PL3001781T3 - System i sposób drukowania do zadrukowywania substratu - Google Patents

System i sposób drukowania do zadrukowywania substratu

Info

Publication number
PL3001781T3
PL3001781T3 PL15178723T PL15178723T PL3001781T3 PL 3001781 T3 PL3001781 T3 PL 3001781T3 PL 15178723 T PL15178723 T PL 15178723T PL 15178723 T PL15178723 T PL 15178723T PL 3001781 T3 PL3001781 T3 PL 3001781T3
Authority
PL
Poland
Prior art keywords
printing
substrates
printing system
Prior art date
Application number
PL15178723T
Other languages
English (en)
Inventor
Ralf Brosi
Gerd Krause
Klaus Mang
Günther Irlbacher
Original Assignee
Ekra Automatisierungssysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Automatisierungssysteme Gmbh filed Critical Ekra Automatisierungssysteme Gmbh
Publication of PL3001781T3 publication Critical patent/PL3001781T3/pl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25Movable or adjustable work or tool supports
    • B23Q1/26Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/262Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members with means to adjust the distance between the relatively slidable members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25Movable or adjustable work or tool supports
    • B23Q1/44Movable or adjustable work or tool supports using particular mechanisms
    • B23Q1/48Movable or adjustable work or tool supports using particular mechanisms with sliding pairs and rotating pairs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0881Machines for printing on polyhedral articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/26Supports for workpieces for articles with flat surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
PL15178723T 2014-07-30 2015-07-28 System i sposób drukowania do zadrukowywania substratu PL3001781T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014215022.1A DE102014215022B3 (de) 2014-07-30 2014-07-30 Drucksystem und Verfahren zum Bedrucken von Substraten
EP15178723.1A EP3001781B1 (de) 2014-07-30 2015-07-28 Drucksystem und verfahren zum bedrucken von substraten

Publications (1)

Publication Number Publication Date
PL3001781T3 true PL3001781T3 (pl) 2021-06-14

Family

ID=53761236

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15178723T PL3001781T3 (pl) 2014-07-30 2015-07-28 System i sposób drukowania do zadrukowywania substratu

Country Status (6)

Country Link
US (1) US10143089B2 (pl)
EP (1) EP3001781B1 (pl)
CN (1) CN105313441B (pl)
DE (1) DE102014215022B3 (pl)
HU (1) HUE053639T2 (pl)
PL (1) PL3001781T3 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014215022B3 (de) * 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
CN107984886A (zh) * 2017-12-22 2018-05-04 苏州海明塑胶制品有限公司 一种非圆形产品印刷治具
WO2021100978A1 (ko) * 2019-11-20 2021-05-27 엘지디스플레이 주식회사 사이드 배선 제조 장치, 사이드 배선 제조 방법 및 표시 장치 제조 방법
CN112272512B (zh) * 2020-10-23 2021-10-19 湖南大学 一种smd用贴装系统
CN112292019B (zh) * 2020-10-23 2022-04-12 湖南大学 一种smd物料供给装置及smd贴装系统
CN116901577A (zh) * 2023-06-02 2023-10-20 华东计算技术研究所(中国电子科技集团公司第三十二研究所) 丝印装置
CN118991222A (zh) * 2024-10-22 2024-11-22 盐城爱迪晟信息科技有限公司 一种电路板快速定位印刷设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4011223A1 (de) * 1990-04-06 1990-09-13 Apt Automation U Produktionste Schablonendruckvorrichtung
JPH04238036A (ja) * 1991-01-21 1992-08-26 Furukawa Electric Co Ltd:The クリーム半田の印刷装置
US5988060A (en) * 1994-08-05 1999-11-23 Fuji Machine Mfg. Co., Ltd. Screen printing apparatus
JP2001293842A (ja) * 2000-04-14 2001-10-23 Minami Kk スクリーン印刷装置
JP2001301120A (ja) * 2000-04-24 2001-10-30 Fuji Mach Mfg Co Ltd スクリーン印刷方法およびスクリーン印刷装置
DE10222119B4 (de) * 2002-05-17 2004-11-11 Asys Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster
JP4549613B2 (ja) * 2002-07-08 2010-09-22 パナソニック株式会社 スクリーン印刷装置
JP5095482B2 (ja) * 2008-04-24 2012-12-12 富士機械製造株式会社 基板位置決め装置、基板処理装置、基板位置決め方法、基板処理方法
US8215473B2 (en) * 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
CN201231591Y (zh) * 2008-07-08 2009-05-06 东远精技工业股份有限公司 无接触网版印刷设备
KR101876583B1 (ko) * 2010-04-27 2018-07-10 가부시키가이샤 후지 스크린 인쇄기
GB2497882B (en) * 2010-10-19 2018-01-17 Panasonic Corp Screen printing device and screen printing method
CN102179996B (zh) * 2011-01-14 2012-06-27 浙江大学 适用于丝网印刷技术的基板定位方法
JP5565384B2 (ja) * 2011-06-29 2014-08-06 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷装置における画像認識方法
US8593613B2 (en) * 2011-09-13 2013-11-26 Shenzhen China Star Optoelectronics Technology Co., Ltd. LCD exposure stage device and exposure system
CN202257028U (zh) * 2011-09-13 2012-05-30 深圳市华星光电技术有限公司 Lcd曝光平台装置及曝光系统
DE102012019573A1 (de) * 2012-09-25 2014-03-27 Ekra Automatisierungssysteme Gmbh Druckvorrichtung, Drucksystem, Verfahren
DE102014215022B3 (de) * 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten

Also Published As

Publication number Publication date
DE102014215022B3 (de) 2015-09-03
CN105313441B (zh) 2019-01-15
CN105313441A (zh) 2016-02-10
HUE053639T2 (hu) 2021-07-28
US20160037648A1 (en) 2016-02-04
US10143089B2 (en) 2018-11-27
EP3001781B1 (de) 2020-12-02
EP3001781A1 (de) 2016-03-30

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