PL2774184T3 - Sposób i urządzenie do wytwarzania wspieranego laserowo elektrycznie przewodzącego styku na powierzchni przedmiotu - Google Patents

Sposób i urządzenie do wytwarzania wspieranego laserowo elektrycznie przewodzącego styku na powierzchni przedmiotu

Info

Publication number
PL2774184T3
PL2774184T3 PL12794178.9T PL12794178T PL2774184T3 PL 2774184 T3 PL2774184 T3 PL 2774184T3 PL 12794178 T PL12794178 T PL 12794178T PL 2774184 T3 PL2774184 T3 PL 2774184T3
Authority
PL
Poland
Prior art keywords
electrically conductive
conductive contact
producing laser
assisted electrically
assisted
Prior art date
Application number
PL12794178.9T
Other languages
English (en)
Inventor
Wolfgang Schmutz
Thomas Rainer
Kristin PLAT
Steffen Kürbitz
Original Assignee
Hegla Boraident Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hegla Boraident Gmbh & Co. Kg filed Critical Hegla Boraident Gmbh & Co. Kg
Publication of PL2774184T3 publication Critical patent/PL2774184T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Manufacture Of Switches (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
PL12794178.9T 2011-11-03 2012-11-05 Sposób i urządzenie do wytwarzania wspieranego laserowo elektrycznie przewodzącego styku na powierzchni przedmiotu PL2774184T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011085714A DE102011085714A1 (de) 2011-11-03 2011-11-03 Verfahren und Vorrichtung zur Erzeugung einer lasergestützten elektrisch leitfähigen Kontaktierung einer Objektoberfläche
PCT/EP2012/004596 WO2013064267A1 (de) 2011-11-03 2012-11-05 Verfahren und vorrichtung zur erzeugung einer lasergestützten elektrisch leitfähigen kontaktierung einer objektoberfläche

Publications (1)

Publication Number Publication Date
PL2774184T3 true PL2774184T3 (pl) 2023-04-17

Family

ID=47263222

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12794178.9T PL2774184T3 (pl) 2011-11-03 2012-11-05 Sposób i urządzenie do wytwarzania wspieranego laserowo elektrycznie przewodzącego styku na powierzchni przedmiotu

Country Status (9)

Country Link
EP (1) EP2774184B1 (pl)
DE (1) DE102011085714A1 (pl)
DK (1) DK2774184T3 (pl)
ES (1) ES2939243T3 (pl)
FI (1) FI2774184T3 (pl)
HR (1) HRP20230114T1 (pl)
PL (1) PL2774184T3 (pl)
PT (1) PT2774184T (pl)
WO (1) WO2013064267A1 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2955981A1 (en) * 2014-06-13 2015-12-16 Irepa Laser Method for manufacturing selective surface deposition using a pulsed radiation treatment
CN107395943B (zh) * 2017-08-31 2023-10-20 Oppo广东移动通信有限公司 接地组件、摄像头模组及移动终端
DE102021213645A1 (de) 2021-12-01 2023-06-01 Hegla Boraident Gmbh & Co. Kg Einzäunung, vorzugsweise für Tiergehege sowie Verwendung einer Glastafel dafür und Verwendung von Laservorrichtungen
DE102021215023B3 (de) 2021-12-23 2023-05-11 Hegla Boraident Gmbh & Co. Kg Mobile Laservorrichtung und deren Verwendung sowie Verfahren zur Bearbeitung einer Glastafel
CN115799354B (zh) * 2022-11-03 2023-06-06 中国科学院力学研究所 一种调控激光金属化栅线几何形貌的方法
DE102023205505B3 (de) 2023-06-13 2024-09-05 Hegla Boraident Gmbh & Co. Kg Lasertransferdruckvorrichtung und deren Verwendung sowie Verfahren zum Beschichten einer Glastafel mittels Lasertransferdruck

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4895735A (en) * 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
JP2000509909A (ja) * 1997-02-21 2000-08-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 熱フォイルエンボス技術を用いた基板を選択的にメタライズする方法
US6060127A (en) * 1998-03-31 2000-05-09 Matsushita Electric Industrial Co., Ltd. Mechanically restricted laser deposition
DE102006040352B3 (de) * 2006-08-29 2007-10-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen von elektrischen Kontakten auf halbleitende Substrate, halbleitendes Substrat und Verwendung des Verfahrens
DE102006044936B4 (de) * 2006-09-22 2008-08-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Metallisierung von Solarzellen und dessen Verwendung
DE102008057228A1 (de) * 2008-01-17 2009-07-23 Schmid Technology Gmbh Verfahren und Vorrichtung zur Herstellung einer Solarzelle

Also Published As

Publication number Publication date
EP2774184B1 (de) 2023-01-04
EP2774184A1 (de) 2014-09-10
DE102011085714A1 (de) 2013-05-08
FI2774184T3 (fi) 2023-03-18
HRP20230114T1 (hr) 2023-03-17
WO2013064267A1 (de) 2013-05-10
PT2774184T (pt) 2023-02-07
ES2939243T3 (es) 2023-04-20
DK2774184T3 (da) 2023-03-20

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