PL3300127T3 - Sposób procesowy z zastosowaniem fotokonwertera z żywicy termoplastycznej do pakietu wiązanego LED przez walcowanie - Google Patents

Sposób procesowy z zastosowaniem fotokonwertera z żywicy termoplastycznej do pakietu wiązanego LED przez walcowanie

Info

Publication number
PL3300127T3
PL3300127T3 PL15901619T PL15901619T PL3300127T3 PL 3300127 T3 PL3300127 T3 PL 3300127T3 PL 15901619 T PL15901619 T PL 15901619T PL 15901619 T PL15901619 T PL 15901619T PL 3300127 T3 PL3300127 T3 PL 3300127T3
Authority
PL
Poland
Prior art keywords
rolling
bond
thermoplastic resin
process method
package led
Prior art date
Application number
PL15901619T
Other languages
English (en)
Inventor
Jinhua He
Original Assignee
Jiangsu Cherrity Optronics Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Cherrity Optronics Co., Ltd filed Critical Jiangsu Cherrity Optronics Co., Ltd
Publication of PL3300127T3 publication Critical patent/PL3300127T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
PL15901619T 2015-08-18 2015-12-16 Sposób procesowy z zastosowaniem fotokonwertera z żywicy termoplastycznej do pakietu wiązanego LED przez walcowanie PL3300127T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201510508066.6A CN106469772B (zh) 2015-08-18 2015-08-18 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法
EP15901619.5A EP3300127B1 (en) 2015-08-18 2015-12-16 Process method using thermoplastic resin photoconverter to bond-package led by rolling
PCT/CN2015/097624 WO2017028417A1 (zh) 2015-08-18 2015-12-16 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法

Publications (1)

Publication Number Publication Date
PL3300127T3 true PL3300127T3 (pl) 2020-01-31

Family

ID=58051662

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15901619T PL3300127T3 (pl) 2015-08-18 2015-12-16 Sposób procesowy z zastosowaniem fotokonwertera z żywicy termoplastycznej do pakietu wiązanego LED przez walcowanie

Country Status (7)

Country Link
US (1) US10546980B2 (pl)
EP (1) EP3300127B1 (pl)
JP (1) JP6538889B2 (pl)
KR (1) KR101957870B1 (pl)
CN (1) CN106469772B (pl)
PL (1) PL3300127T3 (pl)
WO (1) WO2017028417A1 (pl)

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* Cited by examiner, † Cited by third party
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CN106469772B (zh) 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法
CN108058411A (zh) * 2017-11-24 2018-05-22 宁波东旭成新材料科技有限公司 一种双向拉伸制备量子点复合膜的方法
KR102079597B1 (ko) * 2018-02-21 2020-02-20 대성앤텍 주식회사 엘이디 기판의 제조장치 및 이의 제조방법
KR102051478B1 (ko) * 2018-03-02 2019-12-04 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
CN111900243A (zh) * 2020-06-29 2020-11-06 南京中电熊猫液晶显示科技有限公司 显示背板及其封装方法、封装材料的填充方法

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CN106469772B (zh) 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法

Also Published As

Publication number Publication date
EP3300127B1 (en) 2019-05-22
CN106469772B (zh) 2018-01-05
JP6538889B2 (ja) 2019-07-03
EP3300127A1 (en) 2018-03-28
KR101957870B1 (ko) 2019-03-13
KR20180011159A (ko) 2018-01-31
US10546980B2 (en) 2020-01-28
US20190035985A1 (en) 2019-01-31
JP2018523915A (ja) 2018-08-23
WO2017028417A1 (zh) 2017-02-23
EP3300127A4 (en) 2018-04-25
CN106469772A (zh) 2017-03-01

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