PL3298061T3 - Środek utwardzający do termoutwardzalnych żywic epoksydowych i sposób przygotowania systemów izolacyjnych do inżynierii elektrycznej - Google Patents
Środek utwardzający do termoutwardzalnych żywic epoksydowych i sposób przygotowania systemów izolacyjnych do inżynierii elektrycznejInfo
- Publication number
- PL3298061T3 PL3298061T3 PL16725399T PL16725399T PL3298061T3 PL 3298061 T3 PL3298061 T3 PL 3298061T3 PL 16725399 T PL16725399 T PL 16725399T PL 16725399 T PL16725399 T PL 16725399T PL 3298061 T3 PL3298061 T3 PL 3298061T3
- Authority
- PL
- Poland
- Prior art keywords
- preparation
- curing agent
- epoxy resins
- electrical engineering
- thermosetting epoxy
- Prior art date
Links
- 239000003795 chemical substances by application Substances 0.000 title 1
- 238000004870 electrical engineering Methods 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 title 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 238000009413 insulation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/20—Instruments transformers
- H01F38/22—Instruments transformers for single phase AC
- H01F38/24—Voltage transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
- H01H33/02—Details
- H01H33/021—Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Insulators (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15168065 | 2015-05-19 | ||
| PCT/EP2016/060558 WO2016184749A1 (en) | 2015-05-19 | 2016-05-11 | A curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering |
| EP16725399.6A EP3298061B1 (en) | 2015-05-19 | 2016-05-11 | A curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3298061T3 true PL3298061T3 (pl) | 2021-05-31 |
Family
ID=53180604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL16725399T PL3298061T3 (pl) | 2015-05-19 | 2016-05-11 | Środek utwardzający do termoutwardzalnych żywic epoksydowych i sposób przygotowania systemów izolacyjnych do inżynierii elektrycznej |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US10851201B2 (pl) |
| EP (1) | EP3298061B1 (pl) |
| JP (1) | JP6944879B2 (pl) |
| KR (1) | KR102572379B1 (pl) |
| CN (1) | CN107636039B (pl) |
| CA (1) | CA2983679C (pl) |
| DK (1) | DK3298061T3 (pl) |
| ES (1) | ES2834894T3 (pl) |
| HU (1) | HUE052763T2 (pl) |
| MX (1) | MX2017014697A (pl) |
| PL (1) | PL3298061T3 (pl) |
| TW (1) | TWI734686B (pl) |
| WO (1) | WO2016184749A1 (pl) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI734686B (zh) * | 2015-05-19 | 2021-08-01 | 瑞士商亨斯邁先進材料授權（瑞士）有限公司 | 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法 |
| JP6734287B2 (ja) * | 2015-09-16 | 2020-08-05 | 日本曹達株式会社 | 包接化合物 |
| JP2020509100A (ja) * | 2017-01-26 | 2020-03-26 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー | 電気工学用製品の製造のための熱硬化性エポキシ樹脂組成物及びそれから得られる製品 |
| GB2569614B (en) * | 2017-12-21 | 2022-04-06 | Hexcel Composites Ltd | A curative composition and a resin composition containing the curative composition |
| TWI847997B (zh) * | 2018-08-17 | 2024-07-11 | 德商漢高股份有限及兩合公司 | 液體壓縮成型或封裝組合物 |
| TW202337995A (zh) * | 2021-11-17 | 2023-10-01 | 德商漢高股份有限及兩合公司 | 液體模製物料及其當暴露於雷射能後變成具可鍍性的反應產物 |
| CN115926115A (zh) * | 2022-12-19 | 2023-04-07 | 湖南肆玖科技有限公司 | 改性环氧树脂固化剂、制备方法及其使用方法 |
| KR20250066024A (ko) | 2023-11-06 | 2025-05-13 | 주식회사 에이치알에스 | 이온성 액체를 포함하는 실리콘 폿팅 조성물 및 이의 제조 방법 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58214225A (ja) * | 1982-06-07 | 1983-12-13 | 三菱電機株式会社 | 樹脂被覆電気装置の製造法 |
| US4775736A (en) | 1985-12-27 | 1988-10-04 | Ethyl Corporation | Epoxy curing agent composition |
| JPS6460625A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Casting epoxy resin composition |
| US5364977A (en) * | 1992-12-01 | 1994-11-15 | Nippon Soda Co., Ltd. | Clathrate compounds comprising tetrakisphenols as host |
| JP3904311B2 (ja) * | 1996-12-27 | 2007-04-11 | 日本曹達株式会社 | エポキシ樹脂用硬化剤・硬化促進剤及びエポキシ樹脂組成物 |
