PL3111476T3 - Ulepszona obudowa pastylkowa dla wielu elementów półprzewodnikowych stykanych dociskowo - Google Patents

Ulepszona obudowa pastylkowa dla wielu elementów półprzewodnikowych stykanych dociskowo

Info

Publication number
PL3111476T3
PL3111476T3 PL15706201T PL15706201T PL3111476T3 PL 3111476 T3 PL3111476 T3 PL 3111476T3 PL 15706201 T PL15706201 T PL 15706201T PL 15706201 T PL15706201 T PL 15706201T PL 3111476 T3 PL3111476 T3 PL 3111476T3
Authority
PL
Poland
Prior art keywords
pressure
semiconductor components
shaped casing
improved disc
contacted semiconductor
Prior art date
Application number
PL15706201T
Other languages
English (en)
Inventor
Mario Schenk
Jens Przybilla
Reiner Barthelmess
Jörg DORN
Original Assignee
Infineon Technologies Bipolar Gmbh & Co. Kg
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Bipolar Gmbh & Co. Kg, Siemens Aktiengesellschaft filed Critical Infineon Technologies Bipolar Gmbh & Co. Kg
Publication of PL3111476T3 publication Critical patent/PL3111476T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
PL15706201T 2014-02-26 2015-02-17 Ulepszona obudowa pastylkowa dla wielu elementów półprzewodnikowych stykanych dociskowo PL3111476T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014102493.1A DE102014102493A1 (de) 2014-02-26 2014-02-26 Verbesserte Scheibenzelle für mehrere druckkontaktierte Halbleiterbauelemente
EP15706201.9A EP3111476B1 (de) 2014-02-26 2015-02-17 Verbesserte scheibenzelle für mehrere druckkontaktierte halbleiterbauelemente
PCT/EP2015/053289 WO2015128220A1 (de) 2014-02-26 2015-02-17 Verbesserte scheibenzelle für mehrere druckkontaktierte halbleiterbauelemente

Publications (1)

Publication Number Publication Date
PL3111476T3 true PL3111476T3 (pl) 2018-09-28

Family

ID=52577844

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15706201T PL3111476T3 (pl) 2014-02-26 2015-02-17 Ulepszona obudowa pastylkowa dla wielu elementów półprzewodnikowych stykanych dociskowo

Country Status (11)

Country Link
US (1) US10008486B2 (pl)
EP (1) EP3111476B1 (pl)
JP (1) JP6211215B2 (pl)
KR (1) KR101855028B1 (pl)
CN (1) CN106170859B (pl)
CA (1) CA2940087C (pl)
DE (1) DE102014102493A1 (pl)
ES (1) ES2669495T3 (pl)
PL (1) PL3111476T3 (pl)
RU (1) RU2642117C1 (pl)
WO (1) WO2015128220A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018107094B4 (de) * 2018-03-26 2021-04-15 Infineon Technologies Austria Ag Multi-Package-Oberseitenkühlung und Verfahren zu deren Herstellung
JP7395452B2 (ja) * 2020-09-23 2023-12-11 株式会社東芝 半導体装置
RU2758577C1 (ru) * 2021-03-17 2021-10-29 Федеральное государственное бюджетное учреждение науки Институт физики твердого тела Российской академии наук (ИФТТ РАН) Способ изготовления контактов к тонким трёхмерным чешуйкам слоистых кристаллов

