PL4002057T3 - Zespół zawiasu i zespół prowadnicy dla urządzeń elektronicznych wykorzystujący element przenoszący ciepło - Google Patents
Zespół zawiasu i zespół prowadnicy dla urządzeń elektronicznych wykorzystujący element przenoszący ciepłoInfo
- Publication number
- PL4002057T3 PL4002057T3 PL21197807.7T PL21197807T PL4002057T3 PL 4002057 T3 PL4002057 T3 PL 4002057T3 PL 21197807 T PL21197807 T PL 21197807T PL 4002057 T3 PL4002057 T3 PL 4002057T3
- Authority
- PL
- Poland
- Prior art keywords
- heat transfer
- electronic devices
- assembly
- transfer element
- guide assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1681—Details related solely to hinges
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- G06F1/1618—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position the display being foldable up to the back of the other housing with a single degree of freedom, e.g. by 360° rotation over the axis defined by the rear edge of the base enclosure
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/100,849 US12117876B2 (en) | 2020-11-21 | 2020-11-21 | Hinge assembly and guide assembly for electronic devices using a heat carrying member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL4002057T3 true PL4002057T3 (pl) | 2026-01-26 |
Family
ID=75274844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL21197807.7T PL4002057T3 (pl) | 2020-11-21 | 2021-09-20 | Zespół zawiasu i zespół prowadnicy dla urządzeń elektronicznych wykorzystujący element przenoszący ciepło |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12117876B2 (pl) |
| EP (1) | EP4002057B1 (pl) |
| CN (1) | CN114527833A (pl) |
| PL (1) | PL4002057T3 (pl) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102502607B1 (ko) * | 2017-11-14 | 2023-02-23 | 삼성전자주식회사 | 커넥터 모듈 및 이를 포함하는 전자 장치 |
| WO2019177622A1 (en) * | 2018-03-16 | 2019-09-19 | Hewlett-Packard Development Company, L.P. | Hinge assemblies |
| USD933060S1 (en) * | 2018-09-26 | 2021-10-12 | Intel Corporation | Convertible electronic device |
| CN109327586B (zh) * | 2018-10-31 | 2025-08-26 | 周金龙 | 一种穿戴式手机夹持装置 |
| WO2020230745A1 (ja) * | 2019-05-16 | 2020-11-19 | ソニー株式会社 | 熱伝導機構 |
| EP3993586B1 (en) * | 2019-06-28 | 2025-10-29 | LG Electronics Inc. | Avn device |
| US11599155B2 (en) * | 2020-04-21 | 2023-03-07 | Microsoft Technology Licensing, Llc | Hinged device |
| US12117876B2 (en) * | 2020-11-21 | 2024-10-15 | Intel Corporation | Hinge assembly and guide assembly for electronic devices using a heat carrying member |
| US11744045B2 (en) * | 2021-11-10 | 2023-08-29 | Qualcomm Incorporated | Electronic device comprising a thermally conductive connector comprising graphite |
| CN117616363A (zh) | 2021-12-16 | 2024-02-27 | 英特尔公司 | 多面板计算设备中的设备与处理器之间的消息转换和消息直通 |
| US12032171B1 (en) * | 2022-02-04 | 2024-07-09 | Meta Platforms Technologies, Llc | Thermal hinge system |
| US12393052B1 (en) | 2022-02-04 | 2025-08-19 | Meta Platforms Technologies, Llc | Systems and methods for controlling thermal energy between hinged portions of electronic devices |
| CN114709186B (zh) * | 2022-04-06 | 2024-11-29 | 甬矽电子(宁波)股份有限公司 | 基板和基板制作方法 |
| US20250264917A1 (en) * | 2023-01-09 | 2025-08-21 | Meta Platforms Technologies, Llc | Flexible hinge thermal architecture |
| JP7808778B2 (ja) * | 2023-02-06 | 2026-01-30 | パナソニックIpマネジメント株式会社 | 電子機器 |
