PL2871018T3 - Method for void reduction when soldering circuit boards and soldering device for performing the same - Google Patents

Method for void reduction when soldering circuit boards and soldering device for performing the same

Info

Publication number
PL2871018T3
PL2871018T3 PL14186548T PL14186548T PL2871018T3 PL 2871018 T3 PL2871018 T3 PL 2871018T3 PL 14186548 T PL14186548 T PL 14186548T PL 14186548 T PL14186548 T PL 14186548T PL 2871018 T3 PL2871018 T3 PL 2871018T3
Authority
PL
Poland
Prior art keywords
soldering
same
circuit boards
void reduction
soldering device
Prior art date
Application number
PL14186548T
Other languages
Polish (pl)
Inventor
Viktoria Rawinski
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of PL2871018T3 publication Critical patent/PL2871018T3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
PL14186548T 2013-11-11 2014-09-26 Method for void reduction when soldering circuit boards and soldering device for performing the same PL2871018T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201310112367 DE102013112367A1 (en) 2013-11-11 2013-11-11 Method and device for soldering printed circuit boards

Publications (1)

Publication Number Publication Date
PL2871018T3 true PL2871018T3 (en) 2017-01-31

Family

ID=51625881

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14186548T PL2871018T3 (en) 2013-11-11 2014-09-26 Method for void reduction when soldering circuit boards and soldering device for performing the same

Country Status (8)

Country Link
US (2) US20150129648A1 (en)
EP (1) EP2871018B1 (en)
CN (1) CN104640372B (en)
DE (1) DE102013112367A1 (en)
DK (1) DK2871018T3 (en)
ES (1) ES2603064T3 (en)
HU (1) HUE030937T2 (en)
PL (1) PL2871018T3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7035404B2 (en) * 2017-09-19 2022-03-15 日本電気株式会社 Board transfer jig and mounting method
DE102020103288B3 (en) * 2020-02-10 2020-10-29 Semikron Elektronik Gmbh & Co. Kg A method of reducing the surface roughness of a joint surface of a sintered paste layer and pressure sintering method therewith and a sintered joint making device for performing it
JP7854857B2 (en) * 2022-05-26 2026-05-07 三菱電機株式会社 Method for manufacturing semiconductor modules, method for manufacturing power converters, semiconductor modules, power converters

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5372458A (en) * 1976-12-08 1978-06-27 Mitsubishi Electric Corp Fixing method for semiconductor substrate
US5180096A (en) * 1990-07-25 1993-01-19 Nihon Den-Netsu Keiki Co., Ltd. Method and apparatus for reflow-soldering of printed circuit boards
JPH05283449A (en) * 1992-03-31 1993-10-29 Fujitsu General Ltd Bare chip soldering method
DE4432402C2 (en) * 1994-08-30 1998-07-02 Ersa Loettechnik Gmbh Wave soldering nozzle for flux-free soldering
KR0178255B1 (en) * 1995-11-17 1999-03-20 황인길 Pcb carrier frame of bag semiconductor package and method of making the same
JPH10173327A (en) * 1996-12-13 1998-06-26 Kuroda Denki Kk Method and system for soldering surface-mounting printed board
JP2003188515A (en) * 2001-12-19 2003-07-04 Sony Corp Soldering device, soldering method, printed circuit board manufacturing device and method
DE102004036521B4 (en) * 2004-07-28 2007-05-16 Infineon Technologies Ag Method for producing a solder joint
US7367486B2 (en) * 2004-09-30 2008-05-06 Agere Systems, Inc. System and method for forming solder joints
TWI261886B (en) * 2005-01-26 2006-09-11 Advanced Semiconductor Eng Bumping process
JP4881831B2 (en) * 2007-10-11 2012-02-22 株式会社日立製作所 Soldering method and reflow soldering apparatus
JP5097038B2 (en) * 2008-07-10 2012-12-12 株式会社日立製作所 Soldering method and soldering apparatus
DE102010007006A1 (en) * 2010-02-05 2011-08-11 SEHO Systemtechnik GmbH, 97892 Method for soldering components comprising conductor plate and surface mount device-components, involves providing conductor plate that has pad areas for contacting components
DE102010000520A1 (en) * 2010-02-23 2011-08-25 SCHOTT Solar AG, 55122 Method and device for applying solder to a workpiece

Also Published As

Publication number Publication date
ES2603064T3 (en) 2017-02-23
HUE030937T2 (en) 2017-06-28
US20150129648A1 (en) 2015-05-14
CN104640372A (en) 2015-05-20
US20170072491A1 (en) 2017-03-16
DE102013112367A1 (en) 2015-05-13
EP2871018B1 (en) 2016-08-24
CN104640372B (en) 2018-09-04
EP2871018A1 (en) 2015-05-13
DK2871018T3 (en) 2016-12-12

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