PL3478047T3 - System montażu i sposób montażu - Google Patents

System montażu i sposób montażu

Info

Publication number
PL3478047T3
PL3478047T3 PL18201945T PL18201945T PL3478047T3 PL 3478047 T3 PL3478047 T3 PL 3478047T3 PL 18201945 T PL18201945 T PL 18201945T PL 18201945 T PL18201945 T PL 18201945T PL 3478047 T3 PL3478047 T3 PL 3478047T3
Authority
PL
Poland
Prior art keywords
assembly system
assembling method
assembling
assembly
Prior art date
Application number
PL18201945T
Other languages
English (en)
Inventor
Yingcong Deng
Jarosław Kowalski
Andrzej Przybylski
Jarosław Grzębski
Dandan Zhang
Lvhai Hu
Fengchun Xie
Yun Liu
Roberto Francisco-Yi LU
Haidong WU
Hui XIAO
Original Assignee
Tyco Electronics (Shanghai) Co., Ltd.
Tyco Electronics Polska Sp. z o.o.
Te Connectivity Corporation
Kunshan League Automechanism Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Polska Sp. z o.o., Te Connectivity Corporation, Kunshan League Automechanism Co., Ltd. filed Critical Tyco Electronics (Shanghai) Co., Ltd.
Publication of PL3478047T3 publication Critical patent/PL3478047T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automatic Assembly (AREA)
  • Manipulator (AREA)
PL18201945T 2017-10-25 2018-10-23 System montażu i sposób montażu PL3478047T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711008175.7A CN109714943B (zh) 2017-10-25 2017-10-25 组装系统和组装方法
EP18201945.5A EP3478047B1 (en) 2017-10-25 2018-10-23 Assembly system and assembling method

Publications (1)

Publication Number Publication Date
PL3478047T3 true PL3478047T3 (pl) 2021-10-25

Family

ID=64048680

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18201945T PL3478047T3 (pl) 2017-10-25 2018-10-23 System montażu i sposób montażu

Country Status (4)

Country Link
US (1) US11134600B2 (pl)
EP (1) EP3478047B1 (pl)
CN (1) CN109714943B (pl)
PL (1) PL3478047T3 (pl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113758926A (zh) * 2020-06-03 2021-12-07 泰连服务有限公司 具有视觉检查站的产品组装机
CN114324343A (zh) * 2020-10-09 2022-04-12 泰连服务有限公司 具有视觉检查系统的零件制造机器
CN112427911B (zh) * 2020-12-02 2024-04-30 中国工程物理研究院机械制造工艺研究所 高精度装配系统及装配方法
CN112676831B (zh) * 2020-12-11 2025-04-04 苏州富晶微精密电子科技有限公司 一种镜头组件组装设备
CN113910209A (zh) * 2021-11-02 2022-01-11 南京航空航天大学 一种多源传感阵列天线自适应智能装配系统及方法
CN114828445B (zh) * 2022-05-24 2023-09-15 苏州创阈星智能科技有限公司 一种安装设备
CN115635474A (zh) * 2022-11-01 2023-01-24 中国工程物理研究院激光聚变研究中心 一种应用于批量微装配的在线检测系统
CN115682934A (zh) * 2022-11-01 2023-02-03 中国工程物理研究院激光聚变研究中心 一种跨尺度微纳器件装配的显微视觉检测装置和标定方法
CN115771023B (zh) * 2022-11-24 2024-04-02 臻越自动化技术（上海）有限公司 一种具有检测功能的卡扣安装机构
CN116140996B (zh) * 2023-02-23 2025-07-04 深圳双十科技股份有限公司 一种vcm底座的全自动组装设备及其组装方法
CN117444569B (zh) * 2023-11-09 2025-12-12 中船鹏力(南京)智能装备系统有限公司 一种空调压缩机脚垫自动无序安装设备及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2691603A1 (fr) * 1992-05-22 1993-11-26 Nokia Consumer Electronics Fra Machine d'insertion de composants notamment électroniques sur des plaques de circuits imprimés.
DE10296993T5 (de) * 2001-08-08 2004-08-05 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung und Verfahren zum Montieren elektronischer Bauteile
JP2004071625A (ja) * 2002-08-01 2004-03-04 Matsushita Electric Ind Co Ltd 部品装着用認識マーク認識装置及び方法
CN201115328Y (zh) * 2007-09-28 2008-09-10 比亚迪股份有限公司 自动装配机
EP3007538B8 (en) * 2013-06-07 2018-11-14 FUJI Corporation Electronic apparatus assembling machine and similar assembling machines
EP3128824B1 (en) * 2014-04-02 2019-01-02 FUJI Corporation Component mounting machine
CN105621071B (zh) * 2014-10-31 2019-10-01 泰科电子(上海)有限公司 自动备料系统

Also Published As

Publication number Publication date
EP3478047A1 (en) 2019-05-01
EP3478047B1 (en) 2021-02-24
CN109714943B (zh) 2020-12-29
US11134600B2 (en) 2021-09-28
US20190124807A1 (en) 2019-04-25
CN109714943A (zh) 2019-05-03

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