PL2848106T3 - Obudowy elektroniki o dużej sprawności cieplnej i powiązany sposób - Google Patents

Obudowy elektroniki o dużej sprawności cieplnej i powiązany sposób

Info

Publication number
PL2848106T3
PL2848106T3 PL13797147T PL13797147T PL2848106T3 PL 2848106 T3 PL2848106 T3 PL 2848106T3 PL 13797147 T PL13797147 T PL 13797147T PL 13797147 T PL13797147 T PL 13797147T PL 2848106 T3 PL2848106 T3 PL 2848106T3
Authority
PL
Poland
Prior art keywords
high thermal
related method
thermal performance
electronics enclosures
enclosures
Prior art date
Application number
PL13797147T
Other languages
English (en)
Inventor
Bruce C. Fitz-Patrick
Gary A. Clayton
Jr. Byron E. Short
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Publication of PL2848106T3 publication Critical patent/PL2848106T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D25/00—Special casting characterised by the nature of the product
    • B22D25/02—Special casting characterised by the nature of the product by its peculiarity of shape; of works of art
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/0072—Casting in, on, or around objects which form part of the product for making objects with integrated channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/04—Casting in, on, or around objects which form part of the product for joining parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL13797147T 2012-05-11 2013-03-11 Obudowy elektroniki o dużej sprawności cieplnej i powiązany sposób PL2848106T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/469,798 US9107293B2 (en) 2012-05-11 2012-05-11 Electronics enclosures with high thermal performance and related system
EP13797147.9A EP2848106B1 (en) 2012-05-11 2013-03-11 Electronics enclosures with high thermal performance and related method
PCT/US2013/030234 WO2013180790A1 (en) 2012-05-11 2013-03-11 Electronics enclosures with high thermal performance and related system and method

Publications (1)

Publication Number Publication Date
PL2848106T3 true PL2848106T3 (pl) 2018-08-31

Family

ID=49547770

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13797147T PL2848106T3 (pl) 2012-05-11 2013-03-11 Obudowy elektroniki o dużej sprawności cieplnej i powiązany sposób

Country Status (4)

Country Link
US (1) US9107293B2 (pl)
EP (1) EP2848106B1 (pl)
PL (1) PL2848106T3 (pl)
WO (1) WO2013180790A1 (pl)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160029514A1 (en) * 2013-12-31 2016-01-28 Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi A liquid cooled device enclosure
US9468131B2 (en) 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
US11032939B2 (en) 2014-09-26 2021-06-08 Liquidcool Solutions, Inc. Liquid submersion cooled electronic systems
CN107113996B (zh) * 2014-09-26 2019-06-14 液体冷却解决方案公司 用于液体浸没冷却型电子器件的外壳
CN106612604B (zh) * 2015-10-23 2018-12-04 成都泰格微波技术股份有限公司 一种变截面金属流道水冷散热压铸腔体的制造工艺
WO2018087905A1 (ja) * 2016-11-12 2018-05-17 株式会社ＥｘａＳｃａｌｅｒ 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム
US11441586B2 (en) * 2018-05-25 2022-09-13 Divergent Technologies, Inc. Apparatus for injecting fluids in node based connections
FR3086220B1 (fr) * 2018-09-20 2021-01-22 Valeo Systemes Thermiques Compartiment pour dispositif de stockage d'energie electrique pour vehicule automobile
FR3087617B1 (fr) * 2018-10-17 2023-10-27 Valeo Systemes De Controle Moteur Equipement electronique pour vehicule
US10736233B1 (en) * 2019-04-25 2020-08-04 The Boeing Company Self-contained cooling device for an electromagnetic interference filter
US11539109B2 (en) * 2020-03-26 2022-12-27 Hamilton Sundstrand Corporation Heat exchanger rib for multi-function aperture
US11202395B1 (en) * 2020-11-06 2021-12-14 Astrodyne TDI Power module operable in a hazardous environment
US11963340B2 (en) * 2021-06-18 2024-04-16 Baidu Usa Llc Leak protection for cold plate liquid cooling
US11672106B2 (en) * 2021-06-28 2023-06-06 Hamilton Sundstrand Corporation Chassis with thermal transfer fluid path
CN114340332B (zh) * 2021-12-14 2023-08-29 深圳富联富桂精密工业有限公司 浸没式冷却系统
US12446194B2 (en) * 2022-10-06 2025-10-14 Panasonic Automotive Systems America, LLC. Multiple PCB cooling module assembly
US12575069B1 (en) * 2025-03-04 2026-03-10 AGT-USA, Inc. Computer component cooling systems

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2640404A1 (fr) 1988-12-09 1990-06-15 Thomson Csf Procede de fabrication d'une plaque a rainures destinee a positionner des cartes electroniques et plaque obtenue par ce procede
US4962444A (en) 1989-01-03 1990-10-09 Sunstrand Corporation Cold chassis for cooling electronic circuit components on an electronic board
ATE116171T1 (de) 1990-09-25 1995-01-15 Allied Signal Inc Herstellung von komplexen hohlräumen in gussstücken.
US5395499A (en) 1993-05-14 1995-03-07 Xerox Corporation Electroforming mandrels
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US20050263273A1 (en) 2004-05-26 2005-12-01 Crumly William R Electroformed microchannel cooler and methods of making same
US7187550B1 (en) * 2005-09-14 2007-03-06 Sun Microsystems, Inc. Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
JP4819485B2 (ja) 2005-11-18 2011-11-24 株式会社テクニスコ 流路形成体の製造方法
DE202006007275U1 (de) * 2006-05-06 2006-09-07 Schroff Gmbh Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen
DE112007001694B4 (de) * 2006-07-18 2012-07-19 Liebert Corp. Schwenkgelenkanordnungen und ein System für deren Verwendung
US7692924B2 (en) * 2008-03-03 2010-04-06 Nabtesco Corporation Rack for housing a liquid-cooled electric unit
WO2009131810A2 (en) * 2008-04-21 2009-10-29 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US8477498B2 (en) * 2010-03-25 2013-07-02 Curtiss-Wright Controls, Inc. Conduction-cooled apparatus and methods of forming said apparatus
US9306224B2 (en) 2010-09-02 2016-04-05 Akasol Engineering Gmbh Cooling module and method for producing a cooling module

Also Published As

Publication number Publication date
US20130299232A1 (en) 2013-11-14
EP2848106B1 (en) 2018-04-25
WO2013180790A1 (en) 2013-12-05
EP2848106A4 (en) 2015-11-04
US9107293B2 (en) 2015-08-11
EP2848106A1 (en) 2015-03-18

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