PL3183086T3 - Układ dyszowy do lutowania falowego oraz sposób lutowania falowego - Google Patents

Układ dyszowy do lutowania falowego oraz sposób lutowania falowego

Info

Publication number
PL3183086T3
PL3183086T3 PL15741711T PL15741711T PL3183086T3 PL 3183086 T3 PL3183086 T3 PL 3183086T3 PL 15741711 T PL15741711 T PL 15741711T PL 15741711 T PL15741711 T PL 15741711T PL 3183086 T3 PL3183086 T3 PL 3183086T3
Authority
PL
Poland
Prior art keywords
wave soldering
nozzle system
soldering method
wave
soldering nozzle
Prior art date
Application number
PL15741711T
Other languages
English (en)
Inventor
Gregory Leo HUESTE
Original Assignee
Illinois Tool Works Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc. filed Critical Illinois Tool Works Inc.
Publication of PL3183086T3 publication Critical patent/PL3183086T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
PL15741711T 2014-08-21 2015-07-10 Układ dyszowy do lutowania falowego oraz sposób lutowania falowego PL3183086T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/465,559 US9370838B2 (en) 2014-08-21 2014-08-21 Wave soldering nozzle system and method of wave soldering
PCT/US2015/039899 WO2016028407A1 (en) 2014-08-21 2015-07-10 Wave soldering nozzle machine, wave soldering nozzle system and method of wave soldering
EP15741711.4A EP3183086B1 (en) 2014-08-21 2015-07-10 Wave soldering nozzle system and method of wave soldering

Publications (1)

Publication Number Publication Date
PL3183086T3 true PL3183086T3 (pl) 2020-06-15

Family

ID=53719987

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15741711T PL3183086T3 (pl) 2014-08-21 2015-07-10 Układ dyszowy do lutowania falowego oraz sposób lutowania falowego

Country Status (9)

Country Link
US (1) US9370838B2 (pl)
EP (1) EP3183086B1 (pl)
CN (1) CN106660152B (pl)
CA (1) CA2956299A1 (pl)
ES (1) ES2770735T3 (pl)
MX (1) MX380538B (pl)
PL (1) PL3183086T3 (pl)
TW (1) TWI644604B (pl)
WO (1) WO2016028407A1 (pl)

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DE102013217952B3 (de) * 2013-09-09 2014-11-06 Ersa Gmbh Vorrichtung zur Zuführung eines Heißgasstroms
DE102014110720B4 (de) * 2014-07-29 2025-12-31 Illinois Tool Works Inc. Lötmodul
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
KR20200088318A (ko) * 2017-11-28 2020-07-22 노드슨 코포레이션 동기 운동 셀렉티브 솔더링 장치 및 방법
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US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
JP6590232B1 (ja) * 2019-04-22 2019-10-16 千住金属工業株式会社 はんだ付け装置及びはんだ付け方法
CN110539050A (zh) * 2019-10-14 2019-12-06 深圳市劲拓自动化设备股份有限公司 焊接装置及选择性波峰焊装置
CN110548952A (zh) * 2019-10-14 2019-12-10 深圳市劲拓自动化设备股份有限公司 焊接装置及选择性波峰焊装置
CN113333234B (zh) * 2020-03-03 2026-01-30 伊利诺斯工具制品有限公司 分配装置
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
CN113927121B (zh) * 2021-10-15 2023-02-24 扬州扬杰电子科技股份有限公司 基于波峰焊机的光伏模块二极管预储锡装置
CN115302034B (zh) * 2022-08-10 2024-09-20 惠州西文思技术股份有限公司 一种选择性波峰焊接工艺
US12363833B2 (en) * 2023-10-18 2025-07-15 Illinois Tool Works Inc. System and method for controlling flow of solder in a wave soldering machine
US20250269450A1 (en) * 2024-02-27 2025-08-28 Illinois Tool Works Inc. System and method for combined wave solder flow design
US12543271B1 (en) * 2024-12-16 2026-02-03 Illinois Tool Works Inc. Dual pump system and method to control wavesolder contact length
CN119703254B (zh) * 2025-03-03 2025-05-23 厦门源乾电子有限公司 一种fpc连接器pin针结构的焊接设备

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Also Published As

Publication number Publication date
US20160052074A1 (en) 2016-02-25
CA2956299A1 (en) 2016-02-25
CN106660152B (zh) 2019-11-15
EP3183086B1 (en) 2019-12-11
CN106660152A (zh) 2017-05-10
MX2017001184A (es) 2017-05-08
MX380538B (es) 2025-03-12
TW201608948A (zh) 2016-03-01
EP3183086A1 (en) 2017-06-28
ES2770735T3 (es) 2020-07-02
TWI644604B (zh) 2018-12-11
WO2016028407A1 (en) 2016-02-25
US9370838B2 (en) 2016-06-21

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