PL354095A1 - Układ czujnika krzemowegoUkład czujnika krzemowego - Google Patents

Układ czujnika krzemowegoUkład czujnika krzemowego

Info

Publication number
PL354095A1
PL354095A1 PL00354095A PL35409500A PL354095A1 PL 354095 A1 PL354095 A1 PL 354095A1 PL 00354095 A PL00354095 A PL 00354095A PL 35409500 A PL35409500 A PL 35409500A PL 354095 A1 PL354095 A1 PL 354095A1
Authority
PL
Poland
Prior art keywords
microphone
silicon
surface mount
different elements
sensor system
Prior art date
Application number
PL00354095A
Other languages
English (en)
Other versions
PL209935B1 (pl
Inventor
MatthiasMullenborn Matthias Mullenborn
Peter U.Scheel Peter U. Scheel
Jochen F.Kuhmann Jochen F. Kuhmann
Original Assignee
Sonionmems A/Ssonionmems A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Sonionmems A/Ssonionmems A/S filed Critical Sonionmems A/Ssonionmems A/S
Publication of PL354095A1 publication Critical patent/PL354095A1/pl
Publication of PL209935B1 publication Critical patent/PL209935B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Air Bags (AREA)
  • Silicon Polymers (AREA)
PL354095A 1999-09-06 2000-09-06 Układ czujnika na bazie krzemu do mikrofonu PL209935B1 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system

Publications (2)

Publication Number Publication Date
PL354095A1 true PL354095A1 (pl) 2003-12-29
PL209935B1 PL209935B1 (pl) 2011-11-30

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
PL354095A PL209935B1 (pl) 1999-09-06 2000-09-06 Układ czujnika na bazie krzemu do mikrofonu

Country Status (10)

Country Link
EP (1) EP1214864B1 (pl)
JP (2) JP4459498B2 (pl)
CN (1) CN1203726C (pl)
AT (1) ATE242587T1 (pl)
AU (1) AU6984100A (pl)
CA (1) CA2383740C (pl)
DE (1) DE60003199T2 (pl)
DK (1) DK1214864T3 (pl)
PL (1) PL209935B1 (pl)
WO (1) WO2001019134A2 (pl)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
CN100515119C (zh) * 2003-08-12 2009-07-15 中国科学院声学研究所 一种用于硅微电容传声器中的芯片及其制备方法
CN100499877C (zh) * 2003-12-17 2009-06-10 中国科学院声学研究所 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP4553611B2 (ja) 2004-03-15 2010-09-29 三洋電機株式会社 回路装置
DE102004051468A1 (de) * 2004-10-22 2006-04-27 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
DE102005008512B4 (de) * 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005056759A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
CN101005718B (zh) * 2006-01-16 2011-04-20 财团法人工业技术研究院 微型声学传感器及其制造方法
JP4771290B2 (ja) * 2006-07-19 2011-09-14 ヤマハ株式会社 圧力センサの製造方法
WO2008077517A1 (en) * 2006-12-22 2008-07-03 Sonion Mems A/S Microphone assembly with underfill agent having a low coefficient of thermal expansion
JP4893380B2 (ja) * 2007-03-09 2012-03-07 ヤマハ株式会社 コンデンサマイク装置
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体センサ装置
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (zh) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 具有多个换能器元件的传声器
US20100303274A1 (en) * 2009-05-18 2010-12-02 William Ryan Microphone Having Reduced Vibration Sensitivity
KR101609270B1 (ko) 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
DE102009047592B4 (de) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Verfahren zur Herstellung eines Siliziumzwischenträgers
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP2013093637A (ja) * 2010-02-24 2013-05-16 Panasonic Corp 半導体装置及びその製造方法
TWI491009B (zh) 2010-10-08 2015-07-01 環旭電子股份有限公司 晶片級電磁干擾屏蔽結構及製造方法
CN102456669B (zh) * 2010-10-25 2015-07-22 环旭电子股份有限公司 芯片级电磁干扰屏蔽结构及制造方法
WO2012088688A1 (en) * 2010-12-30 2012-07-05 Goertek Inc. A mems microphone and method for packaging the same
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
JP5799619B2 (ja) 2011-06-24 2015-10-28 船井電機株式会社 マイクロホンユニット
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (de) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
JP6426620B2 (ja) * 2012-12-18 2018-11-21 Tdk株式会社 トップポートｍｅｍｓマイクロフォン及びその製造方法
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (it) 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9264832B2 (en) * 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2538177B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
WO2016043738A1 (en) * 2014-09-17 2016-03-24 Intel Corporation DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
CN104780490A (zh) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 一种mems麦克风的封装结构及其制造方法
TWI660466B (zh) * 2017-04-26 2019-05-21 Siliconware Precision Industries Co., Ltd. 封裝結構及其製法
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Also Published As

