PL3703477T3 - System odprowadzania ciepła do obudowy sprzętu obliczeniowego - Google Patents

System odprowadzania ciepła do obudowy sprzętu obliczeniowego

Info

Publication number
PL3703477T3
PL3703477T3 PL19315014T PL19315014T PL3703477T3 PL 3703477 T3 PL3703477 T3 PL 3703477T3 PL 19315014 T PL19315014 T PL 19315014T PL 19315014 T PL19315014 T PL 19315014T PL 3703477 T3 PL3703477 T3 PL 3703477T3
Authority
PL
Poland
Prior art keywords
computing equipment
extraction system
heat extraction
equipment enclosure
enclosure
Prior art date
Application number
PL19315014T
Other languages
English (en)
Inventor
Henryk KLABA
Ali Chehade
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Publication of PL3703477T3 publication Critical patent/PL3703477T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL19315014T 2019-02-28 2019-02-28 System odprowadzania ciepła do obudowy sprzętu obliczeniowego PL3703477T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19315014.1A EP3703477B1 (en) 2019-02-28 2019-02-28 Heat extraction system for a computing equipment enclosure

Publications (1)

Publication Number Publication Date
PL3703477T3 true PL3703477T3 (pl) 2022-02-14

Family

ID=65904355

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19315014T PL3703477T3 (pl) 2019-02-28 2019-02-28 System odprowadzania ciepła do obudowy sprzętu obliczeniowego

Country Status (5)

Country Link
US (1) US11089720B2 (pl)
EP (1) EP3703477B1 (pl)
CN (1) CN111625066B (pl)
DK (1) DK3703477T3 (pl)
PL (1) PL3703477T3 (pl)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6813197B2 (ja) * 2019-04-26 2021-01-13 Ｎｅｃプラットフォームズ株式会社 放熱構造体
US11672105B2 (en) * 2020-01-16 2023-06-06 Meta Platforms, Inc. Data center cooling using a heat pipe
CN112672620B (zh) * 2021-01-11 2024-01-30 华为数字能源技术有限公司 一种制冷设备及数据中心
CN112788928B (zh) * 2021-02-03 2024-11-15 北京遥感设备研究所 一种紧凑型三维均温控温机箱
US12120847B1 (en) * 2021-03-23 2024-10-15 Engendren LLC Container for one or more electronic devices and methods of use thereof
CN113175714B (zh) * 2021-04-30 2022-08-05 西藏宁算科技集团有限公司 蒸发冷却机组及控制方法、控制装置和可读存储介质
CN216698514U (zh) * 2021-09-26 2022-06-07 华为数字能源技术有限公司 储能系统
US12309962B2 (en) * 2022-03-21 2025-05-20 International Business Machines Corporation Configurable multi-chip module heatsink for selective dissipation of heat
CN117734482B (zh) * 2024-02-21 2024-04-30 江苏鼎集智能科技股份有限公司 一种充电桩智能温控系统
CN118338582B (zh) * 2024-06-07 2024-08-23 常州思瑞电力科技有限公司 一种用于光伏电站的智能保护通讯一体机

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US5579830A (en) 1995-11-28 1996-12-03 Hudson Products Corporation Passive cooling of enclosures using heat pipes
US20030094266A1 (en) * 2001-11-21 2003-05-22 Fritsch Brian D. Cabinet having heat exchanger integrally installed between roof and solar shield
CN2856809Y (zh) * 2005-12-26 2007-01-10 杭州中信网络自动化有限公司 机房空调系统用热管换热节能装置
US20100186820A1 (en) * 2008-11-10 2010-07-29 Schon Steven G Solar electricity generation with improved efficiency
CN101539323A (zh) * 2009-04-10 2009-09-23 贵州贵航汽车零部件股份有限公司永红散热器公司 热管冷却系统与空调设备自动切换方法及装置
JP2011220633A (ja) * 2010-04-12 2011-11-04 Fujikura Ltd データセンタの冷却装置
US9271429B2 (en) * 2010-04-12 2016-02-23 Fujikura Ltd. Cooling device, cooling system, and auxiliary cooling device for datacenter
JP2012190884A (ja) * 2011-03-09 2012-10-04 Panasonic Corp ラック型電子機器の冷却装置
CN102355807A (zh) * 2011-07-29 2012-02-15 上海威特力热管散热器有限公司 通信数据机房用热管式换热系统及其热交换方法
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
TWI458924B (zh) * 2011-12-08 2014-11-01 Chunghwa Telecom Co Ltd Energy Saving Device and Method of Air Cooling in Room
US8964373B2 (en) * 2011-12-16 2015-02-24 Paul F. Rembach System for cooling buildings containing heat generating electronics
CN202452867U (zh) * 2012-02-23 2012-09-26 朱建斌 智能热管换热器
EP2974574B1 (en) * 2013-03-15 2020-09-23 Zonit Structured Solutions, LLC Modular data center cooling
KR101276380B1 (ko) * 2013-04-26 2013-06-18 (주)써모텍 히트파이프를 이용한 데이터 센터의 공조 시스템 및 이의 제어방법
US9405335B1 (en) * 2014-02-21 2016-08-02 Google Inc. Heat pipe cooling arrangement
JP2016061483A (ja) * 2014-09-17 2016-04-25 新日鉄住金エンジニアリング株式会社 冷却用箱体とこれを備えたコンテナ型データセンター
US20160338230A1 (en) * 2015-05-12 2016-11-17 Advanced Micro Devices, Inc. Control of thermal energy transfer for phase change material in data center
CN204968334U (zh) * 2015-10-12 2016-01-13 讯凯国际股份有限公司 散热系统
JP6808384B2 (ja) * 2016-07-11 2021-01-06 中部抵抗器株式会社 ヒートパイプ式の熱交換装置
CN107072122A (zh) * 2017-06-07 2017-08-18 苏州安瑞可机柜系统有限公司 一种模块化数据中心
US10806056B2 (en) * 2017-07-19 2020-10-13 Hewlett Packard Enterprise Development Lp Cooling system for high-performance computer

Also Published As

Publication number Publication date
CN111625066A (zh) 2020-09-04
EP3703477B1 (en) 2021-11-17
EP3703477A1 (en) 2020-09-02
CN111625066B (zh) 2022-09-23
US20200281099A1 (en) 2020-09-03
US11089720B2 (en) 2021-08-10
DK3703477T3 (da) 2022-01-03

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