PL3580767T3 - Urządzenie grzejne i/lub chłodzące do ciała stałego lub strumienia płynu - Google Patents

Urządzenie grzejne i/lub chłodzące do ciała stałego lub strumienia płynu

Info

Publication number
PL3580767T3
PL3580767T3 PL18707236.8T PL18707236T PL3580767T3 PL 3580767 T3 PL3580767 T3 PL 3580767T3 PL 18707236 T PL18707236 T PL 18707236T PL 3580767 T3 PL3580767 T3 PL 3580767T3
Authority
PL
Poland
Prior art keywords
heating
fluid flow
cooling apparatus
solid body
solid
Prior art date
Application number
PL18707236.8T
Other languages
English (en)
Inventor
Ingo Brexeler
Original Assignee
Gebr. Krallmann Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebr. Krallmann Gmbh filed Critical Gebr. Krallmann Gmbh
Publication of PL3580767T3 publication Critical patent/PL3580767T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL18707236.8T 2017-02-08 2018-02-07 Urządzenie grzejne i/lub chłodzące do ciała stałego lub strumienia płynu PL3580767T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017001461.2A DE102017001461A1 (de) 2017-02-08 2017-02-08 Heiz- und/oder Kühlvorrichtung für einen Festkörper oder einen Fluidstrom
PCT/EP2018/000052 WO2018145811A1 (de) 2017-02-08 2018-02-07 Heiz- und/oder kühlvorrichtung für einen festkörper oder einen fluidstrom

Publications (1)

Publication Number Publication Date
PL3580767T3 true PL3580767T3 (pl) 2022-12-19

Family

ID=61283154

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18707236.8T PL3580767T3 (pl) 2017-02-08 2018-02-07 Urządzenie grzejne i/lub chłodzące do ciała stałego lub strumienia płynu

Country Status (7)

Country Link
US (1) US20200035385A1 (pl)
EP (1) EP3580767B1 (pl)
CN (1) CN110383399A (pl)
DE (1) DE102017001461A1 (pl)
ES (1) ES2926236T3 (pl)
PL (1) PL3580767T3 (pl)
WO (1) WO2018145811A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1027857B1 (de) * 2019-12-13 2021-07-14 Phoenix Contact Gmbh & Co Vorrichtung zur thermischen belastung
EP4467934A1 (en) 2023-05-23 2024-11-27 Aptiv Technologies AG A sensor housing for a sensor module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3146600A (en) * 1962-05-28 1964-09-01 Whirlpool Co Thermoelectric immersion cooler
EP0262243B1 (de) * 1986-10-01 1991-02-20 David & Baader DBK Spezialfabrik elektrischer Apparate und Heizwiderstände GmbH Kaltleiter-PTC-Heizkörper
DE8905769U1 (de) * 1989-05-09 1989-07-13 Schulte, Franz-Josef, Dipl.-Ing., 59939 Olsberg Gerät zur Erzeugung von Kälte und Wärme
JP2698318B2 (ja) * 1993-08-20 1998-01-19 ティーディーケイ株式会社 ヒータ
BE1010730A7 (nl) * 1996-11-04 1998-12-01 Pira Luc Louis Marie Francis Cryoprobe op basis van peltier module.
WO2003046463A2 (en) * 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
US20060055500A1 (en) * 2002-12-11 2006-03-16 Bourns, Inc Encapsulated conductive polymer device and method of manufacturing the same
JP4055728B2 (ja) * 2004-03-19 2008-03-05 トヨタ自動車株式会社 排熱回収装置
US20100281884A1 (en) * 2009-01-22 2010-11-11 John Myron Rawski Thermoelectric Management Unit
EP2211589A1 (de) * 2009-01-23 2010-07-28 Behr GmbH & Co. KG Wärmeübertrager
DE102009058673A1 (de) * 2009-12-16 2011-06-22 Behr GmbH & Co. KG, 70469 Thermoelektrischer Wärmetauscher
DE202010002010U1 (de) * 2010-02-05 2010-05-06 Berthold Technologies Gmbh & Co. Kg Messvorrichtung zur Messung von Biolumineszenz, Chemolumineszenz oder Fluoreszenz von Objekten, Bestrahlungsvorrichtung und Messsystem
GB2481217B (en) * 2010-06-15 2017-06-07 Otter Controls Ltd Thick film heaters
DE202010011016U1 (de) * 2010-08-04 2011-10-10 Ingo Schehr Elektrisches Heizmodul mit PTC-Element zum elektrischen Erwärmen eines Luftstroms
WO2015100591A1 (en) * 2013-12-31 2015-07-09 Gentherm Automotive Systems (China) Ltd. Ventilation system
US10358778B2 (en) * 2015-02-06 2019-07-23 Michael Gregory Theodore, Jr. Temperature controlled structure assembly
DE102015114043B4 (de) * 2015-08-25 2018-10-04 Biflow Systems Gmbh Temperiervorrichtung

Also Published As

Publication number Publication date
US20200035385A1 (en) 2020-01-30
WO2018145811A1 (de) 2018-08-16
EP3580767B1 (de) 2022-06-08
DE102017001461A1 (de) 2018-08-09
EP3580767A1 (de) 2019-12-18
CN110383399A (zh) 2019-10-25
ES2926236T3 (es) 2022-10-24

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