| US12443244B2 (en) * | 2024-01-31 | 2025-10-14 | Dell Products L.P. | Information handling system assymetric display fold to support an adaptive keyboard row |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2662304B1 (fr) | 1990-05-21 | 1992-07-24 | France Telecom | Procede de fabrication d'une structure integree guide-detecteur de lumiere en materiau semi-conducteur. |
| JPH08204373A (ja) | 1995-01-27 | 1996-08-09 | Diamond Electric Mfg Co Ltd | 放熱装置 |
| US5621613A (en) | 1995-05-16 | 1997-04-15 | Intel Corporation | Apparatus for dissipating heat in a hinged computing device |
| US5646822A (en) | 1995-08-30 | 1997-07-08 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
| US5822187A (en) | 1996-10-25 | 1998-10-13 | Thermal Corp. | Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices |
| US5781409A (en) | 1996-12-19 | 1998-07-14 | Compaq Computer Corporation | Heat dissipating lid hinge structure with laterally offset heat pipe end portions |
| US5832987A (en) | 1997-03-21 | 1998-11-10 | Lowry; David A. | Rotatable heat transfer coupling |
| JPH10262719A (ja) | 1997-03-27 | 1998-10-06 | Mitsubishi Electric Corp | ノートパソコン収納ケース |
| US5796581A (en) | 1997-07-30 | 1998-08-18 | International Business Machines Corporation | Rotational joint for hinged heat pipe cooling of a computer |
| US5910883A (en) | 1997-08-06 | 1999-06-08 | International Business Machines Corporation | Hinge incorporating a helically coiled heat pipe for a laptop computer |
| US5847925A (en) | 1997-08-12 | 1998-12-08 | Compaq Computer Corporation | System and method for transferring heat between movable portions of a computer |
| JP3461269B2 (ja) | 1997-09-04 | 2003-10-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 表示装置組立体及び情報処理機器 |
| US6075696A (en) | 1997-11-06 | 2000-06-13 | Compaq Computer Corporation | Portable computer with flexible heat spreader plate structure therein |
| JP2000010661A (ja) | 1998-06-18 | 2000-01-14 | Mitsubishi Electric Corp | 携帯型情報処理装置および携帯型情報処理装置用カバー、卓上型情報処理装置 |
| US6097597A (en) | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
| US6353529B1 (en) | 1998-11-12 | 2002-03-05 | Thomas Cies | Z-configuration structure for computers, scanners, and communications and video devices |
| US6377452B1 (en) | 1998-12-18 | 2002-04-23 | Furukawa Electric Co., Ltd. | Heat pipe hinge structure for electronic device |
| US6052280A (en) | 1999-01-19 | 2000-04-18 | Alliedsignal Inc. | Carbon/carbon heat spreader |
| US6141216A (en) | 1999-03-31 | 2000-10-31 | International Business Machines Corporation | Quick-release hinge joint for heat pipe |
| US6253836B1 (en) | 1999-05-24 | 2001-07-03 | Compaq Computer Corporation | Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus |
| US6198625B1 (en) | 1999-06-03 | 2001-03-06 | Micron Electronics, Inc. | Hinge assembly for a portable computer |
| US6226177B1 (en) | 1999-06-08 | 2001-05-01 | Torqmaster, Inc. | Friction hinge having high thermal conductivity |
| US6249426B1 (en) | 1999-08-30 | 2001-06-19 | Dell Usa Corp | Portable computer having a sealed hinge clutch |
| US6512670B1 (en) | 2000-10-05 | 2003-01-28 | International Business Machines Corporation | Detachable displays or portable devices |
| US7236355B2 (en) | 2001-01-17 | 2007-06-26 | Boyean Kim | Sun visor having office work apparatus |
| US6741456B2 (en) | 2001-04-18 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | System and method for pivotably securing display housing to computer system |
| JP3710780B2 (ja) | 2002-11-29 | 2005-10-26 | 京セラ株式会社 | コネクタ接続部構造及びこれを用いた携帯端末装置 |
| RU2395924C2 (ru) | 2003-07-10 | 2010-07-27 | Нокиа Корпорейшн | Мобильная станция |
