PL4100880T3 - Urządzenia transakcyjne z podwójnym interfejsem metlowym i sposoby ich wytwarzania - Google Patents

Urządzenia transakcyjne z podwójnym interfejsem metlowym i sposoby ich wytwarzania

Info

Publication number
PL4100880T3
PL4100880T3 PL21709239.4T PL21709239T PL4100880T3 PL 4100880 T3 PL4100880 T3 PL 4100880T3 PL 21709239 T PL21709239 T PL 21709239T PL 4100880 T3 PL4100880 T3 PL 4100880T3
Authority
PL
Poland
Prior art keywords
manufacturing
methods
metal interface
transaction devices
dual metal
Prior art date
Application number
PL21709239.4T
Other languages
English (en)
Inventor
Adam Lowe
John Esau
Original Assignee
Composecure, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Composecure, Llc filed Critical Composecure, Llc
Publication of PL4100880T3 publication Critical patent/PL4100880T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Manufacture Of Switches (AREA)
  • Details Of Aerials (AREA)
PL21709239.4T 2020-02-07 2021-02-05 Urządzenia transakcyjne z podwójnym interfejsem metlowym i sposoby ich wytwarzania PL4100880T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202062971439P 2020-02-07 2020-02-07
PCT/US2021/016741 WO2021158866A1 (en) 2020-02-07 2021-02-05 Dl METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF

Publications (1)

Publication Number Publication Date
PL4100880T3 true PL4100880T3 (pl) 2026-03-09

Family

ID=74845062

Family Applications (1)

Application Number Title Priority Date Filing Date
PL21709239.4T PL4100880T3 (pl) 2020-02-07 2021-02-05 Urządzenia transakcyjne z podwójnym interfejsem metlowym i sposoby ich wytwarzania

Country Status (17)

Country Link
EP (2) EP4651020A3 (pl)
JP (2) JP7611925B2 (pl)
CN (1) CN115244543A (pl)
AR (1) AR121278A1 (pl)
AU (1) AU2021216452B2 (pl)
BR (1) BR112022015587A2 (pl)
CA (1) CA3165428A1 (pl)
CO (1) CO2022011674A2 (pl)
DK (1) DK4100880T3 (pl)
ES (1) ES3057258T3 (pl)
FI (1) FI4100880T3 (pl)
MX (1) MX2022009683A (pl)
PL (1) PL4100880T3 (pl)
PT (1) PT4100880T (pl)
TW (1) TWI804805B (pl)
WO (1) WO2021158866A1 (pl)
ZA (1) ZA202209521B (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025194016A1 (en) * 2024-03-15 2025-09-18 Composecure, Llc Injection-molded-metal smart card with non-metal discontinuity
DE102024107861A1 (de) * 2024-03-19 2025-09-25 Giesecke+Devrient ePayments GmbH Verfahren zum herstellen eines trägerkörpers, portabler datenträger und herstellungsvorrichtung für selbige

