PL2916627T3 - Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego - Google Patents

Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego

Info

Publication number
PL2916627T3
PL2916627T3 PL14840942T PL14840942T PL2916627T3 PL 2916627 T3 PL2916627 T3 PL 2916627T3 PL 14840942 T PL14840942 T PL 14840942T PL 14840942 T PL14840942 T PL 14840942T PL 2916627 T3 PL2916627 T3 PL 2916627T3
Authority
PL
Poland
Prior art keywords
producing
circuit board
ceramic printed
printed circuit
electronic circuit
Prior art date
Application number
PL14840942T
Other languages
English (en)
Inventor
Nobuhiko Chiwata
Original Assignee
Hitachi Metals, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals, Ltd. filed Critical Hitachi Metals, Ltd.
Publication of PL2916627T3 publication Critical patent/PL2916627T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6025—Tape casting, e.g. with a doctor blade
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL14840942T 2013-08-29 2014-03-12 Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego PL2916627T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013177709 2013-08-29
PCT/JP2014/056534 WO2015029478A1 (ja) 2013-08-29 2014-03-12 セラミックス回路基板の製造方法
EP14840942.8A EP2916627B1 (en) 2013-08-29 2014-03-12 Method for manufacturing ceramic circuit board

Publications (1)

Publication Number Publication Date
PL2916627T3 true PL2916627T3 (pl) 2019-09-30

Family

ID=52586061

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14840942T PL2916627T3 (pl) 2013-08-29 2014-03-12 Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego

Country Status (6)

Country Link
US (1) US10104783B2 (pl)
EP (1) EP2916627B1 (pl)
JP (1) JP5720860B1 (pl)
HU (1) HUE044481T2 (pl)
PL (1) PL2916627T3 (pl)
WO (1) WO2015029478A1 (pl)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904094B2 (ja) * 2016-06-23 2021-07-14 三菱マテリアル株式会社 絶縁回路基板の製造方法
EP3263537B1 (de) * 2016-06-27 2021-09-22 Infineon Technologies AG Verfahren zur herstellung eines metall-keramik-substrats
TWI750323B (zh) * 2017-02-14 2021-12-21 南韓商印可得股份有限公司 利用導電金屬薄膜晶種層與蝕刻劑組合物之選擇性蝕刻形成電路之方法
CN110383467B (zh) * 2017-02-23 2022-12-30 三菱电机株式会社 半导体装置
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法
EP3684148B1 (en) * 2017-09-12 2023-11-29 Kabushiki Kaisha Toshiba Method for manufacturing ceramic circuit board
CN111032916A (zh) * 2017-09-12 2020-04-17 株式会社东芝 活性金属钎料用蚀刻液及使用了其的陶瓷电路基板的制造方法
EP3817526A4 (en) * 2018-06-26 2022-04-06 DIC Corporation PROCESS FOR MAKING A METAL PATTERN MOLDING
KR20210022548A (ko) * 2018-06-26 2021-03-03 디아이씨 가부시끼가이샤 프린트 배선판의 제조 방법
KR20210023828A (ko) * 2018-06-26 2021-03-04 디아이씨 가부시끼가이샤 프린트 배선판의 제조 방법
CN109321957B (zh) * 2018-10-24 2023-01-17 中国电子科技集团公司第五十五研究所 一种环保型外壳镀覆前处理蚀刻液工艺及镀覆方法
TW202035793A (zh) * 2018-12-21 2020-10-01 日商Ｄｉｃ股份有限公司 印刷配線板之製造方法
CN113260736A (zh) * 2019-02-19 2021-08-13 Dic株式会社 银用蚀刻液和使用其的印刷配线板的制造方法
WO2021111508A1 (ja) * 2019-12-03 2021-06-10 日本碍子株式会社 接合基板及び接合基板の製造方法
JP7658109B2 (ja) * 2020-03-10 2025-04-08 株式会社プロテリアル セラミックス回路基板およびその製造方法
EP4131345B1 (en) * 2020-03-30 2024-10-23 Denka Company Limited Ceramic circuit board with resist cured film, manufacturing method therefor, and ceramic circuit board manufacturing method
CN111621787B (zh) * 2020-04-27 2022-07-12 江苏富乐华半导体科技股份有限公司 一种蚀刻液体系及一种氮化铝基板的刻蚀方法
JP7543805B2 (ja) * 2020-09-24 2024-09-03 三菱マテリアル株式会社 絶縁回路基板の製造方法
CN112469201B (zh) * 2020-11-24 2021-12-07 绍兴德汇半导体材料有限公司 一种覆铜衬板制作方法
CN112752415A (zh) * 2020-12-14 2021-05-04 广州添利电子科技有限公司 一种沉银工艺中爬银的抑制方法
CN116601332A (zh) * 2020-12-15 2023-08-15 Dic株式会社 银用蚀刻液及使用其的印刷配线板的制造方法
WO2022210507A1 (ja) * 2021-03-30 2022-10-06 株式会社 東芝 セラミックス回路基板の製造方法
CN116489893A (zh) * 2023-04-23 2023-07-25 南通威斯派尔半导体技术有限公司 一种沟槽侧壁无银的覆铜陶瓷线路板及其制备方法
CN117646214B (zh) * 2023-09-27 2024-06-18 江苏富乐华半导体科技股份有限公司 一种直接覆铝陶瓷基板蚀刻清洗方法
TW202535802A (zh) 2024-03-14 2025-09-16 同欣電子工業股份有限公司 雙面活性金屬硬焊基板及其製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353990B2 (ja) 1994-02-22 2002-12-09 電気化学工業株式会社 回路基板の製造方法
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
JP3629783B2 (ja) 1995-12-07 2005-03-16 電気化学工業株式会社 回路基板
JPH09162325A (ja) 1995-12-07 1997-06-20 Denki Kagaku Kogyo Kk 窒化珪素回路基板及びその製造方法
JP3512977B2 (ja) * 1996-08-27 2004-03-31 同和鉱業株式会社 高信頼性半導体用基板
JPH10154866A (ja) 1996-11-21 1998-06-09 Sumitomo Kinzoku Electro Device:Kk セラミックス回路基板の製造方法
JPH10251878A (ja) 1997-03-14 1998-09-22 Asahi Denka Kogyo Kk 塩化銀除去剤
US6453914B2 (en) * 1999-06-29 2002-09-24 Micron Technology, Inc. Acid blend for removing etch residue
JP4887583B2 (ja) * 2001-08-09 2012-02-29 Ｄｏｗａメタルテック株式会社 セラミックス回路基板の製造方法
JP4811756B2 (ja) * 2001-09-28 2011-11-09 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合回路基板の製造方法
KR100440343B1 (ko) 2002-04-03 2004-07-15 동우 화인켐 주식회사 고 선택성 은 식각용액-1
JP5299160B2 (ja) * 2003-03-27 2013-09-25 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板の製造方法
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP2006351988A (ja) 2005-06-20 2006-12-28 Denki Kagaku Kogyo Kk セラミック基板、セラミック回路基板及びそれを用いた電力制御部品。
CN101331811B (zh) 2005-12-20 2010-09-08 三菱瓦斯化学株式会社 用于除去配线基板的残渣的组合物以及洗涤方法
JP4930833B2 (ja) * 2006-12-11 2012-05-16 日立金属株式会社 セラミックス回路基板およびその製造方法
JP2012234857A (ja) * 2011-04-28 2012-11-29 Denki Kagaku Kogyo Kk セラミックス回路基板及びそれを用いたモジュール