| KR100760509B1 (ko) | 2004-12-14 | 2007-09-20 | 삼성전자주식회사 | 폴더 타입 휴대용 무선단말기의 방열 장치 |
| TW200725216A (en) | 2005-12-20 | 2007-07-01 | Asustek Comp Inc | Electronic device with a rotation positioning structure |
| JP2007286785A (ja) | 2006-04-14 | 2007-11-01 | Fujitsu Ltd | 電子機器および冷却部品 |
| JP2008305284A (ja) | 2007-06-11 | 2008-12-18 | Lenovo Singapore Pte Ltd | 携帯式コンピュータ |
| JP4888413B2 (ja) | 2008-02-14 | 2012-02-29 | 富士通株式会社 | 携帯型電子装置 |
| US8446264B2 (en) | 2010-07-21 | 2013-05-21 | Research In Motion Limited | Portable electronic device having a waterproof keypad |
| CN102858114A (zh) | 2011-06-28 | 2013-01-02 | 鸿富锦精密工业(深圳)有限公司 | 便携式电子装置 |
| TWM422001U (en) | 2011-07-13 | 2012-02-01 | Quanta Comp Inc | Dual-axis hinge structure and electric device having the same |
| US8675363B2 (en) | 2011-07-26 | 2014-03-18 | Hewlett-Packard Development Company, L.P. | Thermal conductors in electronic devices |
| US9766661B2 (en) | 2013-07-30 | 2017-09-19 | Intel Corporation | Stacking detachable tablet |
| US9490860B2 (en) | 2014-12-17 | 2016-11-08 | Asia Vital Components Co., Ltd. | Protective device capable of dissipating heat |
| EP3292458A4 (en) | 2015-05-05 | 2018-12-26 | Apple Inc. | Mandrel flex circuit routing |
| US9980412B2 (en) | 2016-09-29 | 2018-05-22 | Intel Corporation | Flexible heat spreader |
| US10488898B2 (en) | 2017-03-31 | 2019-11-26 | Microsoft Technology Licensing, Llc | Flexible heat spreader |
| US10146278B2 (en) | 2017-03-31 | 2018-12-04 | Dell Products L. P. | Thermal spreader spanning two (or more) housings |
| US10120421B1 (en) | 2017-06-21 | 2018-11-06 | Dell Products L.P. | Flexible information handling system display |
| US10571977B2 (en) | 2017-12-26 | 2020-02-25 | Intel Corporation | Technologies for hinges for dual screen devices |
| US10936031B2 (en) | 2018-04-13 | 2021-03-02 | Dell Products L.P. | Information handling system dynamic thermal transfer control |
| US10579113B2 (en) | 2018-04-13 | 2020-03-03 | Dell Products L.P. | Graphite thermal conduit spring |
| US20200033911A1 (en) | 2018-07-27 | 2020-01-30 | George Moser | Laptop computer with multiple displays |
| US10254803B1 (en) | 2018-07-31 | 2019-04-09 | Dell Products, L.P. | Multi-form factor information handling system (IHS) with layered, foldable, bendable, flippable, rotatable, removable, displaceable, and/or slideable component(s) |
| US11231757B2 (en) * | 2018-08-01 | 2022-01-25 | Intel Corporation | Thermal dissipation in dual-chassis devices |
| US10976782B2 (en) | 2018-12-21 | 2021-04-13 | Intel Corporation | Offset hinge assembly for mobile compute devices |
| US11206748B2 (en) * | 2019-12-13 | 2021-12-21 | Intel Corporation | Flexible hinge to accommodate a flexible heat spreader |
| US12117876B2 (en) * | 2020-11-21 | 2024-10-15 | Intel Corporation | Hinge assembly and guide assembly for electronic devices using a heat carrying member |
-
2020
- 2020-11-21 US US17/100,849 patent/US12117876B2/en active Active
-
2021
- 2021-09-20 PL PL21197807.7T patent/PL4002057T3/pl unknown
- 2021-09-20 EP EP21197807.7A patent/EP4002057B1/en active Active
- 2021-10-21 CN CN202111228788.8A patent/CN114527833A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN114527833A (zh) | 2022-05-24 |
| US12117876B2 (en) | 2024-10-15 |
| US20210103317A1 (en) | 2021-04-08 |
| EP4002057A1 (en) | 2022-05-25 |
| EP4002057C0 (en) | 2025-10-08 |
| EP4002057B1 (en) | 2025-10-08 |
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