PL412719A1 - Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia - Google Patents

Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia

Info

Publication number
PL412719A1
PL412719A1 PL412719A PL41271915A PL412719A1 PL 412719 A1 PL412719 A1 PL 412719A1 PL 412719 A PL412719 A PL 412719A PL 41271915 A PL41271915 A PL 41271915A PL 412719 A1 PL412719 A1 PL 412719A1
Authority
PL
Poland
Prior art keywords
melting
range
powder composition
absorbent
selective sintering
Prior art date
Application number
PL412719A
Other languages
English (en)
Inventor
Paweł Szczurek
Konrad Głowacki
Original Assignee
Sinterit Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinterit Spółka Z Ograniczoną Odpowiedzialnością filed Critical Sinterit Spółka Z Ograniczoną Odpowiedzialnością
Priority to PL412719A priority Critical patent/PL412719A1/pl
Priority to US15/737,682 priority patent/US20180155559A1/en
Priority to EP16745165.7A priority patent/EP3310850A1/en
Priority to PCT/IB2016/053632 priority patent/WO2016203453A1/en
Publication of PL412719A1 publication Critical patent/PL412719A1/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)

Abstract

Zgłoszenie dotyczy kompozycji proszku do wytwarzania elementów przestrzennych w urządzeniach stosujących metodę selektywnego spiekania lub/i topienia z użyciem źródła energii elektromagnetycznej, zwłaszcza lasera, zawierającą nie mniej niż 40% wag. substancji bazowej oraz ewentualnie dodatkowe składniki, zwłaszcza wybrane z grupy składającej się z: rozjaśniacza, barwnika widzialnego, sproszkowanego metalu lub minerału, włókna węglowego lub szklanego, kulek szklanych lub absorberów UV, antyutleniaczy, dodatków poprawiających właściwości niepalne, dodatków poprawiające płynność plastiku charakteryzuje się tym, że zawiera substancję absorbującą, przy czym wartość maksymalnej absorbancji substancji absorbującej dla fal w zakresie 700 - 6000 nm jest nie mniejsza niż 0,05, a średnia wartość absorbancji w zakresie fal 400 - 700 nm jest co najmniej dwukrotnie mniejsza od maksymalnej absorbancji dla fal w zakresie 700 - 6000 nm, oraz temperatura rozkładu lub topienia się substancji absorbującej jest większa niż temperatura topnienia proszku bazowego.
PL412719A 2015-06-17 2015-06-17 Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia PL412719A1 (pl)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PL412719A PL412719A1 (pl) 2015-06-17 2015-06-17 Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia
US15/737,682 US20180155559A1 (en) 2015-06-17 2016-06-17 Powder composition and method for producing three-dimensional objects by selective laser sintering and/or melting.
EP16745165.7A EP3310850A1 (en) 2015-06-17 2016-06-17 Powder composition and method for producing three-dimensional objects by selective laser sintering and/or melting
PCT/IB2016/053632 WO2016203453A1 (en) 2015-06-17 2016-06-17 Powder composition and method for producing three-dimensional objects by selective laser sintering and/or melting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL412719A PL412719A1 (pl) 2015-06-17 2015-06-17 Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia

Publications (1)

Publication Number Publication Date
PL412719A1 true PL412719A1 (pl) 2016-12-19

Family

ID=57542479

Family Applications (1)

Application Number Title Priority Date Filing Date
PL412719A PL412719A1 (pl) 2015-06-17 2015-06-17 Kompozycja proszku i sposób wytwarzania trójwymiarowych obiektów metodą selektywnego spiekania lub/i topienia

Country Status (4)

Country Link
US (1) US20180155559A1 (pl)
EP (1) EP3310850A1 (pl)
PL (1) PL412719A1 (pl)
WO (1) WO2016203453A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108164719A (zh) * 2017-12-27 2018-06-15 湖南华曙高科技有限责任公司 一种选择性激光烧结用聚氨酯材料及其制备方法
DE102018219302A1 (de) * 2018-11-12 2020-05-14 Eos Gmbh Electro Optical Systems Selektives Sintern von polymerbasiertem Aufbaumaterial
US20220034403A1 (en) * 2019-04-25 2022-02-03 Hewlett-Packard Development Company, L.P. Seal assemblies having a sensor
DE102020105077A1 (de) 2020-02-26 2021-08-26 Treffert GmbH & Co. KG Polymer mit Zusatzstoffen für das Selektive Lasersintern

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19918981A1 (de) * 1999-04-27 2000-11-02 Bayer Ag Verfahren und Material zur Herstellung von Modellkörpern
US20020156161A1 (en) * 2000-02-11 2002-10-24 Reiko Koshida Thermoplastic resin compositions for laser welding and articles formed therefrom
DE102004012683A1 (de) * 2004-03-16 2005-10-06 Degussa Ag Lasersintern mit Lasern mit einer Wellenlänge von 100 bis 3000 nm
WO2008067496A2 (en) * 2006-11-29 2008-06-05 Desktop Factory Inc. Sinterable powder
JP5271125B2 (ja) * 2009-03-13 2013-08-21 テクノポリマー株式会社 熱可塑性樹脂組成物、並びにこれを用いた熱可塑性樹脂成形品の製造方法
DE102015006533A1 (de) * 2014-12-22 2016-06-23 Voxeljet Ag Verfahren und Vorrichtung zum Herstellen von 3D-Formteilen mit Schichtaufbautechnik

Also Published As

Publication number Publication date
WO2016203453A1 (en) 2016-12-22
EP3310850A1 (en) 2018-04-25
US20180155559A1 (en) 2018-06-07

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