Also Published As

Publication number Publication date
JP5720860B1 (ja) 2015-05-20
US20160192503A1 (en) 2016-06-30
US10104783B2 (en) 2018-10-16
HUE044481T2 (hu) 2019-10-28
EP2916627A4 (en) 2016-03-09
EP2916627A1 (en) 2015-09-09
JPWO2015029478A1 (ja) 2017-03-02
EP2916627B1 (en) 2019-04-03
WO2015029478A1 (ja) 2015-03-05

Similar Documents

Publication Publication Date Title
PL2916627T3 (pl) Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego
HUE053497T2 (hu) Eljárás elektronikai alkatrész-szerelvény tábla gyártására
EP2952073A4 (en) LADDER PLATE WITH ORTHOGONAL SIGNAL PATHWAY
EP2800463A4 (en) FITTED PCB AND MANUFACTURING PROCESS THEREFOR
EP3082385A4 (en) Rigid-flexible circuit board having flying-tail structure and method for manufacturing same
ZA201502653B (en) Selective partitioning of via structures in printed circuit boards
DK2592915T3 (da) Fremstillingsfremgangsmåde til lamineret printplade
GB201415488D0 (en) Method of generating an integrated circuit layout
EP2861046A4 (en) METHOD OF MANUFACTURING A CERAMIC CONDUCTOR PLATE AND CERAMIC CONDUCTOR PLATE
TWI562698B (en) Printed circuit board and method for manufacturing same
EP2808890A4 (en) MULTILAYER CONDUCTOR PLATE
PL3667259T3 (pl) Miernik zużycia zawierający zespół składanej płytki obwodu drukowanego i sposób wytwarzania takiego miernika zużycia
EP3085212A4 (en) Methods of forming segmented vias for printed circuit boards
TWI561126B (en) Rigid flexible printed circuit board and method of manufacturing the same
EP2931008A4 (en) PCB AND MANUFACTURING METHOD THEREFOR
IL245215A (en) Thermal management of printed circuit board components
EP3572555A4 (en) METHOD FOR PRODUCING A CERAMIC CONDUCTOR PLATE
EP2986089A4 (en) Method for manufacturing solder circuit board, solder circuit board, and method for mounting electronic component
TWI561129B (en) Light-pervious printed circuit board method for manufacturing same
EP3010061A4 (en) Flexible printed circuit boards structure
GB2519191B (en) Method for manufacturing a printed circuit board
IL256835A (en) Methods of manufacturing printed circuit boards
EP3573436A4 (en) METHOD FOR PRODUCING A CERAMIC CIRCUIT BOARD
FI20135878A7 (fi) Menetelmä joustavan piirilevyn valmistamiseksi ja joustava piirilevy
FI20135993L (fi) Piirikortti