PL430653A1 - Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu - Google Patents

Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu

Info

Publication number
PL430653A1
PL430653A1 PL430653A PL43065319A PL430653A1 PL 430653 A1 PL430653 A1 PL 430653A1 PL 430653 A PL430653 A PL 430653A PL 43065319 A PL43065319 A PL 43065319A PL 430653 A1 PL430653 A1 PL 430653A1
Authority
PL
Poland
Prior art keywords
cutting
foil
laser
implementing
pieces
Prior art date
Application number
PL430653A
Other languages
English (en)
Inventor
Leon Kukiełka
Piotr Kasprzak
Dariusz Łada
Rafał Gryglicki
Original Assignee
Gryglicki Rafał Phu Kontakt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gryglicki Rafał Phu Kontakt filed Critical Gryglicki Rafał Phu Kontakt
Priority to PL430653A priority Critical patent/PL430653A1/pl
Priority to EP20020260.4A priority patent/EP3766626A1/en
Publication of PL430653A1 publication Critical patent/PL430653A1/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

Przedmiotem wynalazku jest sposób wytwarzania użytków z folii polipropylenowej o grubości od 20 µm do 100 µm obejmujący dostarczanie folii nad stołem operacyjnym, mocowanie folii do stołu, wycinanie użytku o zadanym kształcie za pomocą głowicy tnącej techniką laserową, osuszanie układu optycznego głowicy tnącej, nawijanie ażuru na bęben odbiorczy i opcjonalnie przenoszenie użytku do formy wtryskarki, charakteryzujące się tym, że użytki (142) wycina się w procesie zimnej ablacji laserem ultrafioletowym o długości fali promienia UV wynoszącej 355 nm, energii impulsu wynoszącej od 5 do 13 µJ, mocy lasera wynoszącej 5 W, częstotliwości wynoszącej od 20 do 150 kHz, czasie trwania impulsu wynoszącym od 15 do 35 ns i wielkości plamki wynoszącej od 5 do 50 µm, a cięcie prowadzi się przy zmiennej prędkości skanowania wynoszącej od 50 do 1500 mm/s. Przedmiotem wynalazku jest także urządzenie do realizacji sposobu.
PL430653A 2019-07-18 2019-07-18 Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu PL430653A1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL430653A PL430653A1 (pl) 2019-07-18 2019-07-18 Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu
EP20020260.4A EP3766626A1 (en) 2019-07-18 2020-06-04 Method of cutting pieces out of a polypropylene film and a device for implementing this method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL430653A PL430653A1 (pl) 2019-07-18 2019-07-18 Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP20020260.4A Previously-Filed-Application EP3766626A1 (en) 2019-07-18 2020-06-04 Method of cutting pieces out of a polypropylene film and a device for implementing this method

Publications (1)

Publication Number Publication Date
PL430653A1 true PL430653A1 (pl) 2021-01-25

Family

ID=71409077

Family Applications (1)

Application Number Title Priority Date Filing Date
PL430653A PL430653A1 (pl) 2019-07-18 2019-07-18 Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu

Country Status (2)

Country Link
EP (1) EP3766626A1 (pl)
PL (1) PL430653A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113473715B (zh) * 2021-06-28 2022-06-07 江苏先河激光技术有限公司 一种用于fpc柔性电路板的激光切割贴合方法、装置
CN114682927A (zh) * 2022-05-11 2022-07-01 昆山阿利曼自动化激光设备有限公司 一种pdlc镭射分区切割设备及实施方法
CN115431143B (zh) * 2022-06-02 2024-05-28 河南华辰智控技术有限公司 金属材料抗疲劳抛光装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL128119B1 (en) 1979-12-24 1983-12-31 Prod Nauk Podzespolow Elektron Blanking die for foil shapes
US6734387B2 (en) * 1999-05-27 2004-05-11 Spectra Physics Lasers, Inc. Method and apparatus for micro-machining of articles that include polymeric materials
IE20000618A1 (en) * 1999-08-03 2001-03-07 Xsil Technology Ltd A circuit singulation system and method
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP5665170B2 (ja) 2010-04-27 2015-02-04 スターテクノ株式会社 インモールドラベル成形品のラベル切断装置、ラベル切断供給装置、ラベル切断受け渡し装置とラベル切断方法、ラベル切断供給方法及びラベル切断受け渡し方法
JP5729752B2 (ja) * 2010-12-27 2015-06-03 スターテクノ株式会社 インモールドラベル成形用ラベル切断装置におけるラベルシート移送装置及びラベルシート移送方法
TW201232606A (en) 2011-01-31 2012-08-01 Gallant Prec Machining Co Multilayer thin-films substrate processing method and processing apparatus thereof
US20130168373A1 (en) * 2011-12-28 2013-07-04 Heng-Kuan Lin Laser cutting plotter
US20130258034A1 (en) 2012-03-31 2013-10-03 Devlinks, Ltd. In-Mold Labeling
PL225519B1 (pl) 2012-07-25 2017-04-28 Natalii Spółka Z Ograniczoną Odpowiedzialnością Sposób wykrawania etykiet, zwłaszcza z materiałów warstwowych i układania ich w stosy oraz urządzenia do realizacji tych sposobów
CN203124969U (zh) 2013-01-23 2013-08-14 刘茂珍 基于自适应光学的激光微细加工设备
CN103128450B (zh) 2013-02-19 2015-08-19 深圳市海目星激光科技有限公司 一种紫外激光加工装置
ITUB20153944A1 (it) 2015-09-28 2017-03-28 Cartes S R L Apparato e metodo per produrre porzioni discrete.
CN105665942A (zh) 2016-03-28 2016-06-15 深圳华工激光设备有限公司 一种用于薄膜加工中的激光设备及其方法

Also Published As

Publication number Publication date
EP3766626A1 (en) 2021-01-20

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