PL3839005T3 - Materiały interfejsu termicznego zawierające środek barwiący - Google Patents

Materiały interfejsu termicznego zawierające środek barwiący

Info

Publication number
PL3839005T3
PL3839005T3 PL20211073.0T PL20211073T PL3839005T3 PL 3839005 T3 PL3839005 T3 PL 3839005T3 PL 20211073 T PL20211073 T PL 20211073T PL 3839005 T3 PL3839005 T3 PL 3839005T3
Authority
PL
Poland
Prior art keywords
coloring agent
materials containing
thermal interface
interface materials
thermal
Prior art date
Application number
PL20211073.0T
Other languages
English (en)
Inventor
Li Qiang ZHANG
Ya Qin MAO
Hui Feng DUAN
Hai Gang KANG
Ya Qun Liu
Ling Shen
Kai Zhang
Original Assignee
Honeywell International Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc. filed Critical Honeywell International Inc.
Publication of PL3839005T3 publication Critical patent/PL3839005T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23—Azo-compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Coloring (AREA)
  • Cosmetics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL20211073.0T 2016-10-12 2016-10-12 Materiały interfejsu termicznego zawierające środek barwiący PL3839005T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20211073.0A EP3839005B1 (en) 2016-10-12 2016-10-12 Thermal interface materials including coloring agent
PCT/CN2016/101874 WO2018068222A1 (en) 2016-10-12 2016-10-12 Thermal interface materials including coloring agent

Publications (1)

Publication Number Publication Date
PL3839005T3 true PL3839005T3 (pl) 2023-11-27

Family

ID=61905079

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20211073.0T PL3839005T3 (pl) 2016-10-12 2016-10-12 Materiały interfejsu termicznego zawierające środek barwiący

Country Status (9)

Country Link
EP (2) EP3839005B1 (pl)
JP (1) JP2020500225A (pl)
KR (1) KR102666004B1 (pl)
CN (1) CN109844056B (pl)
BR (1) BR112019007197A2 (pl)
MX (1) MX2019004236A (pl)
PL (1) PL3839005T3 (pl)
PT (1) PT3839005T (pl)
WO (1) WO2018068222A1 (pl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX395096B (es) 2014-07-07 2025-03-24 Honeywell Int Inc Material de interconexion termica con depurador ionico.
WO2016086410A1 (en) 2014-12-05 2016-06-09 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) * 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR102570407B1 (ko) * 2019-06-24 2023-08-23 후지고분시고오교오가부시끼가이샤 내열성 열전도성 조성물 및 내열성 열전도성 시트
CN116568754A (zh) * 2020-12-24 2023-08-08 陶氏环球技术有限责任公司 热界面材料

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3886801A (en) * 1999-09-21 2001-04-24 Saint-Gobain Ceramics And Plastics, Inc. Thermally conductive materials in a hydrophobic compound for thermal management
CN102341474B (zh) * 2009-03-02 2014-09-24 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
JP5651676B2 (ja) * 2009-03-16 2015-01-14 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
EP2821456A4 (en) * 2012-03-02 2015-12-16 Fuji Polymer Ind KITCHENETTE HEAT TRANSFER MATERIAL AND METHOD FOR THE PRODUCTION THEREOF
US20140171567A1 (en) * 2012-12-14 2014-06-19 Sabic Innovative Plastics Ip B.V. Thermally conductive flame retardant polymer compositions and uses thereof
US20150125646A1 (en) * 2013-11-05 2015-05-07 Espci Innov Self-Healing Thermally Conductive Polymer Materials
EP3105300B1 (en) * 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
JPWO2016111139A1 (ja) * 2015-01-06 2017-10-12 富士高分子工業株式会社 蓄熱性熱伝導シート
CN105349113A (zh) * 2015-10-14 2016-02-24 文雪烽 一种导热界面材料

Also Published As

Publication number Publication date
KR102666004B1 (ko) 2024-05-14
BR112019007197A2 (pt) 2019-07-02
EP3839005A1 (en) 2021-06-23
CN109844056B (zh) 2021-11-09
MX2019004236A (es) 2019-07-04
CN109844056A (zh) 2019-06-04
PT3839005T (pt) 2023-09-07
EP3526303A1 (en) 2019-08-21
JP2020500225A (ja) 2020-01-09
KR20190067176A (ko) 2019-06-14
EP3526303A4 (en) 2020-09-09
WO2018068222A1 (en) 2018-04-19
EP3839005B1 (en) 2023-07-19

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