PL371753A1 - Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0 - Google Patents

Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0

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Publication number
PL371753A1
PL371753A1 PL371753A PL37175304A PL371753A1 PL 371753 A1 PL371753 A1 PL 371753A1 PL 371753 A PL371753 A PL 371753A PL 37175304 A PL37175304 A PL 37175304A PL 371753 A1 PL371753 A1 PL 371753A1
Authority
PL
Poland
Prior art keywords
inxalyga1
layer
doped epitaxial
epitaxial layer
producing
Prior art date
Application number
PL371753A
Other languages
English (en)
Inventor
Czesław Skierbiszewski
Sylwester Porowski
Izabella Grzegory
Piotr Perlin
Michał Leszczyński
Marcin Siekacz
Anna Feduniewicz
Tadeusz Suski
Przemysław Wiśniewski
Michał Boćkowski
Original Assignee
Instytut Wysokich Ciśnień Polskiej Akademii Nauk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Wysokich Ciśnień Polskiej Akademii Nauk filed Critical Instytut Wysokich Ciśnień Polskiej Akademii Nauk
Priority to PL371753A priority Critical patent/PL371753A1/pl
Priority to EP05817699A priority patent/EP1829090A1/en
Priority to PCT/PL2005/000081 priority patent/WO2006065160A1/en
Publication of PL371753A1 publication Critical patent/PL371753A1/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/276—Lateral overgrowth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
PL371753A 2004-12-15 2004-12-15 Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0 PL371753A1 (pl)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PL371753A PL371753A1 (pl) 2004-12-15 2004-12-15 Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0
EP05817699A EP1829090A1 (en) 2004-12-15 2005-12-14 METHOD OF MANUFACTURING DOPED Inx AlyGa1-x-yN EPITAXIAL LAYERS, DOPED InxAlyGa1-x-yN EPITAXIAL LAYER AND SEMICONDUCTOR MULTI-LAYER STRUCTURE COMPRISING AT LEAST ONE DOPED InxALyGa1-x-yN EPITAXIAL LAYER, WHERE
PCT/PL2005/000081 WO2006065160A1 (en) 2004-12-15 2005-12-14 METHOD OF MANUFACTURING DOPED Inx AlyGa1-x-yN EPITAXIAL LAYERS, DOPED InxAlyGa1-x-yN EPITAXIAL LAYER AND SEMICONDUCTOR MULTI-LAYER STRUCTURE COMPRISING AT LEAST ONE DOPED InxALyGa1-x-yN EPITAXIAL LAYER, WHERE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL371753A PL371753A1 (pl) 2004-12-15 2004-12-15 Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0

Publications (1)

Publication Number Publication Date
PL371753A1 true PL371753A1 (pl) 2006-06-26

Family

ID=36051512

Family Applications (1)

Application Number Title Priority Date Filing Date
PL371753A PL371753A1 (pl) 2004-12-15 2004-12-15 Sposób wytwarzania domieszkowanych warstw epitaksjalnych InxAlyGa1-x-yN, domieszkowana warstwa epitaksjalna InxAlyGa1-x-yN i półprzewodnikowa struktura wielowarstwowa zawierająca warstwę epitaksjalną InxAlyGa1-x-yN, dla której 1 ˛ x > 0.001 a 0.999 ˛ y > 0

Country Status (3)

Country Link
EP (1) EP1829090A1 (pl)
PL (1) PL371753A1 (pl)
WO (1) WO2006065160A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL385048A1 (pl) * 2008-04-28 2009-11-09 Topgan Spółka Z Ograniczoną Odpowiedzialnością Sposób wytwarzania domieszkowanej magnezem warstwy epitaksjalnej InxAlyGa1-x-yN o przewodnictwie typu p, dla której )0 x 0,2 a 0 y 0,3 oraz półprzewodnikowych struktur wielowarstwowych zawierających taką warstwę epitaksjalną
CN120932760B (zh) * 2025-10-10 2025-12-16 新磊半导体科技(苏州)股份有限公司 一种分子束外延掺杂工艺参数的确定方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997013891A1 (en) * 1995-10-13 1997-04-17 Centrum Badan Wysokocisnieniowych METHOD OF MANUFACTURING EPITAXIAL LAYERS OF GaN OR Ga(A1,In)N ON SINGLE CRYSTAL GaN AND MIXED Ga(A1,In)N SUBSTRATES
JP4432180B2 (ja) * 1999-12-24 2010-03-17 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体の製造方法、ｉｉｉ族窒化物系化合物半導体素子及びｉｉｉ族窒化物系化合物半導体
US6447604B1 (en) * 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
JP2005508077A (ja) * 2001-10-22 2005-03-24 イェール ユニバーシティ 半導体材料のハイパードーピング方法、ハイパードープされた半導体材料、および、ハイパードープされた半導体装置
EP1502303B1 (en) * 2002-04-30 2011-12-21 Cree, Inc. High voltage switching devices and process for forming same

Also Published As

Publication number Publication date
WO2006065160A8 (en) 2006-11-02
WO2006065160A1 (en) 2006-06-22
EP1829090A1 (en) 2007-09-05

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