Publication number Publication date
DE60003199D1 (de) 2003-07-10
CA2383740C (en) 2005-04-05
JP4303742B2 (ja) 2009-07-29
EP1214864A2 (en) 2002-06-19
CN1203726C (zh) 2005-05-25
EP1214864B1 (en) 2003-06-04
DK1214864T3 (da) 2003-08-25
JP2003508998A (ja) 2003-03-04
AU6984100A (en) 2001-04-10
CN1387741A (zh) 2002-12-25
CA2383740A1 (en) 2001-03-15
DE60003199T2 (de) 2004-07-01
ATE242587T1 (de) 2003-06-15
WO2001019134A2 (en) 2001-03-15
JP2007028671A (ja) 2007-02-01
JP4459498B2 (ja) 2010-04-28
PL209935B1 (pl) 2011-11-30
WO2001019134A3 (en) 2001-09-07

Similar Documents

Publication Publication Date Title
PL354095A1 (pl) Układ czujnika krzemowegoUkład czujnika krzemowego
US6522762B1 (en) Silicon-based sensor system
DK1219136T3 (da) Tryktransducer
TW200707606A (en) Method of manufacturing an assembly and assembly
AU2002331046A1 (en) Apparatus with compliant electrical terminals, and methods for forming same
SG170618A1 (en) Polymeric oligonucleotide prodrugs
EP1523229A3 (en) Assembly of an electronic component with spring packaging
EP1187204A3 (en) Circuit device and method of manufacturing the same
WO2003067646A3 (de) Halbleitersubstrat mit einem elektrisch isolierten bereich, insbesondere zur vertikalintegration
EP2112488A3 (en) Pressure sensor module and electronic component
WO2006094025A3 (en) Fabricated adhesive microstructures for making an electrical connection
TW200610110A (en) LSI package possessing interface function with exterior, circuit device including the same, and manufacturing method of circuit device
TW200501838A (en) Hybrid integrated circuit device
WO2001088983A3 (de) Leistungshalbleitermodul
WO2006005304A3 (de) Halbleiterbauteil mit einem halbleiterchip und elektrischen verbindungselementen zu einer leiterstruktur
WO2006061792A3 (en) Hermetically sealed integrated circuit package
US10299046B2 (en) MEMS microphone package
EP1367643A3 (en) Electronic module
WO2001097285A3 (de) Elektronisches bauteil aus einem gehäuse und einem substrat
WO2003012930A3 (en) Electric contact and contact element of silicone for fixing an antenna to a circuit card
ATE299295T1 (de) Verfahren zur herstellung elektrisch leitender verbindungen
WO2003059029A3 (de) Integriertes sensormodul und verfahren zu seiner herstellung
TW200511523A (en) Process for fabricating narrow thickness electronic components
SE9804509L (sv) Trådbondningskompensering
DE10345464A1 (de) Multichip-Gehäuse

Legal Events

Date Code Title Description
RECP Rectifications of patent specification