PL371162A1 - Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi - Google Patents

Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi

Info

Publication number
PL371162A1
PL371162A1 PL371162A PL37116204A PL371162A1 PL 371162 A1 PL371162 A1 PL 371162A1 PL 371162 A PL371162 A PL 371162A PL 37116204 A PL37116204 A PL 37116204A PL 371162 A1 PL371162 A1 PL 371162A1
Authority
PL
Poland
Prior art keywords
pcb board
air circulation
forced air
forced
circulation
Prior art date
Application number
PL371162A
Other languages
English (en)
Other versions
PL193094B1 (pl
Inventor
Zbigniew Wabiszczewicz
Original Assignee
Advanced Digital Broadcast Ltd.
Advanced Digital Broadcast Polska Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Digital Broadcast Ltd., Advanced Digital Broadcast Polska Spółka Z Ograniczoną Odpowiedzialnością filed Critical Advanced Digital Broadcast Ltd.
Priority to PL371162A priority Critical patent/PL193094B1/pl
Priority to US10/908,670 priority patent/US7248471B2/en
Publication of PL371162A1 publication Critical patent/PL371162A1/pl
Publication of PL193094B1 publication Critical patent/PL193094B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL371162A 2004-11-15 2004-11-15 Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi PL193094B1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL371162A PL193094B1 (pl) 2004-11-15 2004-11-15 Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi
US10/908,670 US7248471B2 (en) 2004-11-15 2005-05-22 PCB with forced airflow and device provided with PCB with forced airflow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL371162A PL193094B1 (pl) 2004-11-15 2004-11-15 Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi

Publications (2)

Publication Number Publication Date
PL371162A1 true PL371162A1 (pl) 2006-05-29
PL193094B1 PL193094B1 (pl) 2007-01-31

Family

ID=36386032

Family Applications (1)

Application Number Title Priority Date Filing Date
PL371162A PL193094B1 (pl) 2004-11-15 2004-11-15 Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi

Country Status (2)

Country Link
US (1) US7248471B2 (pl)
PL (1) PL193094B1 (pl)

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JP6511973B2 (ja) * 2015-06-08 2019-05-15 住友電気工業株式会社 電子機器
US20170099746A1 (en) * 2015-10-01 2017-04-06 Microsoft Technology Licensing, Llc Layered airflow cooling for electronic components
CN106646871B (zh) * 2016-10-20 2024-03-12 深圳纳德光学有限公司 一种带有散热系统的头戴显示器
JP2018113406A (ja) * 2017-01-13 2018-07-19 アルパイン株式会社 電子機器
CN107239120B (zh) 2017-05-18 2021-11-30 北京嘉楠捷思信息技术有限公司 一种电子设备
CN109121356B (zh) * 2017-06-26 2021-11-12 中兴通讯股份有限公司 一种风扇控制板及风扇插箱
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CN119947054B (zh) * 2024-09-04 2025-08-22 广州乐云智能科技有限公司 一种电子元件散热装置

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Also Published As

Publication number Publication date
PL193094B1 (pl) 2007-01-31
US20060104025A1 (en) 2006-05-18
US7248471B2 (en) 2007-07-24

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