PL402019A1 - Method for preparing layered materials solder - Google Patents
Method for preparing layered materials solderInfo
- Publication number
- PL402019A1 PL402019A1 PL402019A PL40201912A PL402019A1 PL 402019 A1 PL402019 A1 PL 402019A1 PL 402019 A PL402019 A PL 402019A PL 40201912 A PL40201912 A PL 40201912A PL 402019 A1 PL402019 A1 PL 402019A1
- Authority
- PL
- Poland
- Prior art keywords
- copper
- subjected
- annealing
- silver
- alloys
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 238000000137 annealing Methods 0.000 abstract 2
- 229910001316 Ag alloy Inorganic materials 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 238000005253 cladding Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 230000002498 deadly effect Effects 0.000 abstract 1
- 238000005098 hot rolling Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Metal Rolling (AREA)
Abstract
Sposób wytwarzania lutowniczych taśm trójwarstwowych z udziałem stopów srebra i stopów miedzi jako okładzin zewnętrznych i środkowej warstwy miedzianej charakteryzuje się tym, że materiał warstwowy otrzymuje się w procesie prasowania, na prasie z podgrzewanymi do temperatury 400-460°C kowadłami z naciskiem jednostkowym w zakresie 250-350 MPa w czasie 200 do 600 s, odcinków płaskownika spoiwa twardego na bazie srebra lub/i miedzi i wewnętrznego płaskownika miedzianego o ściśle określonych wymiarach z względną redukcją wysokości w zakresie 35-50%, który następnie po operacji wygrzania w temperaturze 600-650°C przez 2-4 h poddaje się walcowaniu na gorąco z względną redukcją wysokości pakietu wynoszącą 75-90%, a następnie materiał poddaje się wyżarzaniu w temperaturze 560-580°C przez 1 h i kolejno walcuje się na zimno do grubości końcowej stosując w pojedynczych przepustach gniot jednostkowy wynoszący 10-25% osiągając w każdym cyklu gniot sumaryczny 20-45%, przy czym dla taśmy o grubości poniżej 2 mm wyżarzanie międzyoperacyjne korzystnie prowadzi się w temperaturze 500-540°C przez 2-4 h, w atmosferze ochronnej, i tak otrzymaną taśmę poddaje się czyszczeniu powierzchni i cięciu na wymaganą szerokość.The method of producing three-layer soldering tapes with the participation of silver alloys and copper alloys as external cladding and middle copper layer is characterized by the fact that the layered material is obtained by pressing, on a press with anvils heated to 400-460 ° C with a unit pressure of 250 -350 MPa during 200 to 600 s, sections of a flat binder based on silver or / and copper and an internal copper flat bar with strictly defined dimensions with a relative height reduction in the range of 35-50%, which then after annealing at 600-650 ° C for 2-4 h is subjected to hot rolling with a relative reduction of the packet height of 75-90%, and then the material is annealed at 560-580 ° C for 1 h and successively cold rolled to final thickness using in individual unit crest culverts amounting to 10-25% achieving in each cycle creases p deadly 20-45%, where for strips less than 2 mm thick annealing is preferably carried out at a temperature of 500-540 ° C for 2-4 hours, in a protective atmosphere, and the strip thus obtained is subjected to surface cleaning and cutting to the required width .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL402019A PL220380B1 (en) | 2012-12-12 | 2012-12-12 | Method for preparing layered materials solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL402019A PL220380B1 (en) | 2012-12-12 | 2012-12-12 | Method for preparing layered materials solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL402019A1 true PL402019A1 (en) | 2014-06-23 |
| PL220380B1 PL220380B1 (en) | 2015-10-30 |
Family
ID=50943676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL402019A PL220380B1 (en) | 2012-12-12 | 2012-12-12 | Method for preparing layered materials solder |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL220380B1 (en) |
-
2012
- 2012-12-12 PL PL402019A patent/PL220380B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PL220380B1 (en) | 2015-10-30 |
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