PL3469635T3 - Sposób i urządzenie do rozdzielania różnych warstw materiału kompozytowego elementu konstrukcyjnego - Google Patents
Sposób i urządzenie do rozdzielania różnych warstw materiału kompozytowego elementu konstrukcyjnegoInfo
- Publication number
- PL3469635T3 PL3469635T3 PL18704393T PL18704393T PL3469635T3 PL 3469635 T3 PL3469635 T3 PL 3469635T3 PL 18704393 T PL18704393 T PL 18704393T PL 18704393 T PL18704393 T PL 18704393T PL 3469635 T3 PL3469635 T3 PL 3469635T3
- Authority
- PL
- Poland
- Prior art keywords
- composite material
- different layers
- construction element
- separating different
- separating
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title 1
- 238000010276 construction Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/20—Waste processing or separation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/935—Delaminating means in preparation for post consumer recycling
- Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Photovoltaic Devices (AREA)
- Manufacturing & Machinery (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Sorting Of Articles (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017101564 | 2017-01-26 | ||
| DE102017108417 | 2017-04-20 | ||
| EP2017064614 | 2017-06-14 | ||
| PCT/DE2018/100062 WO2018137735A1 (de) | 2017-01-26 | 2018-01-25 | Verfahren und vorrichtung zum trennen verschiedener materialschichten eines verbundbauteils |
| EP18704393.0A EP3469635B1 (de) | 2017-01-26 | 2018-01-25 | Verfahren und vorrichtung zum trennen verschiedener materialschichten eines verbundbauteils |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3469635T3 true PL3469635T3 (pl) | 2021-04-19 |
Family
ID=62979052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL18704393T PL3469635T3 (pl) | 2017-01-26 | 2018-01-25 | Sposób i urządzenie do rozdzielania różnych warstw materiału kompozytowego elementu konstrukcyjnego |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10786982B2 (pl) |
| EP (1) | EP3469635B1 (pl) |
| JP (2) | JP2020507197A (pl) |
| KR (1) | KR102278504B1 (pl) |
| CN (1) | CN109496365B (pl) |
| ES (1) | ES2828082T3 (pl) |
| HU (1) | HUE051753T2 (pl) |
| MY (1) | MY202915A (pl) |
| PL (1) | PL3469635T3 (pl) |
| WO (1) | WO2018137735A1 (pl) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116748280A (zh) | 2018-04-19 | 2023-09-15 | 太阳能先锋株式会社 | 太阳能电池模块的再利用方法以及再利用装置 |
| TWI836077B (zh) * | 2019-05-22 | 2024-03-21 | 日商力森諾科股份有限公司 | 半導體裝置的製造方法 |
| KR102419718B1 (ko) * | 2020-04-29 | 2022-07-12 | 박일남 | 태양전지모듈의 분해 장치 |
| KR20230087509A (ko) * | 2020-10-16 | 2023-06-16 | 브레우어 사이언스, 인코포레이션 | 웨이퍼-수준 패키징 적용을 위한 광자 디본딩 |
| US11407215B2 (en) * | 2020-12-13 | 2022-08-09 | Taesung Kim | Methods and systems for recycling end-of-life photovoltaic modules |
| AU2022438489A1 (en) | 2022-02-01 | 2024-08-22 | FLAXTEC GmbH | Method of recycling silicon components |
| AU2022439181A1 (en) * | 2022-02-07 | 2024-08-22 | FLAXTEC GmbH | Method for separating reusable materials in a composite component |
| CN115503330B (zh) * | 2022-06-27 | 2024-06-18 | 合复新材料科技(无锡)有限公司 | 一种太阳能背板EVA-Si贴合层的界面分离回收方法 |
| CN115446093A (zh) * | 2022-09-02 | 2022-12-09 | 重庆远达烟气治理特许经营有限公司科技分公司 | 层压件辐照处理装置 |
| US20260114069A1 (en) * | 2022-10-11 | 2026-04-23 | Mool C. Gupta | Laser process and system and resultant article of manufacture |
| CN117798176A (zh) * | 2023-12-04 | 2024-04-02 | 国家电投集团远达环保工程有限公司 | 一种高功率稀有气体放电灯阵列、控制方法和回收设备 |
| CN117601553A (zh) * | 2023-12-04 | 2024-02-27 | 国家电投集团远达环保工程有限公司 | 一种模块化阵列氙灯辐照系统及方法 |
