PL3461933T3 - Sposób elektrolitycznego osadzania warstwy stopu cynkowo-niklowego co najmniej na podłożu przeznaczonym do obróbki - Google Patents

Sposób elektrolitycznego osadzania warstwy stopu cynkowo-niklowego co najmniej na podłożu przeznaczonym do obróbki

Info

Publication number
PL3461933T3
PL3461933T3 PL17193725T PL17193725T PL3461933T3 PL 3461933 T3 PL3461933 T3 PL 3461933T3 PL 17193725 T PL17193725 T PL 17193725T PL 17193725 T PL17193725 T PL 17193725T PL 3461933 T3 PL3461933 T3 PL 3461933T3
Authority
PL
Poland
Prior art keywords
zinc
treated
substrate
alloy layer
nickel alloy
Prior art date
Application number
PL17193725T
Other languages
English (en)
Inventor
Thomas Freese
Ronny Best
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL3461933T3 publication Critical patent/PL3461933T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL17193725T 2017-09-28 2017-09-28 Sposób elektrolitycznego osadzania warstwy stopu cynkowo-niklowego co najmniej na podłożu przeznaczonym do obróbki PL3461933T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17193725.3A EP3461933B1 (en) 2017-09-28 2017-09-28 Method for electrolytically depositing a zinc-nickel alloy layer on at least a substrate to be treated

Publications (1)

Publication Number Publication Date
PL3461933T3 true PL3461933T3 (pl) 2020-03-31

Family

ID=59974324

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17193725T PL3461933T3 (pl) 2017-09-28 2017-09-28 Sposób elektrolitycznego osadzania warstwy stopu cynkowo-niklowego co najmniej na podłożu przeznaczonym do obróbki

Country Status (12)

Country Link
US (1) US10961637B2 (pl)
EP (1) EP3461933B1 (pl)
JP (1) JP6851548B2 (pl)
KR (1) KR102127090B1 (pl)
CN (1) CN111094632B (pl)
ES (1) ES2757530T3 (pl)
MX (1) MX379897B (pl)
PL (1) PL3461933T3 (pl)
PT (1) PT3461933T (pl)
RU (1) RU2735210C1 (pl)
TW (1) TWI690624B (pl)
WO (1) WO2019063197A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3461933T (pt) 2017-09-28 2019-12-09 Atotech Deutschland Gmbh Método para depositar eletroliticamente uma camada de liga de zinco-níquel em, pelo menos, um substrato a ser tratado

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE470874A (pl) 1940-12-21
US3945388A (en) * 1974-07-29 1976-03-23 Oxy Metal Industries Corporation Apparatus for counterflow rinsing of workpieces
JPS55106482A (en) 1979-02-08 1980-08-15 Mita Ind Co Ltd Cleaning method in transfer type electrostatic copying machine
FR2503524A1 (fr) * 1981-04-01 1982-10-08 Sagem Perfectionnements apportes aux machines pour secher des cartes a circuits imprimes cablees apres nettoyage de celles-ci a l'issue d'une operation de soudage automatique des composants
DE3110176A1 (de) * 1981-03-17 1982-10-07 Rasselstein Ag, 5450 Neuwied Zinkanode zum galvanischen abscheiden eines zink-nickel-legierungsueberzuges
EP0100777A1 (en) * 1982-08-10 1984-02-22 The Dow Chemical Company Process for electroplating metal parts
JPS62290895A (ja) * 1986-06-11 1987-12-17 Sumitomo Metal Ind Ltd 電気亜鉛合金めつき鋼板
JPS6326396A (ja) * 1986-07-18 1988-02-03 Kobe Steel Ltd Ｚｎ−Ｎｉ系合金電気めつき鋼板の製造方法
CN2175238Y (zh) * 1993-09-29 1994-08-24 北京科技大学 锌-镍合金电镀用阳极
US5435898A (en) * 1994-10-25 1995-07-25 Enthone-Omi Inc. Alkaline zinc and zinc alloy electroplating baths and processes
JP2001026899A (ja) * 1999-05-13 2001-01-30 Sumitomo Metal Ind Ltd 高耐食性燃料タンク用鋼板及びその製造方法
DE10146559A1 (de) 2001-09-21 2003-04-10 Enthone Omi Deutschland Gmbh Verfahren zur Abscheidung einer Zink-Nickel-Legierung aus einem Elektrolyten
KR100851229B1 (ko) * 2001-12-26 2008-08-07 주식회사 포스코 양극의 부동태화를 방지할 수 있는 아연-코발트-텅스텐합금전기도금용액
JP4725145B2 (ja) * 2005-03-17 2011-07-13 日本電気株式会社 合金めっき方法および合金めっき装置
ES2574158T3 (es) * 2005-04-26 2016-06-15 Atotech Deutschland Gmbh Baño galvánico alcalino con una membrana de filtración
US20100096274A1 (en) * 2008-10-17 2010-04-22 Rowan Anthony J Zinc alloy electroplating baths and processes
DE102008056776A1 (de) * 2008-11-11 2010-05-12 Enthone Inc., West Haven Galvanisches Bad und Verfahren zur Abscheidung von zinkhaltigen Schichten
DE202008014947U1 (de) 2008-11-11 2009-03-12 Enthone Inc., West Haven Galvanisches Bad zur Abscheidung von zinkhaltigen Schichten
US20160024683A1 (en) * 2013-03-21 2016-01-28 Atotech Deutschland Gmbh Apparatus and method for electrolytic deposition of metal layers on workpieces
CN203639589U (zh) * 2014-01-13 2014-06-11 杭州莱源环保科技有限公司 用于酸性锌镍合金的双阳极结构双整流器系统的电镀装置
US9689084B2 (en) * 2014-05-22 2017-06-27 Globalfounries Inc. Electrodeposition systems and methods that minimize anode and/or plating solution degradation
CN204174295U (zh) * 2014-07-29 2015-02-25 葛婕 配置有双阳极的酸性锌镍合金电镀装置
CN204174298U (zh) * 2014-08-04 2015-02-25 葛婕 一种用于酸性锌镍合金电镀的辅助阳极
RU2613826C1 (ru) * 2015-07-22 2017-03-21 Дипсол Кемикалз Ко., Лтд. Способ гальваностегии цинковым сплавом
CN106550606B (zh) * 2015-07-22 2019-04-26 迪普索股份公司 锌合金镀敷方法
JP6326396B2 (ja) 2015-11-10 2018-05-16 株式会社神戸製鋼所 ＬｉＣｏＯ２含有スパッタリングターゲットおよびＬｉＣｏＯ２含有焼結体
PT3461933T (pt) 2017-09-28 2019-12-09 Atotech Deutschland Gmbh Método para depositar eletroliticamente uma camada de liga de zinco-níquel em, pelo menos, um substrato a ser tratado

