWI497734B (zh) * 2012-11-20 2015-08-21 Ind Tech Res Inst 模組結構
US9412921B2 (en) 2012-11-20 2016-08-09 Industrial Technology Research Institute Module structure
TW201436855A (zh) 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
US9504124B2 (en) 2013-01-03 2016-11-22 Apple Inc. Narrow border displays for electronic devices
JP2014146582A (ja) * 2013-01-30 2014-08-14 Furukawa Electric Co Ltd:The 封止シートおよび有機電子デバイス用素子の封止方法
US9516743B2 (en) 2013-02-27 2016-12-06 Apple Inc. Electronic device with reduced-stress flexible display
JP6360680B2 (ja) * 2013-12-20 2018-07-18 リンテック株式会社 封止シート、封止体および装置
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
BR112017008003A2 (pt) 2014-10-29 2017-12-19 Tesa Se massas adesivas compreendendo siloxanos multifuncionais sequestrantes de água
US9614168B2 (en) 2015-01-12 2017-04-04 Apple Inc. Flexible display panel with bent substrate
DE102015222027A1 (de) 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
KR102003451B1 (ko) * 2016-06-30 2019-07-24 코오롱인더스트리 주식회사 경화 가능한 석유수지, 이의 제조방법 및 이의 용도
DE102017202668A1 (de) * 2017-02-20 2018-08-23 Tesa Se Vernetzbare Haftklebmasse
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
EP3786192B1 (en) 2019-08-21 2024-07-17 DL Chemical Co., Ltd. Modified polyisobutylene polymer for rubber compounding and rubber composition comprising same

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
JP2644861B2 (ja) * 1988-11-21 1997-08-25 鐘淵化学工業株式会社 ２液型硬化性組成物
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
KR100430958B1 (ko) 1996-11-12 2004-05-12 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 열경화성의 감압성 접착제
BR9906549B1 (pt) * 1998-06-22 2009-01-13 composições de elastÈmeros termoplásticos vulcanizados de silano e processo para a preparação das mesmas.
US7193594B1 (en) 1999-03-18 2007-03-20 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2000311782A (ja) 1999-04-27 2000-11-07 Nec Corp 有機ｅｌディスプレイおよびその製造方法
DE19929011A1 (de) * 1999-06-25 2000-12-28 Bayer Ag Spezielle Aminosilane enthaltende, kondensationsvernetzende Polyurethanmassen, ein Verfahren zu ihrer Herstellung sowie ihre Verwendung
US6833668B1 (en) 1999-09-29 2004-12-21 Sanyo Electric Co., Ltd. Electroluminescence display device having a desiccant
WO2001092344A2 (en) 2000-06-01 2001-12-06 Kraton Polymers Research, B.V. Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
DE10048059A1 (de) 2000-09-28 2002-04-18 Henkel Kgaa Klebstoff mit Barriereeigenschaften
KR20040019098A (ko) 2001-08-03 2004-03-04 디에스엠 엔.브이 표시 장치용 경화성 조성물
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
US7449629B2 (en) * 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
JP4327489B2 (ja) 2003-03-28 2009-09-09 本田技研工業株式会社 燃料電池用金属製セパレータおよびその製造方法
US20060235156A1 (en) * 2005-04-14 2006-10-19 Griswold Roy M Silylated thermoplastic vulcanizate compositions
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP5616020B2 (ja) * 2006-01-26 2014-10-29 シーカ・テクノロジー・アーゲー 良好な接着特性を備えたシラン官能性ポリマーおよびアミノシラン付加物を含有する湿気硬化性組成物
EP1849845A1 (de) * 2006-04-26 2007-10-31 Sika Technology AG Feuchtigkeitshärtende Zusammensetzungen enthaltend silanfunktionelle Polymere und Aminosilan-Addukte
DE102006047738A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008062130A1 (de) * 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036968A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

Also Published As

Publication number Publication date
EP2638118B1 (de) 2017-12-06
DE102010043866A1 (de) 2012-05-16
KR101939134B1 (ko) 2019-01-16
KR20130119940A (ko) 2013-11-01
TW201229179A (en) 2012-07-16
EP2638118A1 (de) 2013-09-18
CN103347970B (zh) 2014-09-10
ES2657711T3 (es) 2018-03-06
WO2012062586A1 (de) 2012-05-18
CN103347970A (zh) 2013-10-09

Similar Documents

Publication Publication Date Title
PL2649642T3 (pl) Masa klejąca i metoda hermetyzacji układu elektronicznego
PL2465149T3 (pl) Sposób hermetyzacji układu elektronicznego
PL2465150T3 (pl) Metoda hermetyzacji układu elektronicznego
PL2279537T3 (pl) Metoda hermetyzacji układu elektronicznego
EP2656955A4 (en) Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component
EP2637204B8 (en) An electronic component element housing package
EP2862038B8 (en) Electronic device housing and assembly method
IL225467A0 (en) Adhesive tape and method for producing adhesive tape
EP2530130A4 (en) CONDUCTIVE TAPE
EP2642841A4 (en) Electronic device
PH12013500427A1 (en) Method for manufacturing electronic component
PL2652812T3 (pl) Sposób wytwarzania urządzenia oled
GB2483352B (en) Method of manufacturing electronic element and electronic element
EP2624673A4 (en) INTEGRATED COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING INTEGRATED COMPONENT SUBSTRATE
EP2560466A4 (en) BOARD AND METHOD FOR PRODUCING A BOARD
PT2361752E (pt) Componente de compósito fibroso e respectivo processo de fabricação
PL2545253T3 (pl) Urządzenie mocujące i sposób mocowania elementu konstrukcyjnego za pomocą środka klejącego na wsporniku elementu konstrukcyjnego
PL2447835T3 (pl) Sposób konfiguracji jednostki elektronicznej
PL2526531T3 (pl) Sposób zabezpieczania obiektu i odpowiedni obiekt
EP2610969A4 (en) CONDUCTIVE RUBBER COMPONENTS AND ASSEMBLY METHOD THEREFOR
EP2563105A4 (en) METHOD FOR MANUFACTURING PRINTED SUBSTRATE, AND PRINTED SUBSTRATE USING THE SAME
PL2552649T3 (pl) Urządzenie montażowe i sposób montażu
IL225782A0 (en) System and method for packaging electronic devices
EP2595181B8 (en) Compound semiconductor device and manufacturing method thereof
TWI563658B (en) Compound semiconductor device and manufacturing method thereof