PL3254800T3 - Środek aktywujący topnik, topnik i lutowie - Google Patents

Środek aktywujący topnik, topnik i lutowie

Info

Publication number
PL3254800T3
PL3254800T3 PL16746731T PL16746731T PL3254800T3 PL 3254800 T3 PL3254800 T3 PL 3254800T3 PL 16746731 T PL16746731 T PL 16746731T PL 16746731 T PL16746731 T PL 16746731T PL 3254800 T3 PL3254800 T3 PL 3254800T3
Authority
PL
Poland
Prior art keywords
flux
solder
activating agent
agent
flux activating
Prior art date
Application number
PL16746731T
Other languages
English (en)
Inventor
Kazuhiro YUKIKATA
Yuusuke Sato
Junichi Aoki
Mitsuyasu Furusawa
Kimiaki Mori
Original Assignee
Koki Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Company Limited filed Critical Koki Company Limited
Publication of PL3254800T3 publication Critical patent/PL3254800T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3603—Halide salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C271/00—Derivatives of carbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
    • C07C271/06—Esters of carbamic acids
    • C07C271/08—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms
    • C07C271/10—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms
    • C07C271/16—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of hydrocarbon radicals substituted by singly-bound oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C271/00—Derivatives of carbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
    • C07C271/06—Esters of carbamic acids
    • C07C271/08—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms
    • C07C271/26—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atom of at least one of the carbamate groups bound to a carbon atom of a six-membered aromatic ring
    • C07C271/28—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atom of at least one of the carbamate groups bound to a carbon atom of a six-membered aromatic ring to a carbon atom of a non-condensed six-membered aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C33/00—Unsaturated compounds having hydroxy or O-metal groups bound to acyclic carbon atoms
    • C07C33/40—Halogenated unsaturated alcohols
    • C07C33/42—Halogenated unsaturated alcohols acyclic
    • C07C33/423—Halogenated unsaturated alcohols acyclic containing only double bonds as unsaturation
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
    • C07C43/14—Unsaturated ethers
    • C07C43/17—Unsaturated ethers containing halogen
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
    • C07C43/14—Unsaturated ethers
    • C07C43/17—Unsaturated ethers containing halogen
    • C07C43/174—Unsaturated ethers containing halogen containing six-membered aromatic rings
    • C07C43/176—Unsaturated ethers containing halogen containing six-membered aromatic rings having unsaturation outside the aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/62—Halogen-containing esters
    • C07C69/63—Halogen-containing esters of saturated acids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
PL16746731T 2015-02-05 2016-02-05 Środek aktywujący topnik, topnik i lutowie PL3254800T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015021528A JP5816947B1 (ja) 2015-02-05 2015-02-05 フラックス用活性剤、フラックス及びはんだ
PCT/JP2016/053540 WO2016125901A1 (ja) 2015-02-05 2016-02-05 フラックス用活性剤、フラックス及びはんだ
EP16746731.5A EP3254800B1 (en) 2015-02-05 2016-02-05 Flux activating agent, flux, and solder

Publications (1)

Publication Number Publication Date
PL3254800T3 true PL3254800T3 (pl) 2021-07-19

Family

ID=54602123

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16746731T PL3254800T3 (pl) 2015-02-05 2016-02-05 Środek aktywujący topnik, topnik i lutowie

Country Status (10)

Country Link
US (1) US10702956B2 (pl)
EP (1) EP3254800B1 (pl)
JP (1) JP5816947B1 (pl)
KR (1) KR102356003B1 (pl)
CN (1) CN107107278B (pl)
MY (1) MY182814A (pl)
PL (1) PL3254800T3 (pl)
SG (1) SG11201705919WA (pl)
TW (1) TWI665047B (pl)
WO (1) WO2016125901A1 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6578393B2 (ja) * 2018-02-27 2019-09-18 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
WO2019172410A1 (ja) * 2018-03-09 2019-09-12 株式会社オリジン フラックス、ソルダペースト、はんだ付けプロセス、はんだ付け製品の製造方法、ｂｇａパッケージの製造方法
CN112088068A (zh) 2018-05-08 2020-12-15 株式会社弘辉 助焊剂和软钎料材料
CN109514125A (zh) * 2018-12-18 2019-03-26 深圳市唯特偶新材料股份有限公司 一种焊锡膏
JP6731034B2 (ja) 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676380A (en) 1969-05-19 1972-07-11 Upjohn Co Low friability polyisocyanurate foams
US4342607A (en) 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
US4587217A (en) * 1982-04-02 1986-05-06 Cetus Corporation Vicinal heterogeneous dihalogenated products and method
JPS60203387A (ja) * 1984-03-26 1985-10-14 Nippon Genma:Kk クリ−ムはんだ
KR100411229B1 (ko) * 1998-06-10 2003-12-18 쇼와 덴코 가부시키가이샤 땜납 분말, 플럭스, 땜납 페이스트, 납땜 방법, 납땜된회로기판, 및 납땜된 접합물
US20020046627A1 (en) 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
US20010042779A1 (en) 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2002086292A (ja) * 2000-02-08 2002-03-26 Showa Denko Kk ハンダペースト
JP4505125B2 (ja) 2000-10-17 2010-07-21 クックソンエレクトロニクス株式会社 はんだ付け用フラックス
JP2003001487A (ja) * 2001-06-15 2003-01-08 Showa Denko Kk ハンダ付けフラックス
JP2003025089A (ja) * 2001-07-13 2003-01-28 Showa Denko Kk ハンダペースト
JP4042418B2 (ja) * 2002-01-30 2008-02-06 昭和電工株式会社 ハンダ付けフラックス
JP2009255153A (ja) * 2008-04-21 2009-11-05 Nippon Genma:Kk ソルダペースト
KR101436714B1 (ko) 2010-06-01 2014-09-01 센주긴조쿠고교 가부시키가이샤 납프리 솔더 페이스트
JP6032399B2 (ja) * 2011-07-26 2016-11-30 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト
JP5635487B2 (ja) * 2011-12-16 2014-12-03 株式会社タムラ製作所 はんだ付け用フラックス
JP2013173156A (ja) * 2012-02-24 2013-09-05 Mitsubishi Materials Corp ハンダペーストの製造方法及びこの方法で製造されたハンダペースト
JP5782474B2 (ja) 2013-03-28 2015-09-24 株式会社タムラ製作所 フラックス組成物およびはんだ組成物

Also Published As

Publication number Publication date
JP5816947B1 (ja) 2015-11-18
JP2016140915A (ja) 2016-08-08
KR20170108937A (ko) 2017-09-27
MY182814A (en) 2021-02-05
CN107107278B (zh) 2019-09-03
US10702956B2 (en) 2020-07-07
EP3254800A1 (en) 2017-12-13
SG11201705919WA (en) 2017-08-30
EP3254800B1 (en) 2020-11-11
TW201636147A (zh) 2016-10-16
US20180015576A1 (en) 2018-01-18
EP3254800A4 (en) 2018-07-11
CN107107278A (zh) 2017-08-29
KR102356003B1 (ko) 2022-01-25
TWI665047B (zh) 2019-07-11
WO2016125901A1 (ja) 2016-08-11

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