Also Published As

Publication number Publication date
RU2735210C1 (ru) 2020-10-28
KR20200027040A (ko) 2020-03-11
WO2019063197A1 (en) 2019-04-04
MX379897B (es) 2025-03-11
KR102127090B1 (ko) 2020-06-26
ES2757530T3 (es) 2020-04-29
PT3461933T (pt) 2019-12-09
JP6851548B2 (ja) 2021-03-31
TW201920780A (zh) 2019-06-01
CN111094632A (zh) 2020-05-01
BR112020001988A2 (pt) 2020-08-18
US20200240036A1 (en) 2020-07-30
EP3461933A1 (en) 2019-04-03
MX2020004725A (es) 2021-02-16
CN111094632B (zh) 2021-02-09
US10961637B2 (en) 2021-03-30
TWI690624B (zh) 2020-04-11
EP3461933B1 (en) 2019-09-04
JP2020535319A (ja) 2020-12-03

Similar Documents

Publication Publication Date Title
WO2012150198A3 (en) Electroplating bath and method for producing dark chromium layers
PT3589771T (pt) Método para produzir uma tira de aço com uma camada de revestimento de liga de alumínio
SG11201808424UA (en) Roll-to-roll atomic layer deposition apparatus and method
EP3149222A4 (en) Plating or coating method for producing metal-ceramic coating on a substrate
PL2752504T3 (pl) Sposób wytwarzania zabezpieczonego przed korozją, metalicznie powlekanego substratu z połyskiem,metalicznie powlekany substrat, jak również jego zastosowanie
GB2591348B (en) Method for producing GaN laminate substrate
ZA201903049B (en) Method for electroplating an uncoated steel strip with a plating layer
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
PL3048181T3 (pl) Instalacja i sposób metalicznego powlekania przedmiotu obrabianego
EP3042984A4 (en) ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN
IL237731B (en) Electrolyte and process for electroplating copper onto a barrier layer
PL2852698T3 (pl) Kąpiel galwaniczna do powlekania niklem lub stopem niklu w celu osadzania pół-błyszczącej warstwy niklu lub stopu niklu
EP2981507A4 (en) Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound
EP2850224A4 (en) METHOD FOR APPLYING TITANIUM ALLOY TO SUBSTRATE
PT3483307T (pt) Composições de revestimento para deposição de cobre eletrolítico, a sua utilização e um método para depósito electrolítico de uma camada de cobre ou liga de cobre na pelo menos uma superfície de um substrato
EP3574128A4 (en) METAL LAYER FORMING PROCESS
PL3607115T3 (pl) Kontrolowany sposób osadzania warstwy chromu albo stopu chromu na co najmniej jednym podłożu
EP3206236A4 (en) Method for horizontally electrochemically depositing metal
EP3196263A4 (en) Electrodeposition liquid, metal core substrate, and process for producing metal core substrate
PL2931936T3 (pl) Sposób obróbki powierzchni metalicznego podłoża
ZA201705163B (en) Method for producing a multilayer coating on a metallic substrate
SG2013020532A (en) Method of forming a coating on a metal substrate
PT3283672T (pt) Produto galvânico possuindo uma camada de acabamento de metal precioso e resistência a corrosão melhorada, método para a sua produção e suas utilizações
PL2992127T3 (pl) Sposób obróbki powierzchni metalowego podłoża
PL3607116T3 (pl) Sposób elektrolitycznego osadzania warstwy chromu lub stopu chromu na co najmniej jednym podłożu