PL444240A1 - Konwerter termoelektryczny z funkcjonalnie gradowanych materiałów - Google Patents
Konwerter termoelektryczny z funkcjonalnie gradowanych materiałówInfo
- Publication number
- PL444240A1 PL444240A1 PL444240A PL44424023A PL444240A1 PL 444240 A1 PL444240 A1 PL 444240A1 PL 444240 A PL444240 A PL 444240A PL 44424023 A PL44424023 A PL 44424023A PL 444240 A1 PL444240 A1 PL 444240A1
- Authority
- PL
- Poland
- Prior art keywords
- thermoelectric elements
- type thermoelectric
- type
- thermal conductivity
- high thermal
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- 229910052797 bismuth Inorganic materials 0.000 abstract 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000002019 doping agent Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Powder Metallurgy (AREA)
Abstract
Przedmiotem zgłoszenia jest konwerter termoelektryczny wykonany z termoelektrycznych materiałów na bazie tellurku bizmutu, obejmujący: elementy termoelektryczne typu n i typu p, warstwy antydyfuzyjne na górnej i dolnej powierzchni elementów termoelektrycznych wykonane z metalu, elektrody metalowe stykające się z warstwami antydyfuzyjnymi i podłożami dielektrycznymi o wysokim przewodnictwie cieplnym, wspomniane podłoża dielektryczne o wysokim przewodnictwie cieplnym, przy czym wspomniane elementy termoelektryczne połączone są elektrycznie szeregowo za pomocą wspomnianych elektrod tworząc termopary, znajdujące się pomiędzy podłożami o wysokim przewodnictwie cieplnym, i przy czym z elementem termoelektrycznym typu n pierwszej termopary połączona jest ujemna końcówka przyłączeniowa, a z elementem termoelektrycznym typu p drugiej termopary połączona jest dodatnia końcówka przyłączeniowa, które to końcówki służą do wyprowadzenia generowanej energii elektrycznej, charakteryzujący się tym, że elementy termoelektryczne typu n(1) i typu p(2) na bazie stopów tellurku bizmutu zawierają domieszki o zróżnicowanym składzie chemicznym, odpowiednio: Se, fluorowiec lub jego mieszaniny, wzdłuż elementów termoelektrycznych typu n oraz Sb wzdłuż elementów termoelektrycznych typu p i tworzą gradowaną strukturę.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL444240A PL444240A1 (pl) | 2023-03-29 | 2023-03-29 | Konwerter termoelektryczny z funkcjonalnie gradowanych materiałów |
| EP23190983.9A EP4440287A1 (en) | 2023-03-29 | 2023-08-11 | Thermoelectric converter based on functionally graded materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL444240A PL444240A1 (pl) | 2023-03-29 | 2023-03-29 | Konwerter termoelektryczny z funkcjonalnie gradowanych materiałów |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL444240A1 true PL444240A1 (pl) | 2024-09-30 |
Family
ID=88241103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL444240A PL444240A1 (pl) | 2023-03-29 | 2023-03-29 | Konwerter termoelektryczny z funkcjonalnie gradowanych materiałów |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP4440287A1 (pl) |
| PL (1) | PL444240A1 (pl) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170194545A1 (en) * | 2011-08-31 | 2017-07-06 | L. Pierre de Rochemont | Fully integrated thermoelectric devices and their application to aerospace de-icing systems |
| US20180212132A1 (en) * | 2015-07-20 | 2018-07-26 | Lg Innotek Co., Ltd. | Thermoelectric element and cooling apparatus comprising same |
| US10490724B2 (en) * | 2014-12-26 | 2019-11-26 | Lintec Corporation | Peltier cooling element and method for manufacturing same |
| CN215496783U (zh) * | 2020-05-18 | 2022-01-11 | 意法半导体股份有限公司 | 集成热电转换器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL292813A (pl) * | 1962-06-29 | |||
| JP5153247B2 (ja) | 2007-07-27 | 2013-02-27 | 京セラ株式会社 | セグメント型熱電素子、熱電モジュール、発電装置および温度調節装置 |
| US20100229911A1 (en) | 2008-12-19 | 2010-09-16 | Hi-Z Technology Inc. | High temperature, high efficiency thermoelectric module |
| TWI605620B (zh) | 2011-12-30 | 2017-11-11 | 財團法人工業技術研究院 | 熱電模組及其製造方法 |
| CN103187519B (zh) | 2011-12-30 | 2016-02-03 | 财团法人工业技术研究院 | 热电模块及其制造方法 |
| JP6820556B2 (ja) | 2017-03-13 | 2021-01-27 | 国立研究開発法人産業技術総合研究所 | セグメント型熱電発電モジュール |
| CN107681044B (zh) | 2017-10-16 | 2020-08-14 | 中国科学院上海硅酸盐研究所 | 一种多段结构宽温域热电发电器件及制备方法 |
| WO2019090526A1 (zh) | 2017-11-08 | 2019-05-16 | 南方科技大学 | 一种高性能热电器件及其超快速制备方法 |
| CN107946452B (zh) | 2017-11-08 | 2020-08-04 | 南方科技大学 | 一种高性能热电器件及其超快速制备方法 |
| US20210313503A1 (en) | 2020-04-01 | 2021-10-07 | The University Of Chicago | Functionally graded organic thermoelectric materials and uses thereof |
-
2023
- 2023-03-29 PL PL444240A patent/PL444240A1/pl unknown
- 2023-08-11 EP EP23190983.9A patent/EP4440287A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170194545A1 (en) * | 2011-08-31 | 2017-07-06 | L. Pierre de Rochemont | Fully integrated thermoelectric devices and their application to aerospace de-icing systems |
| US10490724B2 (en) * | 2014-12-26 | 2019-11-26 | Lintec Corporation | Peltier cooling element and method for manufacturing same |
| US20180212132A1 (en) * | 2015-07-20 | 2018-07-26 | Lg Innotek Co., Ltd. | Thermoelectric element and cooling apparatus comprising same |
| CN215496783U (zh) * | 2020-05-18 | 2022-01-11 | 意法半导体股份有限公司 | 集成热电转换器 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4440287A1 (en) | 2024-10-02 |
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