PL394250A1 - Sposób wyznaczania optymalnych parametrów naswietlania warstw swiatloczulych w procesie fotolitografii oraz glowica do realizacji tego sposobu - Google Patents

Sposób wyznaczania optymalnych parametrów naswietlania warstw swiatloczulych w procesie fotolitografii oraz glowica do realizacji tego sposobu

Info

Publication number
PL394250A1
PL394250A1 PL394250A PL39425011A PL394250A1 PL 394250 A1 PL394250 A1 PL 394250A1 PL 394250 A PL394250 A PL 394250A PL 39425011 A PL39425011 A PL 39425011A PL 394250 A1 PL394250 A1 PL 394250A1
Authority
PL
Poland
Prior art keywords
photolithography
implementation
head
light
sensitive layers
Prior art date
Application number
PL394250A
Other languages
English (en)
Other versions
PL219462B1 (pl
Inventor
Andrzej Sierakowski
Krzysztof Domański
Paweł Janus
Piotr Grabiec
Teodor Paweł Gotszalk
Original Assignee
Instytut Technologii Elektronowej
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Technologii Elektronowej filed Critical Instytut Technologii Elektronowej
Priority to PL394250A priority Critical patent/PL219462B1/pl
Priority to EP20110008132 priority patent/EP2500776A3/en
Publication of PL394250A1 publication Critical patent/PL394250A1/pl
Publication of PL219462B1 publication Critical patent/PL219462B1/pl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PL394250A 2011-03-17 2011-03-17 Sposób wyznaczania optymalnych parametrów naświetlania warstw światłoczułych w procesie fotolitografii oraz głowica do realizacji tego sposobu PL219462B1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL394250A PL219462B1 (pl) 2011-03-17 2011-03-17 Sposób wyznaczania optymalnych parametrów naświetlania warstw światłoczułych w procesie fotolitografii oraz głowica do realizacji tego sposobu
EP20110008132 EP2500776A3 (en) 2011-03-17 2011-10-07 Method for optimization of photoresist exposure parameters in photolithography process and device for implementing the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL394250A PL219462B1 (pl) 2011-03-17 2011-03-17 Sposób wyznaczania optymalnych parametrów naświetlania warstw światłoczułych w procesie fotolitografii oraz głowica do realizacji tego sposobu

Publications (2)

Publication Number Publication Date
PL394250A1 true PL394250A1 (pl) 2012-09-24
PL219462B1 PL219462B1 (pl) 2015-04-30

Family

ID=44862286

Family Applications (1)

Application Number Title Priority Date Filing Date
PL394250A PL219462B1 (pl) 2011-03-17 2011-03-17 Sposób wyznaczania optymalnych parametrów naświetlania warstw światłoczułych w procesie fotolitografii oraz głowica do realizacji tego sposobu

Country Status (2)

Country Link
EP (1) EP2500776A3 (pl)
PL (1) PL219462B1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3667422A1 (en) * 2018-12-14 2020-06-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lithographic patterning method and system therefore
EP3667421A1 (en) * 2018-12-14 2020-06-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lithographic patterning method
CN114256207A (zh) * 2021-12-13 2022-03-29 浙江大学杭州国际科创中心 晶圆表面标记制作方法及扫描电镜内晶圆的定位方法
CN119108296B (zh) * 2024-09-03 2025-10-03 浙江创芯集成电路有限公司 半导体结构的量测分析方法和装置、可读存储介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
DE69231715D1 (de) 1991-03-04 2001-04-12 At & T Corp Herstellungsverfahren von integrierten Halbleiterschaltungen unter Anwendung von latenten Bildern
JPH11174065A (ja) * 1997-12-10 1999-07-02 Nikon Corp 潜像検出方法及び露光状態検出方法
JP2000286190A (ja) * 1999-03-31 2000-10-13 Nikon Corp 露光装置および露光方法ならびにデバイス製造方法

Also Published As

Publication number Publication date
PL219462B1 (pl) 2015-04-30
EP2500776A2 (en) 2012-09-19
EP2500776A3 (en) 2014-12-24

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Effective date: 20140902