| WO2025164465A1 (ja) * | 2024-02-02 | 2025-08-07 | ソーラーフロンティア株式会社 | リサイクル方法及びリサイクル装置 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197556A (ja) * | 2001-12-28 | 2003-07-11 | Ushio Inc | 光加熱装置 |
| JP2004134672A (ja) * | 2002-10-11 | 2004-04-30 | Sony Corp | 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置 |
| JP5186764B2 (ja) * | 2006-12-13 | 2013-04-24 | ウシオ電機株式会社 | 閃光放射装置 |
| JP4471003B2 (ja) * | 2008-01-23 | 2010-06-02 | セイコーエプソン株式会社 | 接合体の形成方法 |
| KR101413370B1 (ko) | 2008-02-29 | 2014-06-30 | 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 결정질 막 제조 방법, 태양전지 형성 방법 및 이 방법에 의해 제조된 결정질 막 및 태양 전지 |
| US7919340B2 (en) * | 2008-06-04 | 2011-04-05 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting device |
| DE102008047675B4 (de) * | 2008-06-13 | 2014-05-15 | Ctf Solar Gmbh | Recycling-Verfahren für Dünnschichtsolarzellenmodule |
| JP2011054641A (ja) * | 2009-08-31 | 2011-03-17 | Nitto Denko Corp | 被切断体からのダイシング表面保護テープの剥離除去方法 |
| JP5574750B2 (ja) * | 2010-02-25 | 2014-08-20 | 昭和シェル石油株式会社 | 太陽電池モジュールのリサイクル方法 |
| JP5580800B2 (ja) * | 2010-10-29 | 2014-08-27 | 東京応化工業株式会社 | 積層体、およびその積層体の分離方法 |
| CN102721641A (zh) * | 2011-03-28 | 2012-10-10 | 优志旺电机株式会社 | 太阳能电池板用耐候试验装置 |
| DE102011081749B4 (de) * | 2011-04-29 | 2016-04-14 | Von Ardenne Gmbh | Substratbehandlungsanlage |
| JP2015217372A (ja) * | 2014-05-20 | 2015-12-07 | 株式会社日本スペリア社 | 太陽電池パネルの再生処理方法 |
| EP3149096B1 (en) * | 2014-05-30 | 2020-06-24 | Henkel AG & Co. KGaA | A process and apparatus for detaching a display module bonded by a liquid optically clear adhesive |
| DE102014111744B4 (de) * | 2014-08-18 | 2022-01-05 | Infineon Technologies Ag | Baugruppe zum handhaben eines halbleiterchips und verfahren zum handhaben eines halbleiterchips |
| JP2016072293A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社Screenホールディングス | 剥離補助装置および剥離補助方法 |
| WO2016175653A2 (en) * | 2015-04-28 | 2016-11-03 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Apparatus and method for soldering chips |
| EP3289605A2 (en) * | 2015-04-28 | 2018-03-07 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Transfer and soldering of chips |
| US10770309B2 (en) * | 2015-12-30 | 2020-09-08 | Mattson Technology, Inc. | Features for improving process uniformity in a millisecond anneal system |
-
2018
- 2018-01-25 EP EP18704393.0A patent/EP3469635B1/de active Active
- 2018-01-25 PL PL18704393T patent/PL3469635T3/pl unknown
- 2018-01-25 JP JP2018566348A patent/JP2020507197A/ja active Pending
- 2018-01-25 WO PCT/DE2018/100062 patent/WO2018137735A1/de not_active Ceased
- 2018-01-25 US US16/309,798 patent/US10786982B2/en active Active
- 2018-01-25 KR KR1020197001305A patent/KR102278504B1/ko active Active
- 2018-01-25 HU HUE18704393A patent/HUE051753T2/hu unknown
- 2018-01-25 MY MYPI2018002532A patent/MY202915A/en unknown
- 2018-01-25 ES ES18704393T patent/ES2828082T3/es active Active
- 2018-01-25 CN CN201880002452.XA patent/CN109496365B/zh active Active
-
2022
- 2022-11-25 JP JP2022188536A patent/JP7442603B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018137735A1 (de) | 2018-08-02 |
| JP2020507197A (ja) | 2020-03-05 |
| CN109496365A (zh) | 2019-03-19 |
| JP7442603B2 (ja) | 2024-03-04 |
| MY202915A (en) | 2024-05-29 |
| EP3469635B1 (de) | 2020-09-09 |
| EP3469635A1 (de) | 2019-04-17 |
| CN109496365B (zh) | 2023-03-24 |
| KR102278504B1 (ko) | 2021-07-15 |
| HUE051753T2 (hu) | 2021-03-29 |
| JP2023024474A (ja) | 2023-02-16 |
| US20190308405A1 (en) | 2019-10-10 |
| US10786982B2 (en) | 2020-09-29 |
| KR20190101354A (ko) | 2019-08-30 |
| ES2828082T3 (es) | 2021-05-25 |
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