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR4984E (fr) 1904-02-03 1905-11-25 Andre Gambin Système de propulseur à forage centrifuge et à traction pneumatique pour navires, ballons, etc.
JPH0718875U (ja) * 1993-09-17 1995-04-04 孝史 前原 吊り下げ名札及び穿孔機
FR2963139B1 (fr) 2010-07-20 2012-09-14 Oberthur Technologies Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne
US20130126622A1 (en) * 2011-08-08 2013-05-23 David Finn Offsetting shielding and enhancing coupling in metallized smart cards
US9812782B2 (en) * 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9390364B2 (en) * 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US9697459B2 (en) * 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US10783426B2 (en) * 2012-08-30 2020-09-22 David Finn Dual-interface metal hybrid smartcard
US20150269477A1 (en) * 2012-08-30 2015-09-24 David Finn Dual-interface hybrid metal smartcard with a booster antenna or coupling frame
WO2014113765A1 (en) * 2013-01-21 2014-07-24 Composecure, Llc Metal card with radio frequency (rf) transmission capability
JP2015149833A (ja) 2014-02-06 2015-08-20 デクセリアルズ株式会社 電子機器
FI3779795T3 (fi) 2015-07-08 2024-07-25 Composecure Llc Metallinen älykortti kaksoisliitäntäominaisuudella
US9390366B1 (en) 2015-07-08 2016-07-12 Composecure, Llc Metal smart card with dual interface capability
EP3487678B1 (en) * 2016-07-21 2020-11-11 SABIC Global Technologies B.V. Multilayer identity article and method of making the same
US10762412B2 (en) * 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) * 2016-07-27 2021-04-13 Composecure, Llc RFID device
DK3491584T3 (da) 2016-07-27 2022-10-17 Composecure Llc Omstøbte elektroniske komponenter til transaktionskort og fremgangsmåder til fremstilling deraf
US9940571B1 (en) * 2017-08-25 2018-04-10 Capital One Services, Llc Metal contactless transaction card
AU2019205433B2 (en) 2018-05-10 2021-04-08 Composecure, Llc Dual interface metal smart card with booster antenna

Also Published As

Publication number Publication date
EP4100880B1 (en) 2025-10-08
AR121278A1 (es) 2022-05-04
ZA202209521B (en) 2024-01-31
JP7829646B2 (ja) 2026-03-13
MX2022009683A (es) 2022-09-09
JP7611925B2 (ja) 2025-01-10
AU2021216452A1 (en) 2022-08-18
AU2021216452B2 (en) 2023-10-19
JP2023513210A (ja) 2023-03-30
CN115244543A (zh) 2022-10-25
JP2024178318A (ja) 2024-12-24
EP4651020A3 (en) 2026-01-21
BR112022015587A2 (pt) 2022-09-27
TW202139068A (zh) 2021-10-16
DK4100880T3 (da) 2026-01-12
CO2022011674A2 (es) 2022-08-30
FI4100880T3 (fi) 2026-01-14
KR20220137928A (ko) 2022-10-12
WO2021158866A1 (en) 2021-08-12
TWI804805B (zh) 2023-06-11
ES3057258T3 (en) 2026-02-27
EP4651020A2 (en) 2025-11-19
CA3165428A1 (en) 2021-08-12
PT4100880T (pt) 2026-01-14
EP4100880A1 (en) 2022-12-14

Similar Documents

Publication Publication Date Title
JP1724412S (ja) イヤリング
JP1724304S (ja) イヤリング
JP1714159S (ja) イヤリング
PL4100880T3 (pl) Urządzenia transakcyjne z podwójnym interfejsem metlowym i sposoby ich wytwarzania
IL286492A (en) Sialidase-resistant saccharide and method of making and using the same
JP1764876S (ja) イヤリング
JP1724523S (ja) イヤリング
JP1784796S (ja) 耳飾り
JP1714170S (ja) イヤリング
IL286485A (en) Pi4-kinase inhibitors and methods of using the same
TWI800294B (zh) 銀粉及其製造方法
JP1714158S (ja) イヤリング
IL299700A (en) Kcnt1 inhibitors and methods of use
PL4084208T3 (pl) Wyprowadzenie elektrodowe wykonane z metali niejednorodnych oraz sposób jego wytwarzania
TWI799578B (zh) 鑽石接合體及鑽石接合體之製造方法
JP1772790S (ja) イヤリング
TWI799791B (zh) 構造體及其製造方法
EP4250349A4 (en) CHIP PACKAGE AND ASSOCIATED PREPARATION METHOD
JP1724648S (ja) イヤリング
KR102592664B9 (ko) 앱타머 및 앱타머의 제조방법
JP1723727S (ja) 耳飾り
TWI799952B (zh) 顯示裝置之製造方法
EP3926674A4 (en) Semiconductor structure and manufacturing method therefor
TWI799763B (zh) 玻璃基板之製造方法及玻璃基板
TH2302000683S (th) ชิ้นส่วนของเครื่องประดับ