PL3989270T3 - Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża - Google Patents
Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłożaInfo
- Publication number
- PL3989270T3 PL3989270T3 PL20202781.9T PL20202781T PL3989270T3 PL 3989270 T3 PL3989270 T3 PL 3989270T3 PL 20202781 T PL20202781 T PL 20202781T PL 3989270 T3 PL3989270 T3 PL 3989270T3
- Authority
- PL
- Poland
- Prior art keywords
- substrate
- fastening
- surface treatment
- clipping mechanism
- clipping
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20202781.9A EP3989270B1 (en) | 2020-10-20 | 2020-10-20 | Clipping mechanism for fastening a substrate for a surface treatment of the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3989270T3 true PL3989270T3 (pl) | 2023-01-16 |
Family
ID=72964550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20202781.9T PL3989270T3 (pl) | 2020-10-20 | 2020-10-20 | Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11942356B2 (pl) |
| EP (2) | EP3989270B1 (pl) |
| KR (1) | KR102590311B1 (pl) |
| CN (1) | CN116438642B (pl) |
| PL (1) | PL3989270T3 (pl) |
| PT (1) | PT3989270T (pl) |
| TW (1) | TWI819396B (pl) |
| WO (1) | WO2022084109A1 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250079227A1 (en) * | 2023-09-05 | 2025-03-06 | Taiwan Semiconductor Manufacturing Company Limited | Wafer retaining device |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111659A (ja) * | 1997-10-01 | 1999-04-23 | Sugai:Kk | 基板帯電防止方法、基板帯電防止装置および基板洗浄装置 |
| US6578893B2 (en) * | 2000-10-02 | 2003-06-17 | Ajs Automation, Inc. | Apparatus and methods for handling semiconductor wafers |
| US7611182B2 (en) * | 2005-02-25 | 2009-11-03 | Semes Co., Ltd. | Wafer transfer apparatus |
| KR100824544B1 (ko) * | 2006-09-18 | 2008-04-23 | (주)에스티아이 | 식각 장치 및 식각방법 |
| WO2008133149A1 (ja) * | 2007-04-23 | 2008-11-06 | Ulvac, Inc. | 支持部材およびキャリアと支持方法 |
| DE102007026634B4 (de) * | 2007-06-06 | 2009-04-16 | Atotech Deutschland Gmbh | Vertikalanlage zur galvanotechnischen Behandlung eines Werkstückes und Verfahren zum Befördern des Werkstückes |
| KR20080114155A (ko) * | 2007-06-27 | 2008-12-31 | 삼성전자주식회사 | 웨이퍼 그리핑 장치 |
| US8695312B2 (en) * | 2008-05-28 | 2014-04-15 | Lantech.Com, Llc | Film clamp and related methods and apparatuses for wrapping loads |
| US20120031565A1 (en) * | 2009-01-28 | 2012-02-09 | Fuji Electric Co., Ltd. | Flexible substrate position control device |
| US20110276082A1 (en) * | 2009-09-17 | 2011-11-10 | Fehring Robert G | Device for providing therapeutic pressure therapy to parts of the body for treatment of pain |
| CN101814586B (zh) * | 2009-12-01 | 2011-09-28 | 东莞宏威数码机械有限公司 | 夹持式基板翻转装置 |
| JP3166374U (ja) | 2010-12-20 | 2011-03-03 | 旭硝子株式会社 | 板状体収納容器 |
| DE102011100235A1 (de) * | 2011-05-02 | 2012-11-08 | Trw Automotive Gmbh | Befestigungsclip zum Montieren eines Bauteils |
| US8864753B2 (en) * | 2011-12-13 | 2014-10-21 | Covidien Lp | Surgical Forceps Connected to Treatment Light Source |
| KR101388619B1 (ko) | 2012-08-29 | 2014-04-23 | 주식회사 엠엠테크 | 글라스 슬리밍 장치 |
| DE102013001625A1 (de) * | 2012-09-30 | 2014-04-03 | Cepventures International Corp. | Verpackung für kantenempfindliches Transportgut |
| JP6065722B2 (ja) * | 2013-04-10 | 2017-01-25 | 日本電気硝子株式会社 | 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット |
| JP6234731B2 (ja) * | 2013-08-08 | 2017-11-22 | 上村工業株式会社 | クランパーを備える保持具 |
| KR101553623B1 (ko) | 2013-12-16 | 2015-09-16 | 주식회사 에스에프에이 | 캐리어 |
| FR3049941B1 (fr) * | 2016-04-06 | 2018-04-13 | Saint- Gobain Glass France | Dispositif de convoyage et de maintien pour feuille de verre notamment dans une installation de lavage |
| US20170323822A1 (en) * | 2016-05-06 | 2017-11-09 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved substrate handling assembly |
| US10074554B2 (en) * | 2016-06-27 | 2018-09-11 | Tel Nexx, Inc. | Workpiece loader for a wet processing system |
| US10283396B2 (en) * | 2016-06-27 | 2019-05-07 | Asm Nexx, Inc. | Workpiece holder for a wet processing system |
| US10483138B2 (en) | 2017-03-09 | 2019-11-19 | Himax Technologies Limited | Wafer clamp and a method of clamping a wafer |
| US10720353B2 (en) * | 2018-07-04 | 2020-07-21 | Murata Machinery, Ltd. | Opener apparatus |
| TWI890340B (zh) * | 2019-03-13 | 2025-07-11 | 以色列商核心流有限公司 | 圓形晶圓側向定位裝置 |
| US20230130419A1 (en) * | 2021-10-21 | 2023-04-27 | Asmpt Nexx, Inc. | Method for cleaning semiconductor devices |
| CN115036235A (zh) * | 2022-02-11 | 2022-09-09 | 宇弘研精密机械(苏州)有限公司 | 一种芯片清洗循环翻转倒料系统 |
-
2020
- 2020-10-20 EP EP20202781.9A patent/EP3989270B1/en active Active
- 2020-10-20 PT PT202027819T patent/PT3989270T/pt unknown
- 2020-10-20 EP EP21177304.9A patent/EP3989271B1/en active Active
- 2020-10-20 PL PL20202781.9T patent/PL3989270T3/pl unknown
-
2021
- 2021-10-12 WO PCT/EP2021/078208 patent/WO2022084109A1/en not_active Ceased
- 2021-10-12 US US18/025,577 patent/US11942356B2/en active Active
- 2021-10-12 KR KR1020237009687A patent/KR102590311B1/ko active Active
- 2021-10-12 CN CN202180070405.0A patent/CN116438642B/zh active Active
- 2021-10-18 TW TW110138556A patent/TWI819396B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3989270A1 (en) | 2022-04-27 |
| KR20230044029A (ko) | 2023-03-31 |
| TWI819396B (zh) | 2023-10-21 |
| US20230260823A1 (en) | 2023-08-17 |
| EP3989271A1 (en) | 2022-04-27 |
| KR102590311B1 (ko) | 2023-10-16 |
| CN116438642B (zh) | 2024-10-11 |
| EP3989270B1 (en) | 2022-10-05 |
| EP3989271B1 (en) | 2024-06-05 |
| PT3989270T (pt) | 2022-11-10 |
| CN116438642A (zh) | 2023-07-14 |
| WO2022084109A1 (en) | 2022-04-28 |
| US11942356B2 (en) | 2024-03-26 |
| TW202220096A (zh) | 2022-05-16 |
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