PL4234940T3 - Urządzenie lutownicze - Google Patents

Urządzenie lutownicze

Info

Publication number
PL4234940T3
PL4234940T3 PL21882439.9T PL21882439T PL4234940T3 PL 4234940 T3 PL4234940 T3 PL 4234940T3 PL 21882439 T PL21882439 T PL 21882439T PL 4234940 T3 PL4234940 T3 PL 4234940T3
Authority
PL
Poland
Prior art keywords
soldering device
soldering
Prior art date
Application number
PL21882439.9T
Other languages
English (en)
Inventor
Tsutomu Hiyama
Original Assignee
Senju Metal Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd. filed Critical Senju Metal Industry Co., Ltd.
Publication of PL4234940T3 publication Critical patent/PL4234940T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/16—Combinations of two or more pumps ; Producing two or more separate gas flows
    • F04D25/166—Combinations of two or more pumps ; Producing two or more separate gas flows using fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4213—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps suction ports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4226—Fan casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL21882439.9T 2020-10-22 2021-08-25 Urządzenie lutownicze PL4234940T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020177089 2020-10-22
PCT/JP2021/031123 WO2022085298A1 (ja) 2020-10-22 2021-08-25 はんだ付け装置

Publications (1)

Publication Number Publication Date
PL4234940T3 true PL4234940T3 (pl) 2026-03-23

Family

ID=81291198

Family Applications (1)

Application Number Title Priority Date Filing Date
PL21882439.9T PL4234940T3 (pl) 2020-10-22 2021-08-25 Urządzenie lutownicze

Country Status (9)

Country Link
US (1) US20230347437A1 (pl)
EP (1) EP4234940B1 (pl)
JP (2) JPWO2022085298A1 (pl)
KR (1) KR102888350B1 (pl)
CN (1) CN116348679A (pl)
ES (1) ES3056352T3 (pl)
MX (1) MX2023002975A (pl)
PL (1) PL4234940T3 (pl)
WO (1) WO2022085298A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102726503B1 (ko) * 2023-03-30 2024-11-06 주식회사 에드파 가열 유닛 및 이를 포함하는 태양전지 리페어 장치

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
JP3592033B2 (ja) * 1997-05-20 2004-11-24 日本電熱計器株式会社 リフローはんだ付け方法およびその装置
JP3585750B2 (ja) * 1998-12-08 2004-11-04 日本電熱計器株式会社 リフローはんだ付け装置
JP2001144427A (ja) * 1999-11-12 2001-05-25 Nihon Dennetsu Keiki Co Ltd リフローはんだ付け装置
JP3877477B2 (ja) * 1999-11-12 2007-02-07 日本電熱計器株式会社 リフローはんだ付け装置
JP3515058B2 (ja) 2000-08-14 2004-04-05 有限会社ヨコタテクニカ リフロー半田付け装置
JP3581828B2 (ja) * 2000-12-25 2004-10-27 古河電気工業株式会社 半田付け用加熱炉
JP4537312B2 (ja) * 2001-02-23 2010-09-01 株式会社タムラ製作所 熱風噴射型加熱装置および加熱炉
JP3799278B2 (ja) * 2001-02-23 2006-07-19 株式会社タムラ製作所 熱風噴射装置、熱風噴射型加熱装置および加熱炉
JP4473814B2 (ja) * 2001-02-23 2010-06-02 株式会社タムラ製作所 加熱炉
JP2003069211A (ja) * 2001-08-30 2003-03-07 Matsushita Electric Ind Co Ltd リフロー半田付け方法と装置
JP2003069212A (ja) * 2001-08-30 2003-03-07 Matsushita Electric Ind Co Ltd リフロー半田付け装置
US6780225B2 (en) 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
EP1870191B9 (en) * 2004-08-04 2012-09-19 Senju Metal Industry Co., Ltd. Reflow oven
JP4319647B2 (ja) * 2005-06-30 2009-08-26 株式会社タムラ古河マシナリー リフロー炉
JP4866253B2 (ja) * 2007-01-15 2012-02-01 株式会社鈴木 リフロー炉
US8196799B2 (en) * 2010-06-28 2012-06-12 Illinois Tool Works Inc. Compression box for reflow oven heating with a pressurizing plate
JP5541353B1 (ja) 2012-12-28 2014-07-09 千住金属工業株式会社 気体吸込み孔の配列構造及びはんだ付け装置
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
US20150216092A1 (en) * 2014-01-28 2015-07-30 Illinois Tool Works Inc. Forced convection pre-heater for wave solder machine and related method
KR101675558B1 (ko) * 2015-01-26 2016-11-11 주식회사 티에스엠 휨 방지 노즐을 구비한 리플로우 장치
JP2018073902A (ja) * 2016-10-26 2018-05-10 株式会社タムラ製作所 リフロー装置

Also Published As

Publication number Publication date
US20230347437A1 (en) 2023-11-02
ES3056352T3 (en) 2026-02-19
KR20230065310A (ko) 2023-05-11
JP2023134597A (ja) 2023-09-27
EP4234940A4 (en) 2024-12-04
MX2023002975A (es) 2023-04-10
KR102888350B1 (ko) 2025-11-20
EP4234940B1 (en) 2025-10-01
EP4234940A1 (en) 2023-08-30
JP7445180B2 (ja) 2024-03-07
WO2022085298A1 (ja) 2022-04-28
JPWO2022085298A1 (pl) 2022-04-28
CN116348679A (zh) 2023-06-27

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