PL3778426T3 - Korpus opakowaniowy folii barierowej do urządzenia elektronicznego - Google Patents

Korpus opakowaniowy folii barierowej do urządzenia elektronicznego

Info

Publication number
PL3778426T3
PL3778426T3 PL19775738.8T PL19775738T PL3778426T3 PL 3778426 T3 PL3778426 T3 PL 3778426T3 PL 19775738 T PL19775738 T PL 19775738T PL 3778426 T3 PL3778426 T3 PL 3778426T3
Authority
PL
Poland
Prior art keywords
electronic device
barrier film
packaging body
packaging
barrier
Prior art date
Application number
PL19775738.8T
Other languages
English (en)
Inventor
Chiho SUGIURA
Yusuke Obu
Kenji Hayashi
Yutaka KAWAKUBO
Original Assignee
Toyo Seikan Group Holdings, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Seikan Group Holdings, Ltd. filed Critical Toyo Seikan Group Holdings, Ltd.
Publication of PL3778426T3 publication Critical patent/PL3778426T3/pl

Links

Classifications

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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Food Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Packaging Of Machine Parts And Wound Products (AREA)
  • Electroluminescent Light Sources (AREA)
PL19775738.8T 2018-03-30 2019-04-01 Korpus opakowaniowy folii barierowej do urządzenia elektronicznego PL3778426T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018069256A JP7135389B2 (ja) 2018-03-30 2018-03-30 電子デバイス用バリアフィルムの包装体
PCT/JP2019/014518 WO2019189931A1 (ja) 2018-03-30 2019-04-01 電子デバイス用バリアフィルムの包装体

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JP2019177645A (ja) * 2018-03-30 2019-10-17 東洋製罐グループホールディングス株式会社 電子デバイス用バリアフィルム
CN113725381A (zh) * 2021-08-05 2021-11-30 广东志慧芯屏科技有限公司 一种显示模组及制备方法
KR102683210B1 (ko) * 2022-12-27 2024-07-09 율촌화학 주식회사 셀 파우치 포장 구조물 및 그의 형성방법
WO2025221996A1 (en) * 2024-04-17 2025-10-23 Adept Materials, Inc. Multilayer structures for packaging

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JP2996047B2 (ja) * 1993-03-23 1999-12-27 東レ株式会社 フイルム巻層体の包装方法およびその方法により包装されたフイルム巻層体
JP4158265B2 (ja) 1999-03-10 2008-10-01 凸版印刷株式会社 プラスチック容器の製造方法及び容器
JP2002347713A (ja) * 2001-05-28 2002-12-04 Asahi Kasei Corp 吸湿性フィルムの包装方法
US8679604B2 (en) * 2009-01-20 2014-03-25 Curwood, Inc. Peelable film and package using same
EP2442975B1 (en) * 2009-06-16 2018-11-28 Pleotint, L.L.C. Method and constructions for moisture sensitive layers and structures having reduced moisture content in moisture sensitive layers
JP5471347B2 (ja) * 2009-11-19 2014-04-16 日立化成株式会社 回路部材接続用接着フィルム梱包体及びその製造方法
JP5376327B2 (ja) * 2010-01-18 2013-12-25 大日本印刷株式会社 吸湿性積層体
JP2014019056A (ja) * 2012-07-18 2014-02-03 Konica Minolta Inc フィルムロール梱包体およびその製造方法
JP6287288B2 (ja) * 2013-02-07 2018-03-07 東洋製罐グループホールディングス株式会社 水分バリア性に優れたガスバリア性積層体
JP6519974B2 (ja) * 2013-10-10 2019-05-29 東洋製罐グループホールディングス株式会社 水分バリア性の良好なガスバリア性積層体
JP2015178250A (ja) * 2014-03-19 2015-10-08 日立化成株式会社 シート状乾燥材と支持体付き接着フィルムとを重ねた積層体、及び支持体付き接着フィルムの保存方法
JP2017064708A (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 吸湿材料及びその製造方法、包装材料並びに包装物
TW201805351A (zh) * 2016-03-24 2018-02-16 味之素股份有限公司 薄膜捲筒捆包體以及其製造方法
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JP7110668B2 (ja) * 2018-03-29 2022-08-02 東洋製罐グループホールディングス株式会社 水分バリア性積層体

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EP3778426A1 (en) 2021-02-17
JP7135389B2 (ja) 2022-09-13
WO2019189931A1 (ja) 2019-10-03
TWI786284B (zh) 2022-12-11
KR20200128578A (ko) 2020-11-13
TW201945192A (zh) 2019-12-01
EP3778426B1 (en) 2025-11-19
CN111936394A (zh) 2020-11-13
US20210016986A1 (en) 2021-01-21
JP2019177934A (ja) 2019-10-17
EP3778426A4 (en) 2022-01-05
EP3778426C0 (en) 2025-11-19
KR102494886B1 (ko) 2023-02-06

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