| US7495060B2 (en) * | 1996-12-27 | 2009-02-24 | Nippon Soda Co., Ltd. | Tetrakisphenol and non-clathrated curing agent for epoxy resin |
| US6727325B1 (en) | 1996-12-27 | 2004-04-27 | Nippon Soda Co. Ltd. | Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound |
| JPH10324826A (ja) * | 1997-03-25 | 1998-12-08 | Kansai Paint Co Ltd | 硬化型塗料組成物 |
| GB2323596B (en) * | 1997-03-25 | 2000-02-23 | Kansai Paint Co Ltd | Curable coating composition |
| EP1705740A4 (en) * | 2003-12-18 | 2009-02-25 | Kurita Water Ind Ltd | FUEL FOR A FUEL CELL, FUEL CELL AND APPLICATION THEREOF |
| JP2012232994A (ja) | 2005-07-06 | 2012-11-29 | Nippon Soda Co Ltd | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
| JP5068045B2 (ja) | 2005-07-06 | 2012-11-07 | 日本曹達株式会社 | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
| CN102875470B (zh) | 2006-12-21 | 2015-09-09 | 日本曹达株式会社 | 包合化合物、固化催化剂、固化树脂形成用组合物及固化树脂 |
| MY150836A (en) * | 2007-09-21 | 2014-02-28 | Nippon Soda Co | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| JP5576595B2 (ja) | 2008-03-27 | 2014-08-20 | 大阪瓦斯株式会社 | フルオレン骨格を含有する化合物を用いた包接化合物 |
| JPWO2010103809A1 (ja) * | 2009-03-11 | 2012-09-13 | 日本曹達株式会社 | エポキシ樹脂組成物、硬化剤及び硬化促進剤 |
| EP2424917A1 (en) * | 2009-04-30 | 2012-03-07 | Dow Global Technologies LLC | Thermosettable resin compositions |
| US9068074B2 (en) * | 2009-10-16 | 2015-06-30 | Nippon Soda Co., Ltd. | Composition for formation of cured epoxy resin, and cured products thereof |
| EP2573148A4 (en) * | 2010-05-21 | 2014-02-19 | Nippon Soda Co | HARDENABLE POWDER COATING COMPOSITION AND CURED PRODUCT THEREOF |
| WO2013029831A1 (en) * | 2011-08-31 | 2013-03-07 | Huntsman Advanced Materials (Switzerland) Gmbh | Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer |
| JP6046894B2 (ja) * | 2011-12-28 | 2016-12-21 | ナミックス株式会社 | 液状封止材 |
| JP2014185115A (ja) * | 2013-03-25 | 2014-10-02 | Nippon Soda Co Ltd | 新規な包接化合物 |
| TWI734686B (zh) * | 2015-05-19 | 2021-08-01 | 瑞士商亨斯邁先進材料授權（瑞士）有限公司 | 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法 |
| JP6734287B2 (ja) * | 2015-09-16 | 2020-08-05 | 日本曹達株式会社 | 包接化合物 |
-
2016
- 2016-05-06 TW TW105114110A patent/TWI734686B/zh not_active IP Right Cessation
- 2016-05-11 CN CN201680028631.1A patent/CN107636039B/zh active Active
- 2016-05-11 HU HUE16725399A patent/HUE052763T2/hu unknown
- 2016-05-11 CA CA2983679A patent/CA2983679C/en active Active
- 2016-05-11 KR KR1020177036621A patent/KR102572379B1/ko active Active
- 2016-05-11 ES ES16725399T patent/ES2834894T3/es active Active
- 2016-05-11 US US15/575,270 patent/US10851201B2/en active Active
- 2016-05-11 DK DK16725399.6T patent/DK3298061T3/da active
- 2016-05-11 JP JP2017558739A patent/JP6944879B2/ja not_active Expired - Fee Related
- 2016-05-11 WO PCT/EP2016/060558 patent/WO2016184749A1/en not_active Ceased
- 2016-05-11 PL PL16725399T patent/PL3298061T3/pl unknown
- 2016-05-11 MX MX2017014697A patent/MX2017014697A/es unknown
- 2016-05-11 EP EP16725399.6A patent/EP3298061B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3298061B1 (en) | 2020-09-09 |
| ES2834894T3 (es) | 2021-06-21 |
| EP3298061A1 (en) | 2018-03-28 |
| KR102572379B1 (ko) | 2023-09-01 |
| CN107636039B (zh) | 2020-11-24 |
| US20180142058A1 (en) | 2018-05-24 |
| WO2016184749A1 (en) | 2016-11-24 |
| CA2983679C (en) | 2023-08-08 |
| JP2018517018A (ja) | 2018-06-28 |
| CA2983679A1 (en) | 2016-11-24 |
| DK3298061T3 (da) | 2020-11-16 |
| KR20180008782A (ko) | 2018-01-24 |
| CN107636039A (zh) | 2018-01-26 |
| MX2017014697A (es) | 2018-01-24 |
| US10851201B2 (en) | 2020-12-01 |
| TWI734686B (zh) | 2021-08-01 |
| HUE052763T2 (hu) | 2021-05-28 |
| TW201700525A (zh) | 2017-01-01 |
| JP6944879B2 (ja) | 2021-10-06 |
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