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3719862A (en) * 1972-03-15 1973-03-06 Motorola Inc Flexible contact members for use in high power electrical devices including a plurality of semiconductor units
JPS5737256U (pl) * 1980-08-11 1982-02-27
EP0064383A3 (en) * 1981-05-06 1984-06-27 LUCAS INDUSTRIES public limited company A semi-conductor package
DE3223532A1 (de) 1982-06-24 1983-12-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zum verspannen mehrerer scheibenfoermiger halbleiterbauelemente
JPS61134068A (ja) * 1984-12-05 1986-06-21 Fuji Electric Co Ltd 半導体装置
JP3256636B2 (ja) * 1994-09-15 2002-02-12 株式会社東芝 圧接型半導体装置
JP3588503B2 (ja) * 1995-06-20 2004-11-10 株式会社東芝 圧接型半導体装置
JP3018971B2 (ja) * 1995-12-18 2000-03-13 富士電機株式会社 半導体装置
CN1236982A (zh) * 1998-01-22 1999-12-01 株式会社日立制作所 压力接触型半导体器件及其转换器
JP3507834B2 (ja) * 1998-01-29 2004-03-15 富士電機システムズ株式会社 パワー半導体デバイスの冷却装置
JPH11330283A (ja) * 1998-05-15 1999-11-30 Toshiba Corp 半導体モジュール及び大型半導体モジュール
JP2930074B1 (ja) 1998-06-02 1999-08-03 富士電機株式会社 半導体装置
JP2004335777A (ja) * 2003-05-08 2004-11-25 Toshiba Mitsubishi-Electric Industrial System Corp 平型半導体素子用スタック
US7757392B2 (en) * 2006-05-17 2010-07-20 Infineon Technologies Ag Method of producing an electronic component
RU2384915C1 (ru) * 2008-10-01 2010-03-20 Федеральное государственное унитарное предприятие "Всероссийский Электротехнический институт им. В.И. Ленина" (ФГУП ВЭИ) Силовой полупроводниковый прибор с полностью прижимными контактами
DE102009005915B4 (de) 2009-01-23 2013-07-11 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
CN202142521U (zh) * 2011-06-03 2012-02-08 安徽省祁门县黄山电器有限责任公司 组合式大功率半导体芯片
CN102664177B (zh) * 2012-05-16 2014-10-29 中国科学院电工研究所 一种双面冷却的功率半导体模块

Also Published As

Publication number Publication date
EP3111476A1 (de) 2017-01-04
KR101855028B1 (ko) 2018-05-04
JP2017510998A (ja) 2017-04-13
CA2940087A1 (en) 2015-09-03
JP6211215B2 (ja) 2017-10-11
CA2940087C (en) 2019-07-23
WO2015128220A1 (de) 2015-09-03
US10008486B2 (en) 2018-06-26
RU2642117C1 (ru) 2018-01-24
CN106170859A (zh) 2016-11-30
CN106170859B (zh) 2018-12-11
US20170033091A1 (en) 2017-02-02
KR20160127051A (ko) 2016-11-02
ES2669495T3 (es) 2018-05-28
DE102014102493A1 (de) 2015-08-27
EP3111476B1 (de) 2018-04-04

Similar Documents

Publication Publication Date Title
TWI562322B (en) Semiconductor device packages
HUE051760T2 (hu) Eljárás félvezetõ modul elõállítására
LT3191487T (lt) Katepsino c spirocikliniai inhibitoriai
SG11201608819VA (en) Bonding wire for semiconductor device
GB201416403D0 (en) High voltage semiconductor devices
EP3089223C0 (en) SEMICONDUCTOR DEVICE
TWI563631B (en) Semiconductor Device
SG11201704914QA (en) Bonding wire for semiconductor device
GB201707907D0 (en) Low temperature adhesive resins for wafer bonding
DK3232978T3 (da) Interventionsføringsindretning
GB2529930B (en) Cellular layout for semiconductor devices
SG11201601519YA (en) Bonding wire for semiconductor device
DK3230929T3 (da) Forbedringer til tælleranordninger
GB2545155B (en) Assembly of semiconductor devices
GB2529297B (en) Cellular layout for semiconductor devices
TWI560882B (en) Semiconductor structure
GB201419688D0 (en) Substrate cooling device
SG11201701725QA (en) Semiconductor device
TWI560850B (en) Semiconductor device
KR102212985B9 (ko) 탄화규소 분말 제조방법
SG11201609433VA (en) A method for bonding a chip to a wafer
GB201503397D0 (en) Manufacture of potato chips
GB201420531D0 (en) Semiconductor structure
TWM477045U (en) Package substrate
GB2539136B (en) Integrated circuit package substrate