PL2888755T3 - Urządzenie do cylindrycznego napylania magnetronowego - Google Patents

Urządzenie do cylindrycznego napylania magnetronowego

Info

Publication number
PL2888755T3
PL2888755T3 PL13710953T PL13710953T PL2888755T3 PL 2888755 T3 PL2888755 T3 PL 2888755T3 PL 13710953 T PL13710953 T PL 13710953T PL 13710953 T PL13710953 T PL 13710953T PL 2888755 T3 PL2888755 T3 PL 2888755T3
Authority
PL
Poland
Prior art keywords
magnetron sputtering
cylindrical magnetron
cylindrical
sputtering
magnetron
Prior art date
Application number
PL13710953T
Other languages
English (en)
Inventor
John R. German
Klaus H.W. Hartig
Original Assignee
Cardinal Cg Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cardinal Cg Company filed Critical Cardinal Cg Company
Publication of PL2888755T3 publication Critical patent/PL2888755T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL13710953T 2012-08-24 2013-03-08 Urządzenie do cylindrycznego napylania magnetronowego PL2888755T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261693032P 2012-08-24 2012-08-24
PCT/US2013/029810 WO2014031156A1 (en) 2012-08-24 2013-03-08 Apparatus for cylindrical magnetron sputtering
EP13710953.4A EP2888755B1 (en) 2012-08-24 2013-03-08 Apparatus for cylindrical magnetron sputtering

Publications (1)

Publication Number Publication Date
PL2888755T3 true PL2888755T3 (pl) 2019-01-31

Family

ID=47902371

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13710953T PL2888755T3 (pl) 2012-08-24 2013-03-08 Urządzenie do cylindrycznego napylania magnetronowego

Country Status (5)

Country Link
US (1) US9748082B2 (pl)
EP (1) EP2888755B1 (pl)
LT (1) LT2888755T (pl)
PL (1) PL2888755T3 (pl)
WO (1) WO2014031156A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102877B4 (de) * 2014-03-05 2015-10-08 Von Ardenne Gmbh Verfahren zum Einrichten einer Magnetanordnung eines Magnetrons
DE102014110001A1 (de) * 2014-07-16 2016-01-21 Von Ardenne Gmbh Magnetron-Anordnung, Verfahren zum Codieren und Übertragen von Information in einer Magnetron-Anordnung und Verwendung einer Magnetron- Anordnung
JP6469434B2 (ja) * 2014-12-11 2019-02-13 株式会社アルバック ロータリーカソード、および、スパッタ装置
CN111500994A (zh) * 2015-02-24 2020-08-07 株式会社爱发科 磁控管溅射装置用旋转式阴极单元
US10151023B2 (en) * 2016-06-27 2018-12-11 Cardinal Cg Company Laterally adjustable return path magnet assembly and methods
US10056238B2 (en) 2016-06-27 2018-08-21 Cardinal Cg Company Adjustable return path magnet assembly and methods
US10790127B2 (en) 2017-05-04 2020-09-29 Cardinal Cg Company Flexible adjustable return path magnet assembly and methods
CN116997675A (zh) * 2021-01-20 2023-11-03 星火工业有限公司 采用踢脉冲的磁控溅射的波纹管镀膜
WO2024124217A2 (en) * 2022-12-09 2024-06-13 Intevac, Inc. Substrate carrier for thin-film processing
US12542263B2 (en) 2022-12-12 2026-02-03 Intevac, Inc. Cylindrical cathode and chamber using same for sputtering

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163567A (ja) * 1991-12-09 1993-06-29 Tokyo Electron Ltd スパッタ装置
WO1999054911A1 (en) * 1998-04-16 1999-10-28 Sinvaco N.V. Means for controlling target erosion and sputtering in a magnetron
US6974629B1 (en) 1999-08-06 2005-12-13 Cardinal Cg Company Low-emissivity, soil-resistant coating for glass surfaces
US6660365B1 (en) 1998-12-21 2003-12-09 Cardinal Cg Company Soil-resistant coating for glass surfaces
US6964731B1 (en) 1998-12-21 2005-11-15 Cardinal Cg Company Soil-resistant coating for glass surfaces
KR100293330B1 (ko) 1999-05-25 2001-06-15 김충섭 오르토규산 아연계 녹색 발광 형광체의 제조방법
GB0118803D0 (en) * 2001-08-02 2001-09-26 Bekaert Sa Nv Adjustable magnet configuration and method for magnetron sputtering
EP1774563A1 (en) 2004-07-01 2007-04-18 Cardinal CG Company Cylindrical target with oscillating magnet from magnetron sputtering
US20080047831A1 (en) * 2006-08-24 2008-02-28 Hendryk Richert Segmented/modular magnet bars for sputtering target
EP2301060B1 (en) * 2008-05-16 2014-07-09 Soleras Advanced Coatings bvba A rotatable sputtering magnetron with high stiffness
US20100200395A1 (en) * 2009-02-06 2010-08-12 Anton Dietrich Techniques for depositing transparent conductive oxide coatings using dual C-MAG sputter apparatuses
US8398834B2 (en) * 2010-04-02 2013-03-19 NuvoSun, Inc. Target utilization improvement for rotatable magnetrons

Also Published As

Publication number Publication date
US20140054168A1 (en) 2014-02-27
US9748082B2 (en) 2017-08-29
EP2888755A1 (en) 2015-07-01
EP2888755B1 (en) 2018-08-01
LT2888755T (lt) 2018-11-12
WO2014031156A1 (en) 2014-02-27

Similar Documents

Publication Publication Date Title
PL2758218T3 (pl) Urządzenie wspomagające odrywanie
LT2888755T (lt) Dalelių pūtimo cilindriniu magnetronu aparatas
EP2682297A4 (en) VEHICLE ACTUATING APPARATUS
EP2819069A4 (en) ELECTRONIC DEVICE
PL3686314T3 (pl) Urządzenie do rozpylania
GB201109103D0 (en) An apparatus
PL2880196T3 (pl) Urządzenie do rozpylania
GB2502208B (en) Control Apparatus
GB2522600B (en) Sputtering Apparatus
GB2489220B (en) Magnetron
GB201108521D0 (en) Cooking apparatus
GB201107317D0 (en) Apparatus
GB201103768D0 (en) Apparatus
GB201103102D0 (en) Apparatus
TWM390320U (en) Apparatus for cylindrical magnetron target
ZA201403952B (en) Microwave cooking apparatus
EP2797223A4 (en) FREQUENCY CONTROL APPARATUS
AU2011900609A0 (en) Apparatus for cooking
AU2012905232A0 (en) Cooking apparatus
AU2012905388A0 (en) Apparatus
AU2012903063A0 (en) Apparatus
AU2012903015A0 (en) Apparatus
AU2012902940A0 (en) Apparatus
AU2012902504A0 (en) Apparatus
AU2012902466A0 (en) Apparatus