PL3879640T3 - Złącze koncentryczne i podłoże wyposażone w złącze koncentryczne - Google Patents

Złącze koncentryczne i podłoże wyposażone w złącze koncentryczne

Info

Publication number
PL3879640T3
PL3879640T3 PL19882315.5T PL19882315T PL3879640T3 PL 3879640 T3 PL3879640 T3 PL 3879640T3 PL 19882315 T PL19882315 T PL 19882315T PL 3879640 T3 PL3879640 T3 PL 3879640T3
Authority
PL
Poland
Prior art keywords
coaxial connector
substrate equipped
substrate
coaxial
connector
Prior art date
Application number
PL19882315.5T
Other languages
English (en)
Inventor
Yoshiyuki Ikuma
Original Assignee
AGC Inc.
Agc Glass Europe
Agc Flat Glass North America, Inc.
Agc Vidros Do Brasil Ltda.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Inc., Agc Glass Europe, Agc Flat Glass North America, Inc., Agc Vidros Do Brasil Ltda. filed Critical AGC Inc.
Publication of PL3879640T3 publication Critical patent/PL3879640T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/42—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches
    • H01R24/44—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
PL19882315.5T 2018-11-06 2019-10-30 Złącze koncentryczne i podłoże wyposażone w złącze koncentryczne PL3879640T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018208766 2018-11-06
PCT/JP2019/042530 WO2020095783A1 (ja) 2018-11-06 2019-10-30 同軸コネクタ及び同軸コネクタ付き基板

Publications (1)

Publication Number Publication Date
PL3879640T3 true PL3879640T3 (pl) 2025-08-11

Family

ID=70612223

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19882315.5T PL3879640T3 (pl) 2018-11-06 2019-10-30 Złącze koncentryczne i podłoże wyposażone w złącze koncentryczne

Country Status (10)

Country Link
US (1) US11967792B2 (pl)
EP (1) EP3879640B1 (pl)
JP (1) JPWO2020095783A1 (pl)
KR (1) KR20210087933A (pl)
CN (1) CN112913088A (pl)
DK (1) DK3879640T3 (pl)
ES (1) ES3035202T3 (pl)
FI (1) FI3879640T3 (pl)
PL (1) PL3879640T3 (pl)
WO (1) WO2020095783A1 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022050917A1 (en) * 2020-09-01 2022-03-10 Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ Soldered adapter modulation structure
WO2022079769A1 (ja) * 2020-10-12 2022-04-21 オリンパス株式会社 導波管の接続構造、導波管コネクタ、導波管ユニット、モード変換機、撮像装置、及び、内視鏡
US12456790B2 (en) * 2021-07-09 2025-10-28 Kyocera Corporation Electronic element storing package and electronic device
JP7488242B2 (ja) * 2021-11-16 2024-05-21 矢崎総業株式会社 アンテナケーブルのノイズ抑制構造
KR102745032B1 (ko) * 2022-08-31 2024-12-23 (주)니나노 Ｒｆ 커넥터

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586204A (en) * 1978-12-23 1980-06-28 Fujitsu Ltd Microstrip coaxial converter
JPS5830761B2 (ja) * 1979-07-27 1983-07-01 株式会社トキメック 同軸−マイクロストリツプ変換器
US4737111A (en) * 1985-11-19 1988-04-12 C-Cor Electronics, Inc. RF connector for use in testing a printed circuit board
JPS63316901A (ja) * 1987-06-19 1988-12-26 Mitsubishi Electric Corp 同軸コネクタ
US5404117A (en) * 1993-10-01 1995-04-04 Hewlett-Packard Company Connector for strip-type transmission line to coaxial cable
US6457979B1 (en) 2001-10-29 2002-10-01 Agilent Technologies, Inc. Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate
US6957980B2 (en) * 2003-05-02 2005-10-25 Insert Enterprise Co., Ltd. Insert type super mini microwave connector
US6894590B2 (en) * 2003-05-30 2005-05-17 Agilent Technologies, Inc. Apparatus and method to introduce signals into a shielded RF circuit
JP2005236648A (ja) * 2004-02-19 2005-09-02 Mitsubishi Electric Corp 同軸マイクロストリップ線路変換器
US7344381B2 (en) * 2004-04-29 2008-03-18 Emerson Network Power Connectivity Solutions, Inc. High frequency edge mount connector
JP2007141607A (ja) * 2005-11-17 2007-06-07 Yazaki Corp 同軸コネクタの基板接続構造
JP2009099283A (ja) * 2007-10-12 2009-05-07 Murata Mfg Co Ltd 高周波同軸コネクタ、これを用いた高周波同軸コネクタの実装構造及び高周波同軸コネクタの接続方法
US8035466B2 (en) * 2009-01-12 2011-10-11 Kenneth Ray Payne High frequency electrical connector
US7713067B1 (en) * 2009-03-03 2010-05-11 Bomar Interconnect Products, Inc. Connector with a conductive shell with an extension to stradle a circuit board
US7946854B2 (en) * 2009-07-21 2011-05-24 Tyco Electronics Corporation Electrical connector assembly having shield member
JP5240726B2 (ja) * 2009-10-28 2013-07-17 京セラ株式会社 半導体装置と回路基板との接続構造
US8384492B2 (en) * 2010-09-07 2013-02-26 National Taipei University Of Technology Coaxial line to microstrip connector having slots in the microstrip line for receiving an encircling metallic plate
CZ303925B6 (cs) * 2010-11-12 2013-06-26 Ceské vysoké ucení technické v Praze Fakulta elektrotechnická Adaptér pro propojení koaxiálního vedení s planárním vedením, zejména pro mericí prístroje
FR2985157B1 (fr) * 2011-12-23 2014-10-10 Thales Sa Dispositif de protection electromagnetique apte a proteger une liaison hyperfrequences entre un connecteur et un element hyperfrequences
JP6103898B2 (ja) * 2012-11-28 2017-03-29 三菱電機株式会社 同軸コネクタおよびその基板接続構造
CN204271230U (zh) * 2014-12-17 2015-04-15 电子科技大学 一种改善高频及驻波特性的sma接头到微带过渡装置
TWI563718B (en) * 2015-06-11 2016-12-21 Univ Nat Taipei Technology Vertical Transition Structure
TWI560956B (zh) * 2016-06-07 2016-12-01 國立臺北科技大學 應用於同軸線至微帶線之轉接的接頭設計及裝配方法
JP6853655B2 (ja) * 2016-11-14 2021-03-31 ヒロセ電機株式会社 基板とコネクタとの接続構造および基板

Also Published As

Publication number Publication date
US20210242641A1 (en) 2021-08-05
WO2020095783A1 (ja) 2020-05-14
KR20210087933A (ko) 2021-07-13
EP3879640B1 (en) 2025-04-09
FI3879640T3 (fi) 2025-07-04
EP3879640A4 (en) 2022-08-03
US11967792B2 (en) 2024-04-23
DK3879640T3 (da) 2025-07-21
EP3879640A1 (en) 2021-09-15
CN112913088A (zh) 2021-06-04
JPWO2020095783A1 (ja) 2021-10-14
ES3035202T3 (en) 2025-08-29

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