PL3208523T3 - Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania - Google Patents

Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania

Info

Publication number
PL3208523T3
PL3208523T3 PL15851506T PL15851506T PL3208523T3 PL 3208523 T3 PL3208523 T3 PL 3208523T3 PL 15851506 T PL15851506 T PL 15851506T PL 15851506 T PL15851506 T PL 15851506T PL 3208523 T3 PL3208523 T3 PL 3208523T3
Authority
PL
Poland
Prior art keywords
led encapsulation
dimensional element
manufacture
substrate used
bulb containing
Prior art date
Application number
PL15851506T
Other languages
English (en)
Inventor
Andrew YEUNG
Original Assignee
Sim Lighting Design Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201420596768.5U external-priority patent/CN204176377U/zh
Priority claimed from CN201420596769.XU external-priority patent/CN204424304U/zh
Priority claimed from CN201420597293.1U external-priority patent/CN204257694U/zh
Priority claimed from CN201420615380.5U external-priority patent/CN204268119U/zh
Priority claimed from CN201420616660.8U external-priority patent/CN204240103U/zh
Priority claimed from CN201510023423.XA external-priority patent/CN104595872A/zh
Priority claimed from CN201510023784.4A external-priority patent/CN104613346A/zh
Application filed by Sim Lighting Design Company Limited filed Critical Sim Lighting Design Company Limited
Publication of PL3208523T3 publication Critical patent/PL3208523T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
PL15851506T 2014-10-15 2015-10-15 Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania PL3208523T3 (pl)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
CN201420596768.5U CN204176377U (zh) 2014-10-15 2014-10-15 立体led封装的灯泡
CN201420596769.XU CN204424304U (zh) 2014-10-15 2014-10-15 立体led封装
CN201420597293.1U CN204257694U (zh) 2014-10-15 2014-10-15 Led封装基板
CN201420615380.5U CN204268119U (zh) 2014-10-23 2014-10-23 一种双螺旋形led封装的灯泡
CN201420616660.8U CN204240103U (zh) 2014-10-23 2014-10-23 一种螺旋形led封装的灯泡
CN201510023423.XA CN104595872A (zh) 2015-01-16 2015-01-16 一种螺旋形led封装的灯泡的制作方法
CN201510023784.4A CN104613346A (zh) 2015-01-16 2015-01-16 一种立体led封装的灯泡的制作方法
PCT/CN2015/091970 WO2016058539A1 (zh) 2014-10-15 2015-10-15 Led封装用基板、立体led封装、具有该立体led封装的灯泡及其制作方法
EP15851506.4A EP3208523B1 (en) 2014-10-15 2015-10-15 Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor

Publications (1)

Publication Number Publication Date
PL3208523T3 true PL3208523T3 (pl) 2021-04-19

Family

ID=55082670

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15851506T PL3208523T3 (pl) 2014-10-15 2015-10-15 Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania

Country Status (9)

Country Link
US (1) US10563824B2 (pl)
EP (1) EP3208523B1 (pl)
JP (2) JP2017532793A (pl)
AU (1) AU2015333293B2 (pl)
CA (1) CA2964421C (pl)
ES (1) ES2835831T3 (pl)
HK (1) HK1207250A2 (pl)
PL (1) PL3208523T3 (pl)
WO (1) WO2016058539A1 (pl)

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Also Published As

Publication number Publication date
HK1207250A2 (en) 2016-01-22
AU2015333293B2 (en) 2018-12-20
CA2964421A1 (en) 2016-04-21
EP3208523A4 (en) 2018-05-16
ES2835831T3 (es) 2021-06-23
US10563824B2 (en) 2020-02-18
WO2016058539A1 (zh) 2016-04-21
EP3208523B1 (en) 2020-09-02
CA2964421C (en) 2021-05-18
AU2015333293A1 (en) 2017-05-04
US20170241597A1 (en) 2017-08-24
EP3208523A1 (en) 2017-08-23
JP2017532793A (ja) 2017-11-02
JP2019117936A (ja) 2019-07-18

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