PL2835030T3 - Płytka obwodów drukowanych z osadzoną grzałką - Google Patents

Płytka obwodów drukowanych z osadzoną grzałką

Info

Publication number
PL2835030T3
PL2835030T3 PL13736269T PL13736269T PL2835030T3 PL 2835030 T3 PL2835030 T3 PL 2835030T3 PL 13736269 T PL13736269 T PL 13736269T PL 13736269 T PL13736269 T PL 13736269T PL 2835030 T3 PL2835030 T3 PL 2835030T3
Authority
PL
Poland
Prior art keywords
circuit board
printed circuit
embedded heater
heater
embedded
Prior art date
Application number
PL13736269T
Other languages
English (en)
Inventor
Gil White
Original Assignee
Viasystems Tech Corp L L C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasystems Tech Corp L L C filed Critical Viasystems Tech Corp L L C
Publication of PL2835030T3 publication Critical patent/PL2835030T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/004—Heaters using a particular layout for the resistive material or resistive elements using zigzag layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/006—Heaters using a particular layout for the resistive material or resistive elements using interdigitated electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PL13736269T 2012-01-13 2013-01-11 Płytka obwodów drukowanych z osadzoną grzałką PL2835030T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261586691P 2012-01-13 2012-01-13
US13/482,702 US9012811B2 (en) 2012-01-13 2012-05-29 Printed circuit board with embedded heater
EP13736269.5A EP2835030B9 (en) 2012-01-13 2013-01-11 Printed circuit board with embedded heater

Publications (1)

Publication Number Publication Date
PL2835030T3 true PL2835030T3 (pl) 2017-07-31

Family

ID=48779277

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13736269T PL2835030T3 (pl) 2012-01-13 2013-01-11 Płytka obwodów drukowanych z osadzoną grzałką

Country Status (9)

Country Link
US (1) US9012811B2 (pl)
EP (1) EP2835030B9 (pl)
KR (1) KR20140145111A (pl)
CN (1) CN104380837B (pl)
DK (1) DK2835030T3 (pl)
ES (1) ES2616684T3 (pl)
HU (1) HUE033225T2 (pl)
PL (1) PL2835030T3 (pl)
WO (1) WO2013106682A1 (pl)

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DE102013114006A1 (de) 2013-12-13 2015-06-18 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Leiterplatte
US9210991B2 (en) * 2014-02-28 2015-12-15 Intel Corporation Apparatus and method for keeping mobile devices warm in cold climates
DE102014015586B3 (de) * 2014-10-21 2016-03-31 Webasto SE Heizgerät
EP3043438B1 (en) * 2015-01-09 2018-11-28 ABB Schweiz AG A power and control device for medium voltage applications
US10178763B2 (en) * 2015-12-21 2019-01-08 Intel Corporation Warpage mitigation in printed circuit board assemblies
US10260961B2 (en) 2015-12-21 2019-04-16 Intel Corporation Integrated circuit packages with temperature sensor traces
GB201601370D0 (en) 2016-01-26 2016-03-09 Haydale Graphene Ind Plc Heater
KR102329513B1 (ko) * 2016-05-10 2021-11-23 램 리써치 코포레이션 적층된 히터와 히터 전압 입력부들 사이의 연결부들
US10880994B2 (en) 2016-06-02 2020-12-29 Intel Corporation Top-side connector interface for processor packaging
US10285283B2 (en) 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
CN106304621A (zh) * 2016-10-26 2017-01-04 邦彦技术股份有限公司 一种pcb板的加热方法及装置、pcb板组件和电子设备
US10372182B2 (en) * 2017-01-13 2019-08-06 International Business Machines Corporation Reducing thermal cycling fatigue
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method
US10306776B1 (en) 2017-11-29 2019-05-28 Lam Research Corporation Substrate processing system printed-circuit control board assembly with one or more heater layers
US10887979B2 (en) 2018-01-10 2021-01-05 Hamilton Sunstrand Corporation Low cycle fatigue prevention
US10561011B1 (en) * 2018-08-24 2020-02-11 Loon Llc Combined heat sink and photon harvestor
US11545408B2 (en) * 2019-01-16 2023-01-03 Intel Corporation Reflowable grid array to support grid heating
US11488839B2 (en) * 2019-01-16 2022-11-01 Intel Corporation Reflowable grid array as standby heater for reliability
WO2021002387A1 (ja) * 2019-07-04 2021-01-07 パナソニックＩｐマネジメント株式会社 記憶装置ユニット
CN112492706A (zh) * 2019-09-12 2021-03-12 恒为科技（上海）股份有限公司 一种电气设备及控制方法
US10939537B1 (en) * 2019-12-19 2021-03-02 Honeywell International Inc. Printed circuit board assembly embedded thermal management system using thin-film thermoelectric coolers
US11638344B1 (en) 2020-03-25 2023-04-25 Rockwell Collins, Inc. Embedded electronic heater controller
US11709008B2 (en) 2020-09-30 2023-07-25 Midea Group Co., Ltd. Refrigerator with multi-zone ice maker
TWI787777B (zh) * 2021-04-01 2022-12-21 歆熾電氣技術股份有限公司 基板及電路基板
US12336084B2 (en) 2021-12-23 2025-06-17 Xerox Corporation Humidity-adjusted power supply
US12339051B2 (en) 2022-04-11 2025-06-24 Midea Group Co., Ltd. Refrigerator with a thermally conductive component with heater for ice maker
US12315774B2 (en) * 2022-07-05 2025-05-27 Nanya Technology Corporation Semiconductor structure having heat dissipation structure
US12456630B2 (en) 2022-07-05 2025-10-28 Nanya Technology Corporation Method of manufacturing semiconductor structure having heat dissipation structure
JP2024082568A (ja) * 2022-12-08 2024-06-20 株式会社東芝 電子モジュール
DE102024134032A1 (de) 2024-11-20 2026-05-21 Karl Storz Se & Co. Kg Zerlegung und Entsorgung eines medizinischen Instruments
DE102024134027A1 (de) 2024-11-20 2026-05-21 Karl Storz Se & Co. Kg Zerlegung und Entsorgung eines medizinischen Instruments
DE102024134029B3 (de) 2024-11-20 2026-03-12 Karl Storz Se & Co. Kg Zerlegung und Entsorgung eines medizinischen Instruments
DE102024134030A1 (de) 2024-11-20 2026-05-21 Karl Storz Se & Co. Kg Zerlegung und Entsorgung eines medizinischen Instruments
DE102024134028A1 (de) 2024-11-20 2026-05-21 Karl Storz Se & Co. Kg Zerlegung und Entsorgung eines medizinischen Instruments

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US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
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US8089440B2 (en) * 2008-04-02 2012-01-03 American Panel Corporation Liquid crystal flat panel display with an integral heater of predeterminable capacity
US8445818B2 (en) * 2009-05-05 2013-05-21 Sierra Wireless, Inc. PCB quick heater

Also Published As

Publication number Publication date
HK1206536A1 (en) 2016-01-08
US20130180973A1 (en) 2013-07-18
EP2835030B9 (en) 2017-03-15
EP2835030A4 (en) 2015-09-30
HUE033225T2 (en) 2017-11-28
EP2835030B1 (en) 2016-12-14
CN104380837B (zh) 2016-11-09
CN104380837A (zh) 2015-02-25
WO2013106682A1 (en) 2013-07-18
DK2835030T3 (en) 2017-02-20
ES2616684T3 (es) 2017-06-14
KR20140145111A (ko) 2014-12-22
US9012811B2 (en) 2015-04-21
EP2835030A1 (en) 2015-02-11

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