PL3844803T3 - Kontrola przy przenoszeniu komponentów elektronicznych z pierwszego na drugi nośnik - Google Patents
Kontrola przy przenoszeniu komponentów elektronicznych z pierwszego na drugi nośnikInfo
- Publication number
- PL3844803T3 PL3844803T3 PL19762106.3T PL19762106T PL3844803T3 PL 3844803 T3 PL3844803 T3 PL 3844803T3 PL 19762106 T PL19762106 T PL 19762106T PL 3844803 T3 PL3844803 T3 PL 3844803T3
- Authority
- PL
- Poland
- Prior art keywords
- carrier
- control
- electronic components
- transferring electronic
- transferring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018006760.3A DE102018006760A1 (de) | 2018-08-27 | 2018-08-27 | Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
| PCT/EP2019/072577 WO2020043612A1 (de) | 2018-08-27 | 2019-08-23 | Inspektion beim übertragen elektronischer bauteile von einem ersten zu einem zweiten träger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3844803T3 true PL3844803T3 (pl) | 2023-02-27 |
Family
ID=67810585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL19762106.3T PL3844803T3 (pl) | 2018-08-27 | 2019-08-23 | Kontrola przy przenoszeniu komponentów elektronicznych z pierwszego na drugi nośnik |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12046491B2 (pl) |
| EP (1) | EP3844803B1 (pl) |
| CN (2) | CN120955021A (pl) |
| DE (1) | DE102018006760A1 (pl) |
| FI (1) | FI3844803T3 (pl) |
| MY (1) | MY200078A (pl) |
| PL (1) | PL3844803T3 (pl) |
| SG (1) | SG11202101124SA (pl) |
| TW (1) | TWI732277B (pl) |
| WO (1) | WO2020043612A1 (pl) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018006760A1 (de) * | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
| DE102020001439B3 (de) * | 2020-02-21 | 2021-06-10 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834701B2 (ja) | 1975-12-02 | 1983-07-28 | トヨタ自動車株式会社 | ジドウヘンソクキヨウギヤトレ−ン |
| JPS53100765A (en) | 1977-02-15 | 1978-09-02 | Toshiba Corp | Production of semiconductor device |
| JPS596058B2 (ja) | 1978-11-21 | 1984-02-08 | 株式会社東芝 | 半導体装置の製造装置 |
| DE3336606A1 (de) | 1983-10-07 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur mikropackherstellung |
| US4990051A (en) | 1987-09-28 | 1991-02-05 | Kulicke And Soffa Industries, Inc. | Pre-peel die ejector apparatus |
| US4850780A (en) | 1987-09-28 | 1989-07-25 | Kulicke And Soffa Industries Inc. | Pre-peel die ejector apparatus |
| DE59204509D1 (de) | 1992-04-13 | 1996-01-11 | Tresky Dr Ing Miroslav | Ausstossvorrichtung zum Abtrennen eines Chips von einem adhäsiven Träger. |
| JP3498877B2 (ja) | 1995-12-05 | 2004-02-23 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
| ATE197503T1 (de) * | 1997-08-22 | 2000-11-11 | Fraunhofer Ges Forschung | Verfahren und vorrichtung zur automatischen prüfung bewegter oberflächen |
| JP3644212B2 (ja) * | 1997-09-25 | 2005-04-27 | 松下電器産業株式会社 | 電子部品実装装置 |
| EP0949662A3 (en) | 1998-03-27 | 2001-08-01 | Supersensor (Proprietary) Limited | Die transfer method and system |
| DE19822512A1 (de) | 1998-05-19 | 1999-10-21 | Siemens Ag | Verfahren zum Vereinzeln und Positionieren von Halbleiter-Bauteilen |
| DE19840226B4 (de) | 1998-09-03 | 2006-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen eines Schaltungschips auf einen Träger |
| US7042580B1 (en) * | 1999-02-01 | 2006-05-09 | Tokyo Electron Limited | Apparatus for imaging metrology |
| JP2002050670A (ja) | 2000-08-04 | 2002-02-15 | Toshiba Corp | ピックアップ装置及びピックアップ方法 |
| KR100353905B1 (ko) * | 2000-12-29 | 2002-09-28 | 주식회사옌트 | 표면 실장용 칩 검사 장치에 사용되는 조명 시스템 |
| JP3719182B2 (ja) | 2001-09-28 | 2005-11-24 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
| JP2003124700A (ja) * | 2001-10-15 | 2003-04-25 | Nidec Copal Corp | 撮像装置 |
| US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
| DE10203601A1 (de) | 2002-01-30 | 2003-08-14 | Siemens Ag | Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer |
