PL3705978T3 - Struktura rozpraszająca ciepło - Google Patents

Struktura rozpraszająca ciepło

Info

Publication number
PL3705978T3
PL3705978T3 PL20160941.9T PL20160941T PL3705978T3 PL 3705978 T3 PL3705978 T3 PL 3705978T3 PL 20160941 T PL20160941 T PL 20160941T PL 3705978 T3 PL3705978 T3 PL 3705978T3
Authority
PL
Poland
Prior art keywords
heat dissipation
dissipation structure
heat
dissipation
Prior art date
Application number
PL20160941.9T
Other languages
English (en)
Inventor
Chun-Chieh Wong
Cheng-Yu Wang
Original Assignee
Asustek Computer Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asustek Computer Inc. filed Critical Asustek Computer Inc.
Publication of PL3705978T3 publication Critical patent/PL3705978T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL20160941.9T 2019-03-04 2020-03-04 Struktura rozpraszająca ciepło PL3705978T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108202567U TWM579819U (zh) 2019-03-04 2019-03-04 散熱結構

Publications (1)

Publication Number Publication Date
PL3705978T3 true PL3705978T3 (pl) 2023-08-07

Family

ID=67703454

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20160941.9T PL3705978T3 (pl) 2019-03-04 2020-03-04 Struktura rozpraszająca ciepło

Country Status (4)

Country Link
US (1) US11172594B2 (pl)
EP (1) EP3705978B1 (pl)
PL (1) PL3705978T3 (pl)
TW (1) TWM579819U (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115551174A (zh) * 2021-06-30 2022-12-30 微星科技股份有限公司 散热结构总成
JP7273116B2 (ja) * 2021-08-27 2023-05-12 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
CN114501961A (zh) * 2022-03-21 2022-05-13 联想(北京)有限公司 电子设备及其制备方法
WO2024073430A1 (en) * 2022-09-28 2024-04-04 Cisco Technology, Inc. Heatsink for ring type integrated circuits
TWI850991B (zh) * 2023-01-30 2024-08-01 宏碁股份有限公司 電子封裝模組

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561590A (en) 1995-09-21 1996-10-01 Unisys Corporation Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention
KR100446290B1 (ko) * 2001-11-03 2004-09-01 삼성전자주식회사 댐을 포함하는 반도체 패키지 및 그 제조방법
US7218000B2 (en) * 2003-06-27 2007-05-15 Intel Corporation Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7268428B2 (en) 2005-07-19 2007-09-11 International Business Machines Corporation Thermal paste containment for semiconductor modules
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
CA2676495C (en) * 2009-08-24 2014-04-08 Ibm Canada Limited - Ibm Canada Limitee Mechanical barrier element for improved thermal reliability of electronic components
US9210832B2 (en) * 2012-08-13 2015-12-08 Asustek Computer Inc. Thermal buffering element
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
FR3023975A1 (fr) 2014-07-18 2016-01-22 Thales Sa Dispositif d'interface thermique avec joint microporeux capable d'empecher la migration de graisse thermique
US10399190B2 (en) * 2014-08-08 2019-09-03 Dell Products, L.P. Liquid-vapor phase change thermal interface material
JP6320332B2 (ja) * 2015-03-10 2018-05-09 東芝メモリ株式会社 電子機器
US10049896B2 (en) * 2015-12-09 2018-08-14 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
CN106455427B (zh) 2016-09-29 2019-03-05 努比亚技术有限公司 一种移动终端
CN106413371A (zh) 2016-11-30 2017-02-15 依偎科技（南昌）有限公司 移动终端及其制备方法

Also Published As

Publication number Publication date
EP3705978A1 (en) 2020-09-09
EP3705978B1 (en) 2023-04-05
US20200288604A1 (en) 2020-09-10
US11172594B2 (en) 2021-11-09
TWM579819U (zh) 2019-06-21

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