PL3098910T3 - Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej - Google Patents

Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej

Info

Publication number
PL3098910T3
PL3098910T3 PL16161891T PL16161891T PL3098910T3 PL 3098910 T3 PL3098910 T3 PL 3098910T3 PL 16161891 T PL16161891 T PL 16161891T PL 16161891 T PL16161891 T PL 16161891T PL 3098910 T3 PL3098910 T3 PL 3098910T3
Authority
PL
Poland
Prior art keywords
laser processing
processing machine
setting method
angle setting
focusing angle
Prior art date
Application number
PL16161891T
Other languages
English (en)
Inventor
Takayoshi Miyazaki
Tomoki Komiya
Takuya Yoshimi
Original Assignee
Panasonic Industrial Devices Sunx Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Industrial Devices Sunx Co., Ltd. filed Critical Panasonic Industrial Devices Sunx Co., Ltd.
Publication of PL3098910T3 publication Critical patent/PL3098910T3/pl

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/40Optical focusing aids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/105Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1635Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1654Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305Feedback control systems

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
PL16161891T 2015-05-29 2016-03-23 Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej PL3098910T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015110822A JP6633297B2 (ja) 2015-05-29 2015-05-29 レーザ加工装置、及び、レーザ加工装置の集光角設定方法
EP16161891.3A EP3098910B1 (en) 2015-05-29 2016-03-23 Laser processing machine and focusing angle setting method of laser processing machine

Publications (1)

Publication Number Publication Date
PL3098910T3 true PL3098910T3 (pl) 2020-07-27

Family

ID=55637227

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16161891T PL3098910T3 (pl) 2015-05-29 2016-03-23 Urządzenie do obróbki laserowej i sposób nastawiania kąta ogniskowania urządzenia do obróbki laserowej

Country Status (8)

Country Link
US (1) US9703111B2 (pl)
EP (1) EP3098910B1 (pl)
JP (1) JP6633297B2 (pl)
CN (1) CN205798696U (pl)
ES (1) ES2769867T3 (pl)
HU (1) HUE048025T2 (pl)
PL (1) PL3098910T3 (pl)
PT (1) PT3098910T (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107350227A (zh) * 2017-09-05 2017-11-17 镇江金海创科技有限公司 焦距可调式激光清洗振镜
JP6616368B2 (ja) * 2017-09-14 2019-12-04 ファナック株式会社 レーザ加工前に光学系の汚染レベルに応じて加工条件を補正するレーザ加工装置
CN119965659A (zh) * 2025-04-10 2025-05-09 丰睿成科技(深圳)股份有限公司 一种激光光斑调试校准平台

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7103141A (pl) * 1970-03-11 1971-09-14
JPH04155304A (ja) * 1990-10-18 1992-05-28 Ricoh Co Ltd 集光位置検出装置
KR100346704B1 (ko) * 1999-07-29 2002-08-01 삼성전자 주식회사 인쇄기
JP2001108930A (ja) * 1999-10-06 2001-04-20 Minolta Co Ltd 走査光学装置及びその制御方法
JP2001221968A (ja) * 2000-02-10 2001-08-17 Ricoh Co Ltd 光走査装置及び該光走査装置の焦点調整方法
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP5013699B2 (ja) 2005-10-21 2012-08-29 株式会社キーエンス 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置
JP5062838B2 (ja) 2008-02-29 2012-10-31 パナソニック デバイスSunx株式会社 レーザマーキング装置
US10464172B2 (en) * 2013-02-21 2019-11-05 Nlight, Inc. Patterning conductive films using variable focal plane to control feature size
JP6083284B2 (ja) * 2013-03-26 2017-02-22 オムロン株式会社 レーザ加工装置

Also Published As

Publication number Publication date
HUE048025T2 (hu) 2020-05-28
US9703111B2 (en) 2017-07-11
EP3098910B1 (en) 2020-01-01
ES2769867T3 (es) 2020-06-29
EP3098910A1 (en) 2016-11-30
US20160349525A1 (en) 2016-12-01
PT3098910T (pt) 2020-02-04
JP6633297B2 (ja) 2020-01-22
CN205798696U (zh) 2016-12-14
JP2016221545A (ja) 2016-12-28

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