PL3513422T3 - Urządzenie do powlekania podłoży z drutu za pomocą plazmy po wyładowaniu - Google Patents

Urządzenie do powlekania podłoży z drutu za pomocą plazmy po wyładowaniu

Info

Publication number
PL3513422T3
PL3513422T3 PL17762144T PL17762144T PL3513422T3 PL 3513422 T3 PL3513422 T3 PL 3513422T3 PL 17762144 T PL17762144 T PL 17762144T PL 17762144 T PL17762144 T PL 17762144T PL 3513422 T3 PL3513422 T3 PL 3513422T3
Authority
PL
Poland
Prior art keywords
post
coating device
discharge plasma
plasma coating
wired substrates
Prior art date
Application number
PL17762144T
Other languages
English (en)
Inventor
Simon BULOU
Patrick Choquet
Thomas GAULAIN
Mathieu GERARD
Original Assignee
Luxembourg Institute Of Science And Technology (List)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxembourg Institute Of Science And Technology (List) filed Critical Luxembourg Institute Of Science And Technology (List)
Publication of PL3513422T3 publication Critical patent/PL3513422T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
PL17762144T 2016-09-15 2017-09-08 Urządzenie do powlekania podłoży z drutu za pomocą plazmy po wyładowaniu PL3513422T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
LU93222A LU93222B1 (en) 2016-09-15 2016-09-15 Post-discharge plasma coating device for wired substrates
PCT/EP2017/072635 WO2018050562A1 (en) 2016-09-15 2017-09-08 Post-discharge plasma coating device for wired substrates
EP17762144.8A EP3513422B1 (en) 2016-09-15 2017-09-08 Post-discharge plasma coating device for wired substrates

Publications (1)

Publication Number Publication Date
PL3513422T3 true PL3513422T3 (pl) 2021-02-08

Family

ID=57178454

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17762144T PL3513422T3 (pl) 2016-09-15 2017-09-08 Urządzenie do powlekania podłoży z drutu za pomocą plazmy po wyładowaniu

Country Status (7)

Country Link
US (1) US11756770B2 (pl)
EP (1) EP3513422B1 (pl)
JP (1) JP7075666B2 (pl)
ES (1) ES2808116T3 (pl)
LU (1) LU93222B1 (pl)
PL (1) PL3513422T3 (pl)
WO (1) WO2018050562A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7510037B2 (ja) * 2019-08-06 2024-07-03 ザ ロイヤル インスティテューション フォー ザ アドバンスメント オブ ラーニング／マクギル ユニバーシティ 変換可能なプラズマ源および方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7737382B2 (en) * 2004-04-01 2010-06-15 Lincoln Global, Inc. Device for processing welding wire
KR20060098740A (ko) * 2005-03-07 2006-09-19 삼성전자주식회사 플라즈마 장치와 그를 이용한 광섬유 모재 제작 장치
JP4862193B2 (ja) * 2006-07-24 2012-01-25 古河電気工業株式会社 半導体膜形成装置、半導体膜形成方法、及び半導体膜付き線条体
CA2659298C (en) * 2006-07-31 2012-03-06 Tekna Plasma Systems Inc. Plasma surface treatment using dielectric barrier discharges
US9288886B2 (en) * 2008-05-30 2016-03-15 Colorado State University Research Foundation Plasma-based chemical source device and method of use thereof
US8994270B2 (en) * 2008-05-30 2015-03-31 Colorado State University Research Foundation System and methods for plasma application
TWI432228B (zh) * 2010-09-07 2014-04-01 Univ Nat Cheng Kung 微電漿產生裝置及其滅菌系統
DE102012104224A1 (de) * 2012-05-15 2013-11-21 Plasmatreat Gmbh Vorrichtung und Verfahren zur Behandlung eines Drahts aus leitfähigem Material
WO2014191012A1 (de) 2013-05-27 2014-12-04 Plasmatreat Gmbh Vorrichtung und verfahren zur behandlung eines drahts aus leitfähigem material

Also Published As

Publication number Publication date
US20190259577A1 (en) 2019-08-22
EP3513422B1 (en) 2020-04-29
LU93222B1 (en) 2018-04-11
ES2808116T3 (es) 2021-02-25
EP3513422A1 (en) 2019-07-24
JP2019529700A (ja) 2019-10-17
US11756770B2 (en) 2023-09-12
JP7075666B2 (ja) 2022-05-26
WO2018050562A1 (en) 2018-03-22

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