PL3529829T3 - Sposób i urządzenie do obróbki - Google Patents

Sposób i urządzenie do obróbki

Info

Publication number
PL3529829T3
PL3529829T3 PL17787030T PL17787030T PL3529829T3 PL 3529829 T3 PL3529829 T3 PL 3529829T3 PL 17787030 T PL17787030 T PL 17787030T PL 17787030 T PL17787030 T PL 17787030T PL 3529829 T3 PL3529829 T3 PL 3529829T3
Authority
PL
Poland
Prior art keywords
machining apparatus
machining
Prior art date
Application number
PL17787030T
Other languages
English (en)
Inventor
Massimiliano SALE
Original Assignee
Manz Italy S.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manz Italy S.R.L. filed Critical Manz Italy S.R.L.
Publication of PL3529829T3 publication Critical patent/PL3529829T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/006—Feeding elongated articles, such as tubes, bars, or profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Press Drives And Press Lines (AREA)
  • Shearing Machines (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Secondary Cells (AREA)
  • Control Of Presses (AREA)
PL17787030T 2016-10-19 2017-10-13 Sposób i urządzenie do obróbki PL3529829T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102016000105300A IT201600105300A1 (it) 2016-10-19 2016-10-19 Metodo e apparato di lavorazione
PCT/IB2017/056358 WO2018073709A1 (en) 2016-10-19 2017-10-13 Method and machining apparatus
EP17787030.0A EP3529829B1 (en) 2016-10-19 2017-10-13 Method and machining apparatus

Publications (1)

Publication Number Publication Date
PL3529829T3 true PL3529829T3 (pl) 2020-12-28

Family

ID=58054405

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17787030T PL3529829T3 (pl) 2016-10-19 2017-10-13 Sposób i urządzenie do obróbki

Country Status (9)

Country Link
US (1) US20190255591A1 (pl)
EP (1) EP3529829B1 (pl)
JP (1) JP2020500109A (pl)
KR (1) KR20190064620A (pl)
CN (1) CN109844926A (pl)
HU (1) HUE052217T2 (pl)
IT (1) IT201600105300A1 (pl)
PL (1) PL3529829T3 (pl)
WO (1) WO2018073709A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112607497A (zh) * 2020-12-07 2021-04-06 机械工业第九设计研究院有限公司 撕胶带机构

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523142B1 (pl) * 1969-04-19 1977-01-26
JP3164863B2 (ja) * 1991-12-06 2001-05-14 株式会社アマダ 形鋼の穴明け・切断装置
US5277571A (en) * 1992-07-17 1994-01-11 George Schmitt & Co., Inc. Apparatus for perforation of a sheet material
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
JPH09108898A (ja) * 1995-10-18 1997-04-28 Orii Corp コイル材の自動加工装置
US6739447B2 (en) * 2002-03-06 2004-05-25 Jan Josef Verhaeghe Multi-cell reciprocating conveyor slat and method of manufacture and non-continuous guide structure
EP1587138B1 (de) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
JP4935575B2 (ja) * 2006-12-11 2012-05-23 日産自動車株式会社 トリミング装置およびトリミング方法
EP2008749B1 (en) * 2007-06-27 2011-08-10 Sica S.P.A. Method for cutting a continuously extruded tube into segments of lesser and predetermined length
WO2011045551A1 (en) * 2009-10-13 2011-04-21 M-Solv Ltd Apparatus and method for processing long, continuous flexible substrates
JP5654831B2 (ja) * 2010-10-18 2015-01-14 株式会社セーコウ 穿孔装置及びこれを備えた画像形成装置
KR101271492B1 (ko) * 2010-12-02 2013-06-05 주식회사 엘지화학 신규한 전극시트 커팅 장치 및 이를 사용하여 생산되는 이차전지
KR101326630B1 (ko) * 2010-12-02 2013-11-07 주식회사 엘지화학 신규한 노칭 장치 및 이를 사용하여 생산되는 이차전지
IT1403981B1 (it) * 2011-02-17 2013-11-08 Kemet Electronics Italia S R L Apparato di taglio
JP5361967B2 (ja) * 2011-09-28 2013-12-04 三星ダイヤモンド工業株式会社 基板の溝加工ツール
JP2013179035A (ja) * 2012-01-31 2013-09-09 Nissan Motor Co Ltd 非双極型電池の製造方法、および非双極型電池の製造装置
JP5796525B2 (ja) * 2012-03-28 2015-10-21 三菱マテリアル株式会社 電池用電極のプレス方法及びそのプレス装置
JP2016021560A (ja) * 2014-06-20 2016-02-04 株式会社半導体エネルギー研究所 剥離装置
CN105537445B (zh) * 2016-02-29 2017-12-12 长江大学 一种自动连续冲压全程自动化设备

Also Published As

Publication number Publication date
EP3529829B1 (en) 2020-08-12
EP3529829A1 (en) 2019-08-28
HUE052217T2 (hu) 2021-04-28
JP2020500109A (ja) 2020-01-09
US20190255591A1 (en) 2019-08-22
WO2018073709A1 (en) 2018-04-26
IT201600105300A1 (it) 2018-04-19
KR20190064620A (ko) 2019-06-10
CN109844926A (zh) 2019-06-04

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