| DE10349847B3 (de) | 2003-10-25 | 2005-05-25 | Mühlbauer Ag | Positionierungsvorrichtung und -Verfahren für die Übertragung elektronischer Bauteile |
| US20060013680A1 (en) | 2004-07-16 | 2006-01-19 | Tessera, Inc. | Chip handling methods and apparatus |
| US7238258B2 (en) | 2005-04-22 | 2007-07-03 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
| KR101248719B1 (ko) | 2006-04-12 | 2013-03-28 | 쿨릭케 운트 소파 다이 본딩 게엠베하 | 전자 부품의 배치 방법 및 장치 |
| DE102006025361A1 (de) | 2006-05-31 | 2007-12-06 | Siemens Ag | Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen |
| KR20070120319A (ko) | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법 |
| US7665204B2 (en) | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| JP5241245B2 (ja) | 2008-01-11 | 2013-07-17 | 株式会社日立ハイテクノロジーズ | 検査装置及び検査方法 |
| JP4985513B2 (ja) | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | 電子部品の剥離方法及び剥離装置 |
| DE102008018586A1 (de) * | 2008-04-12 | 2009-11-05 | Mühlbauer Ag | Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen |
| JP5792063B2 (ja) * | 2008-07-10 | 2015-10-07 | ノードソン コーポレーションＮｏｒｄｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ | アンダーフィル材料のフィレットの寸法を制御する方法 |
| JP2010161155A (ja) | 2009-01-07 | 2010-07-22 | Canon Machinery Inc | チップ転写方法およびチップ転写装置 |
| KR101650169B1 (ko) | 2009-10-19 | 2016-09-05 | 엠-솔브 리미티드 | 플렉시블 포일의 연속적인 길이들을 프로세싱하기 위한 장치 |
| DE102010053912B4 (de) | 2010-12-09 | 2013-01-31 | Mühlbauer Ag | Optische Untersuchungseinrichtung und optisches Untersuchungsverfahren |
| DE102011017218B4 (de) | 2011-04-15 | 2018-10-31 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten Träger zu einem zweiten Träger |
| DE102011104225B4 (de) | 2011-06-15 | 2017-08-24 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung |
| US9386984B2 (en) | 2013-02-08 | 2016-07-12 | Ethicon Endo-Surgery, Llc | Staple cartridge comprising a releasable cover |
| TWI528472B (zh) | 2013-08-29 | 2016-04-01 | 均華精密工業股份有限公司 | 黏著半導體晶片之裝置 |
| WO2015085064A1 (en) | 2013-12-05 | 2015-06-11 | Uniqarta, Inc. | Electronic device incorporated into a sheet |
| JP5662603B1 (ja) | 2014-02-27 | 2015-02-04 | 株式会社新川 | ボンディング装置およびボンディング方法 |
| DE102015013495B4 (de) * | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
| DE102015013494B3 (de) * | 2015-10-16 | 2017-04-06 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung |
| US10104784B2 (en) | 2015-11-06 | 2018-10-16 | Nxp B.V. | Method for making an electronic product with flexible substrate |
| KR20180083557A (ko) | 2017-01-13 | 2018-07-23 | (주)제이티 | 소자핸들러 |
| DE102018006760A1 (de) * | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
-
2018
- 2018-08-27 DE DE102018006760.3A patent/DE102018006760A1/de active Pending
-
2019
- 2019-08-23 MY MYPI2021000915A patent/MY200078A/en unknown
- 2019-08-23 EP EP19762106.3A patent/EP3844803B1/de active Active
- 2019-08-23 SG SG11202101124SA patent/SG11202101124SA/en unknown
- 2019-08-23 US US17/264,106 patent/US12046491B2/en active Active
- 2019-08-23 WO PCT/EP2019/072577 patent/WO2020043612A1/de not_active Ceased
- 2019-08-23 CN CN202510916404.3A patent/CN120955021A/zh active Pending
- 2019-08-23 CN CN201980055925.7A patent/CN112655080A/zh active Pending
- 2019-08-23 FI FIEP19762106.3T patent/FI3844803T3/fi active
- 2019-08-23 PL PL19762106.3T patent/PL3844803T3/pl unknown
- 2019-08-26 TW TW108130445A patent/TWI732277B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI732277B (zh) | 2021-07-01 |
| WO2020043612A1 (de) | 2020-03-05 |
| CN112655080A (zh) | 2021-04-13 |
| FI3844803T3 (fi) | 2023-01-31 |
| DE102018006760A1 (de) | 2020-02-27 |
| EP3844803A1 (de) | 2021-07-07 |
| US12046491B2 (en) | 2024-07-23 |
| TW202027193A (zh) | 2020-07-16 |
| US20210313206A1 (en) | 2021-10-07 |
| SG11202101124SA (en) | 2021-03-30 |
| MY200078A (en) | 2023-12-06 |
| EP3844803B1 (de) | 2022-10-26 |
| CN120955021A (zh) | 2025-11-14 |
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