PL3993576T3 - Układ do i sposób produkcji przemysłowej płytek kompozytowych - Google Patents

Układ do i sposób produkcji przemysłowej płytek kompozytowych

Info

Publication number
PL3993576T3
PL3993576T3 PL20831296.7T PL20831296T PL3993576T3 PL 3993576 T3 PL3993576 T3 PL 3993576T3 PL 20831296 T PL20831296 T PL 20831296T PL 3993576 T3 PL3993576 T3 PL 3993576T3
Authority
PL
Poland
Prior art keywords
industrial production
composite plates
composite
plates
industrial
Prior art date
Application number
PL20831296.7T
Other languages
English (en)
Inventor
Sungmoon KIM
Jinwoo Kim
Sanghwa Kim
Euidock RYU
Hyungrae ROH
Original Assignee
Doosan Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Corporation filed Critical Doosan Corporation
Publication of PL3993576T3 publication Critical patent/PL3993576T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
PL20831296.7T 2019-06-25 2020-06-25 Układ do i sposób produkcji przemysłowej płytek kompozytowych PL3993576T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190075969A KR102886773B1 (ko) 2019-06-25 2019-06-25 복합 기판의 제조시스템 및 제조방법
PCT/KR2020/008270 WO2020262979A1 (ko) 2019-06-25 2020-06-25 복합 기판의 제조시스템 및 제조방법

Publications (1)

Publication Number Publication Date
PL3993576T3 true PL3993576T3 (pl) 2025-08-18

Family

ID=74060299

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20831296.7T PL3993576T3 (pl) 2019-06-25 2020-06-25 Układ do i sposób produkcji przemysłowej płytek kompozytowych

Country Status (8)

Country Link
US (1) US12219715B2 (pl)
EP (1) EP3993576B1 (pl)
JP (1) JP7281567B2 (pl)
KR (1) KR102886773B1 (pl)
CN (2) CN114271037B (pl)
HU (1) HUE072185T2 (pl)
PL (1) PL3993576T3 (pl)
WO (2) WO2020262981A1 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102438799B1 (ko) * 2022-05-31 2022-09-01 주식회사 오케이테크놀러지 롤투롤 방식 반도체 서스 패널 제조장치 및 방법
CN115782197B (zh) * 2022-11-10 2026-03-06 浙江林德纳新型建材有限公司 铝塑板防粘黏的热压成型装置
CN117602159B (zh) * 2024-01-23 2024-04-05 四川英创力电子科技股份有限公司 一种带有覆膜功能的电路板自动投板装置及方法
KR102982726B1 (ko) 2024-04-12 2026-06-26 주식회사 케이엔제이 필름 이송 및 부착장치
KR20250150996A (ko) 2024-04-12 2025-10-21 주식회사 케이엔제이 커버레이 가접 시스템, 그리고 이를 이용한 커버레이 가접 방법
KR102968303B1 (ko) * 2024-12-12 2026-05-29 비앤에스(주) 반도체 서브스트레이트 적층재료 캐리어 자동 적층 장치 및 방법
KR102942571B1 (ko) * 2025-04-21 2026-03-23 (주) 고송이엔지 롤투컷 방식 인쇄회로기판 커버레이 필름 가접장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1910100B (zh) * 2004-04-13 2010-04-14 倍科有限公司 覆盖层薄膜贴合装置及其截断载置装置
JP2007149936A (ja) * 2005-11-28 2007-06-14 Ishii Hyoki Corp フレキシブル基板のシート材仮貼付装置
KR200421129Y1 (ko) * 2006-04-25 2006-07-07 김창수 Ｆｐｃｂ용 핫프레스 장치
KR200420975Y1 (ko) 2006-04-25 2006-07-07 김창수 Ｆｐｃｂ용 커버레이 가접 장치
JP4898388B2 (ja) 2006-10-27 2012-03-14 富士フイルム株式会社 感光性積層体の製造装置及び製造方法
KR100808674B1 (ko) 2007-04-20 2008-02-29 (주)인터플렉스 경연성 인쇄회로기판 연성부의 커버레이 부착방법
JP5021384B2 (ja) 2007-07-10 2012-09-05 日本メクトロン株式会社 プリント配線板の貼付装置および貼付方法
JP5368054B2 (ja) 2008-10-15 2013-12-18 日本メクトロン株式会社 フレキシブル回路基板の製造方法及びフレキシブル回路基板
KR101257621B1 (ko) 2011-09-19 2013-04-29 우영관 Ｆｐｃ에 부재플레이트를 부착하기 위한 부재플레이트 부착장치 및 부착방법
KR101354066B1 (ko) * 2012-05-18 2014-01-23 (주)우리엔지니어링 커버레이 가접방법 및 이를 이용한 커버레이 가접장치
KR101401984B1 (ko) * 2012-12-11 2014-05-30 세호로보트 주식회사 커버레이 필름 부착 장치
KR101562058B1 (ko) * 2013-08-28 2015-10-20 삼성전기주식회사 커버레이 가접장치
KR102154208B1 (ko) * 2013-11-21 2020-09-09 주식회사 아모그린텍 연성인쇄회로기판 제조용 프레싱 장치 및 이를 이용한 연성인쇄회로기판 제조방법
JP6240007B2 (ja) 2014-03-18 2017-11-29 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造に用いられる中間生成物
KR20180038645A (ko) * 2016-10-07 2018-04-17 우영관 커버레이 가접기

Also Published As

Publication number Publication date
WO2020262981A1 (ko) 2020-12-30
CN114287173B (zh) 2024-03-08
CN114271037A (zh) 2022-04-01
JP7281567B2 (ja) 2023-05-25
HUE072185T2 (hu) 2025-10-28
EP3993576A1 (en) 2022-05-04
EP3993576A4 (en) 2023-11-15
US20220353999A1 (en) 2022-11-03
US12219715B2 (en) 2025-02-04
KR102886773B1 (ko) 2025-11-13
EP3993576B1 (en) 2025-04-30
JP2022539064A (ja) 2022-09-07
CN114271037B (zh) 2024-01-30
KR20210000610A (ko) 2021-01-05
CN114287173A (zh) 2022-04-05
WO2020262979A1 (ko) 2020-12-30

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