PL3917300T3 - Zasilacz awaryjny zawierający urządzenie do chłodzenia cieczą - Google Patents

Zasilacz awaryjny zawierający urządzenie do chłodzenia cieczą

Info

Publication number
PL3917300T3
PL3917300T3 PL20315287.1T PL20315287T PL3917300T3 PL 3917300 T3 PL3917300 T3 PL 3917300T3 PL 20315287 T PL20315287 T PL 20315287T PL 3917300 T3 PL3917300 T3 PL 3917300T3
Authority
PL
Poland
Prior art keywords
power supply
cooling device
liquid cooling
uninterruptible power
uninterruptible
Prior art date
Application number
PL20315287.1T
Other languages
English (en)
Inventor
Ali Chehade
Hadrien Bauduin
Grégory Francis Louis Bauchart
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Publication of PL3917300T3 publication Critical patent/PL3917300T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
    • H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
    • H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
PL20315287.1T 2020-05-29 2020-05-29 Zasilacz awaryjny zawierający urządzenie do chłodzenia cieczą PL3917300T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20315287.1A EP3917300B1 (en) 2020-05-29 2020-05-29 Uninterruptible power supply having a liquid cooling device

Publications (1)

Publication Number Publication Date
PL3917300T3 true PL3917300T3 (pl) 2023-03-06

Family

ID=71607845

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20315287.1T PL3917300T3 (pl) 2020-05-29 2020-05-29 Zasilacz awaryjny zawierający urządzenie do chłodzenia cieczą

Country Status (5)

Country Link
US (1) US11470740B2 (pl)
EP (1) EP3917300B1 (pl)
CN (1) CN113747745B (pl)
DK (1) DK3917300T3 (pl)
PL (1) PL3917300T3 (pl)

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US20220173015A1 (en) * 2022-02-18 2022-06-02 Intel Corporation Liquid cooled cold plate for multiple semiconductor chip packages
CN114927794A (zh) * 2022-05-31 2022-08-19 厦门科华数能科技有限公司 一种液冷系统及储能系统
US20240237311A1 (en) * 2023-01-06 2024-07-11 Delta Electronics, Inc. Heat dissipation system and solid-state transformer power apparatus
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US12471250B1 (en) 2025-02-20 2025-11-11 Next Silicon Ltd. Liquid cooling assembly for electronic components on printed circuit boards and computing device including same
US12520416B1 (en) * 2025-02-20 2026-01-06 Next Silicon Ltd. Liquid cooling assembly for dual-sided thermal management and computing device including the same

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Also Published As

Publication number Publication date
US20210378147A1 (en) 2021-12-02
CN113747745A (zh) 2021-12-03
DK3917300T3 (da) 2023-01-16
EP3917300B1 (en) 2022-12-28
CN113747745B (zh) 2024-02-13
US11470740B2 (en) 2022-10-11
EP3917300A1 (en) 2021-12-01

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