PL2697827T3 - Urządzenie chłodzące dla modułu elektronicznego urządzenia gospodarstwa domowego, urządzenie gospodarstwa domowego z urządzeniem chłodzącym - Google Patents

Urządzenie chłodzące dla modułu elektronicznego urządzenia gospodarstwa domowego, urządzenie gospodarstwa domowego z urządzeniem chłodzącym

Info

Publication number
PL2697827T3
PL2697827T3 PL12715017T PL12715017T PL2697827T3 PL 2697827 T3 PL2697827 T3 PL 2697827T3 PL 12715017 T PL12715017 T PL 12715017T PL 12715017 T PL12715017 T PL 12715017T PL 2697827 T3 PL2697827 T3 PL 2697827T3
Authority
PL
Poland
Prior art keywords
cooling device
household appliance
electronic module
household
appliance
Prior art date
Application number
PL12715017T
Other languages
English (en)
Inventor
Hasan Gökcer Albayrak
David Paul Michaud
Rudolf Seidl
Jörg SKRIPPEK
Original Assignee
Bsh Hausgeraete Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bsh Hausgeraete Gmbh filed Critical Bsh Hausgeraete Gmbh
Publication of PL2697827T3 publication Critical patent/PL2697827T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL12715017T 2011-04-12 2012-04-03 Urządzenie chłodzące dla modułu elektronicznego urządzenia gospodarstwa domowego, urządzenie gospodarstwa domowego z urządzeniem chłodzącym PL2697827T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011007171A DE102011007171A1 (de) 2011-04-12 2011-04-12 Kühlvorrichtung für ein Elektronikmodul eines Haushaltsgeräts sowie Baugruppe und Haushaltsgerät mit einer Kühlvorrichtung
PCT/EP2012/056082 WO2012139935A1 (de) 2011-04-12 2012-04-03 Kühlvorrichtung für ein elektronikmodul eines haushaltsgeräts sowie baugruppe und haushaltsgerät mit einer kühlvorrichtung
EP12715017.5A EP2697827B1 (de) 2011-04-12 2012-04-03 Kühlvorrichtung für ein elektronikmodul eines haushaltsgeräts sowie haushaltsgerät mit einer kühlvorrichtung

Publications (1)

Publication Number Publication Date
PL2697827T3 true PL2697827T3 (pl) 2016-08-31

Family

ID=45976322

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12715017T PL2697827T3 (pl) 2011-04-12 2012-04-03 Urządzenie chłodzące dla modułu elektronicznego urządzenia gospodarstwa domowego, urządzenie gospodarstwa domowego z urządzeniem chłodzącym

Country Status (5)

Country Link
EP (1) EP2697827B1 (pl)
CN (1) CN103460378B (pl)
DE (1) DE102011007171A1 (pl)
PL (1) PL2697827T3 (pl)
WO (1) WO2012139935A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013223430A1 (de) 2013-11-18 2015-05-21 BSH Hausgeräte GmbH Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung
DE102014200775A1 (de) 2014-01-17 2015-07-23 BSH Hausgeräte GmbH Waschmaschine mit Ausnutzung der Elektronikmodulverlustwärme
US10653038B2 (en) 2016-04-14 2020-05-12 Microsoft Technology Licensing, Llc Heat spreader
DE102019103071A1 (de) * 2019-02-07 2020-08-13 Fujitsu Client Computing Limited Computersystem und wärmeleitkörper

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721308Y2 (ja) * 1990-10-30 1995-05-17 信越化学工業株式会社 熱伝導性シート
JPH0823183A (ja) * 1994-07-06 1996-01-23 Matsushita Electric Ind Co Ltd 部材の冷却構造
US5896269A (en) * 1996-11-27 1999-04-20 Gateway 2000, Inc. Positive pressure heat sink conduit
TWI257543B (en) * 2003-07-02 2006-07-01 Delta Electronics Inc Equalizing temperature device
US20070053168A1 (en) * 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
KR100664349B1 (ko) * 2005-09-30 2007-01-02 자화전자(주) 조명용 엘이디 기판 및 이를 포함하는 조명 유닛
EP1860165A1 (en) * 2006-05-24 2007-11-28 ARCELOR France Organic coated metallic substrate with enhanced heat transfer properties and method of production thereof
CN201015124Y (zh) * 2006-08-10 2008-01-30 上海清能燃料电池技术有限公司 一种多组模块式的发电装置
DE102007027901A1 (de) * 2007-06-18 2008-12-24 Robert Bosch Gmbh Leistungselektronikmodul
JP4558012B2 (ja) * 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
KR101418025B1 (ko) * 2008-07-10 2014-07-09 그라프텍 인터내셔널 홀딩스 인코포레이티드 로우 프로파일 장치를 위한 향상된 열 방산
AT11107U1 (de) * 2008-11-20 2010-04-15 Plansee Se Wärmesenke sowie verfahren zu deren herstellung
JP5271879B2 (ja) * 2008-11-28 2013-08-21 富士高分子工業株式会社 熱拡散シート及びその実装方法
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
DE102010001958A1 (de) * 2010-02-16 2011-08-18 Robert Bosch GmbH, 70469 Elektronisches Steuergerät

Also Published As

Publication number Publication date
CN103460378B (zh) 2016-08-24
DE102011007171A1 (de) 2012-10-18
EP2697827B1 (de) 2016-03-23
EP2697827A1 (de) 2014-02-19
CN103460378A (zh) 2013-12-18
WO2012139935A1 (de) 2012-10-18

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