PL3098910T3 - Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej - Google Patents
Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowejInfo
- Publication number
- PL3098910T3 PL3098910T3 PL16161891T PL16161891T PL3098910T3 PL 3098910 T3 PL3098910 T3 PL 3098910T3 PL 16161891 T PL16161891 T PL 16161891T PL 16161891 T PL16161891 T PL 16161891T PL 3098910 T3 PL3098910 T3 PL 3098910T3
- Authority
- PL
- Poland
- Prior art keywords
- laser processing
- processing machine
- setting method
- angle setting
- focusing angle
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/40—Optical focusing aids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
- H01S3/1305—Feedback control systems
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015110822A JP6633297B2 (ja) | 2015-05-29 | 2015-05-29 | レーザ加工装置、及び、レーザ加工装置の集光角設定方法 |
| EP16161891.3A EP3098910B1 (en) | 2015-05-29 | 2016-03-23 | Laser processing machine and focusing angle setting method of laser processing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3098910T3 true PL3098910T3 (pl) | 2020-07-27 |
Family
ID=55637227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL16161891T PL3098910T3 (pl) | 2015-05-29 | 2016-03-23 | Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9703111B2 (pl) |
| EP (1) | EP3098910B1 (pl) |
| JP (1) | JP6633297B2 (pl) |
| CN (1) | CN205798696U (pl) |
| ES (1) | ES2769867T3 (pl) |
| HU (1) | HUE048025T2 (pl) |
| PL (1) | PL3098910T3 (pl) |
| PT (1) | PT3098910T (pl) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350227A (zh) * | 2017-09-05 | 2017-11-17 | 镇江金海创科技有限公司 | 焦距可调式激光清洗振镜 |
| JP6616368B2 (ja) * | 2017-09-14 | 2019-12-04 | ファナック株式会社 | レーザ加工前に光学系の汚染レベルに応じて加工条件を補正するレーザ加工装置 |
| CN119965659A (zh) * | 2025-04-10 | 2025-05-09 | 丰睿成科技(深圳)股份有限公司 | 一种激光光斑调试校准平台 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7103141A (pl) * | 1970-03-11 | 1971-09-14 | ||
| JPH04155304A (ja) * | 1990-10-18 | 1992-05-28 | Ricoh Co Ltd | 集光位置検出装置 |
| KR100346704B1 (ko) * | 1999-07-29 | 2002-08-01 | 삼성전자 주식회사 | 인쇄기 |
| JP2001108930A (ja) * | 1999-10-06 | 2001-04-20 | Minolta Co Ltd | 走査光学装置及びその制御方法 |
| JP2001221968A (ja) * | 2000-02-10 | 2001-08-17 | Ricoh Co Ltd | 光走査装置及び該光走査装置の焦点調整方法 |
| TWI221102B (en) * | 2002-08-30 | 2004-09-21 | Sumitomo Heavy Industries | Laser material processing method and processing device |
| JP5013699B2 (ja) | 2005-10-21 | 2012-08-29 | 株式会社キーエンス | 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置 |
| JP5062838B2 (ja) | 2008-02-29 | 2012-10-31 | パナソニック デバイスSunx株式会社 | レーザマーキング装置 |
| US10464172B2 (en) * | 2013-02-21 | 2019-11-05 | Nlight, Inc. | Patterning conductive films using variable focal plane to control feature size |
| JP6083284B2 (ja) * | 2013-03-26 | 2017-02-22 | オムロン株式会社 | レーザ加工装置 |
-
2015
- 2015-05-29 JP JP2015110822A patent/JP6633297B2/ja active Active
-
2016
- 2016-03-23 HU HUE16161891A patent/HUE048025T2/hu unknown
- 2016-03-23 EP EP16161891.3A patent/EP3098910B1/en active Active
- 2016-03-23 PT PT161618913T patent/PT3098910T/pt unknown
- 2016-03-23 ES ES16161891T patent/ES2769867T3/es active Active
- 2016-03-23 PL PL16161891T patent/PL3098910T3/pl unknown
- 2016-03-24 CN CN201620232344.XU patent/CN205798696U/zh not_active Expired - Fee Related
- 2016-03-24 US US15/079,668 patent/US9703111B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| HUE048025T2 (hu) | 2020-05-28 |
| US9703111B2 (en) | 2017-07-11 |
| EP3098910B1 (en) | 2020-01-01 |
| ES2769867T3 (es) | 2020-06-29 |
| EP3098910A1 (en) | 2016-11-30 |
| US20160349525A1 (en) | 2016-12-01 |
| PT3098910T (pt) | 2020-02-04 |
| JP6633297B2 (ja) | 2020-01-22 |
| CN205798696U (zh) | 2016-12-14 |
| JP2016221545A (ja) | 2016-12-28 |
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