PL382902A1 - Method and device for processing flat, fragile substrates - Google Patents

Method and device for processing flat, fragile substrates

Info

Publication number
PL382902A1
PL382902A1 PL382902A PL38290207A PL382902A1 PL 382902 A1 PL382902 A1 PL 382902A1 PL 382902 A PL382902 A PL 382902A PL 38290207 A PL38290207 A PL 38290207A PL 382902 A1 PL382902 A1 PL 382902A1
Authority
PL
Poland
Prior art keywords
processing flat
fragile substrates
fragile
substrates
flat
Prior art date
Application number
PL382902A
Other languages
Polish (pl)
Inventor
Thomas Kosikowski
Original Assignee
Hollmuller Maschinenbau Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollmuller Maschinenbau Gmbh filed Critical Hollmuller Maschinenbau Gmbh
Publication of PL382902A1 publication Critical patent/PL382902A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Photovoltaic Devices (AREA)
PL382902A 2006-07-19 2007-07-11 Method and device for processing flat, fragile substrates PL382902A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006033353A DE102006033353B4 (en) 2006-07-19 2006-07-19 Method and device for treating flat, fragile substrates

Publications (1)

Publication Number Publication Date
PL382902A1 true PL382902A1 (en) 2008-01-21

Family

ID=38830654

Family Applications (1)

Application Number Title Priority Date Filing Date
PL382902A PL382902A1 (en) 2006-07-19 2007-07-11 Method and device for processing flat, fragile substrates

Country Status (5)

Country Link
JP (1) JP2008025030A (en)
CN (1) CN101109095B (en)
DE (1) DE102006033353B4 (en)
PL (1) PL382902A1 (en)
TW (1) TW200806822A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1035265C2 (en) * 2008-04-07 2009-10-08 Meco Equip Eng Method and device for the electroplating of non-metallic glassy substrates.
DE102008026199B3 (en) * 2008-05-30 2009-10-08 Rena Gmbh Device and method for electrical contacting of flat material in continuous systems
US7955873B2 (en) * 2009-03-31 2011-06-07 Infineon Technologies Ag Method of fabricating a semiconductor device
DE102009018360A1 (en) * 2009-04-23 2010-11-04 Rena Gmbh Electroplating sunny side of non-illuminated solar cells in electrolytic cells of continuous feed system, immersion bath system or cup-plate by rectifier, comprises negatively polarizing solar cell at its electrically conductive rear side
DE102009022337A1 (en) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Method and device for treating a substrate
EP2473654B1 (en) * 2009-09-01 2013-10-30 Imec Method for electrochemical processing of non-flat samples
DE102013100805B4 (en) * 2013-01-28 2015-01-22 Hochschule Offenburg Wet-chemical treatment plant for the electrochemical coating of flat substrates
DE102013219886A1 (en) 2013-10-01 2015-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Apparatus and method for the continuous production of porous silicon layers
DE102015121636A1 (en) * 2015-12-11 2017-06-14 Nexwafe Gmbh Device and method for one-sided etching of a semiconductor layer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140797A (en) * 1991-11-18 1993-06-08 Sumitomo Metal Ind Ltd Manufacturing method of continuous electric plated steel strip
JPH05320985A (en) * 1992-05-27 1993-12-07 Kanai Hiroyuki Method for energizing cathode in continuous electroplating of wire and conductor cathode body
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
JP3284496B2 (en) * 2000-08-09 2002-05-20 株式会社荏原製作所 Plating apparatus and plating solution removal method
JP2002161395A (en) * 2000-11-17 2002-06-04 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region

Also Published As

Publication number Publication date
TW200806822A (en) 2008-02-01
DE102006033353B4 (en) 2010-11-18
CN101109095B (en) 2011-03-16
DE102006033353A1 (en) 2008-01-24
JP2008025030A (en) 2008-02-07
CN101109095A (en) 2008-01-23

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Legal Events

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