PL3475240T3 - Sposób hermetyzacji wspomaganej laserem oraz jej produkt - Google Patents
Sposób hermetyzacji wspomaganej laserem oraz jej produktInfo
- Publication number
- PL3475240T3 PL3475240T3 PL17757869T PL17757869T PL3475240T3 PL 3475240 T3 PL3475240 T3 PL 3475240T3 PL 17757869 T PL17757869 T PL 17757869T PL 17757869 T PL17757869 T PL 17757869T PL 3475240 T3 PL3475240 T3 PL 3475240T3
- Authority
- PL
- Poland
- Prior art keywords
- assisted
- laser
- product
- encapsulation process
- hermetic encapsulation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PT2016109489 | 2016-06-25 | ||
| PT10948916 | 2016-06-25 | ||
| PT2017109826 | 2017-01-02 | ||
| PT10982617 | 2017-01-02 | ||
| EP17757869.7A EP3475240B1 (en) | 2016-06-25 | 2017-06-26 | Laser-assisted hermetic encapsulation process and product thereof |
| PCT/IB2017/053808 WO2017221218A1 (en) | 2016-06-25 | 2017-06-26 | Laser-assisted hermetic encapsulation process and product thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3475240T3 true PL3475240T3 (pl) | 2021-06-14 |
Family
ID=59702764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17757869T PL3475240T3 (pl) | 2016-06-25 | 2017-06-26 | Sposób hermetyzacji wspomaganej laserem oraz jej produkt |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11427505B2 (pl) |
| EP (1) | EP3475240B1 (pl) |
| PL (1) | PL3475240T3 (pl) |
| WO (1) | WO2017221218A1 (pl) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019217466A1 (de) * | 2019-11-12 | 2021-05-12 | Lpkf Laser & Electronics Ag | Reaktionsgefäße aus Glas, Herstellungsverfahren und Verfahren zur Analyse |
| WO2021108136A1 (en) * | 2019-11-25 | 2021-06-03 | Corning Incorporated | Bonded articles and methods for forming the same |
| KR20210141870A (ko) * | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 웨이퍼 처리 장치 및 이를 이용한 반도체 소자 제조 방법 |
| US12442243B2 (en) * | 2022-11-23 | 2025-10-14 | LuxWall, Inc. | Vacuum insulated panel with optimized seal width(s) |
| CN116171064B (zh) * | 2023-02-27 | 2025-12-12 | 昆山国显光电有限公司 | 显示面板及显示装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| US7425166B2 (en) * | 2005-12-06 | 2008-09-16 | Corning Incorporated | Method of sealing glass substrates |
| US7537504B2 (en) * | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
| KR100887009B1 (ko) * | 2005-12-06 | 2009-03-04 | 코닝 인코포레이티드 | 완전 밀봉 글래스 패키지 및 그 제조방법 |
| US8448468B2 (en) * | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
| CA2776462C (en) | 2009-10-02 | 2017-04-18 | Wisconsin Alumni Research Foundation | (20s,22e)-2-methylene-19-nor-22-ene-1.alpha.,25-dihydroxyvitamin d3 analogs |
| KR101117732B1 (ko) * | 2010-01-19 | 2012-02-24 | 삼성모바일디스플레이주식회사 | 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| US8796109B2 (en) | 2010-12-23 | 2014-08-05 | Medtronic, Inc. | Techniques for bonding substrates using an intermediate layer |
| PT2690676T (pt) | 2011-03-22 | 2021-03-30 | Efacec Engenharia E Sist S A | Processo de fabrico para um susbtrato e um elétrodo para células solares |
| KR102034252B1 (ko) * | 2012-12-21 | 2019-10-21 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 기판 밀봉 방법 |
| TWI636875B (zh) * | 2013-02-04 | 2018-10-01 | Semiconductor Energy Laboratory Co., Ltd. | 玻璃層的形成方法及密封結構的製造方法 |
| KR102049445B1 (ko) * | 2013-05-31 | 2019-11-28 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
-
2017
- 2017-06-26 PL PL17757869T patent/PL3475240T3/pl unknown
- 2017-06-26 WO PCT/IB2017/053808 patent/WO2017221218A1/en not_active Ceased
- 2017-06-26 EP EP17757869.7A patent/EP3475240B1/en active Active
- 2017-06-26 US US16/313,374 patent/US11427505B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017221218A1 (en) | 2017-12-28 |
| US20210230060A1 (en) | 2021-07-29 |
| EP3475240A1 (en) | 2019-05-01 |
| US11427505B2 (en) | 2022-08-30 |
| EP3475240B1 (en) | 2020-08-26 |
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