PL509S2 - Electronic instrument housing - Google Patents

Electronic instrument housing Download PDF

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Publication number
PL509S2
PL509S2 PL18495F PL18495F PL509S2 PL 509 S2 PL509 S2 PL 509S2 PL 18495 F PL18495 F PL 18495F PL 18495 F PL18495 F PL 18495F PL 509 S2 PL509 S2 PL 509S2
Authority
PL
Poland
Prior art keywords
electronic instrument
instrument housing
housing
design
electronic device
Prior art date
Application number
PL18495F
Other languages
Polish (pl)
Inventor
Marek Janiszewski
Original Assignee
Sowar Spólka Z Oo
Filing date
Publication date
Application filed by Sowar Spólka Z Oo filed Critical Sowar Spólka Z Oo
Publication of PL509S2 publication Critical patent/PL509S2/en

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Description

Obudowa przyrzadu elektronicznego Prawo z rejestracji wzoru zdobniczego trwa od dnia: 08.091999r Przedmiotem wzoru zdobniczego jest obudowa przyrzadu elektronicznego, zwlaszcza z tworzywa sztucznego przeznaczona do pomieszczenia w niej podzespolów elektronicznych oraz doprowadzenia i odprowadzenia pradu. Istote wzoru zdobniczego stanowi nowa postac przedmiotu, przejawiajaca sie w jego ksztalcie. Przedmiot wzoru zdobniczego przedstawiono na zalaczonym rysunku, na którym fig. 1 przedstawia obudowe w widoku z góry, fig.2 - w widoku z boku, zas fig.3 - w widoku od czola. Obudowa przyrzadu elektronicznego jest utworzona z podstawy i pokrywy. Charakteryzuje sie ona tym, ze pokrywa jest dzielona i jest utworzona ze srodkowej czesci (1) i dwu skrajnych (2). Srodkowa czesc (1) ma rowki (3) rozmieszczone symetrycznie na jej górnej powierzchni i po bokach, zas skrajne czesci (2) maja zwezenie ku koncom a od czola maja wyciecie (4), zas od góry maja otwór (5), jak przedstawiono na fig. 1 - 3. PL PL PLElectronic Device Housing. The design registration right is valid from: September 8, 1999. The design is for an electronic device housing, particularly a plastic housing designed to house electronic components and conduct electricity. The essence of the design is a new form of the object, manifested in its shape. The design is shown in the attached drawing, in which Fig. 1 shows the housing from above, Fig. 2 from the side, and Fig. 3 from the front. The electronic device housing consists of a base and a cover. It is characterized by the fact that the cover is divided and is composed of a central part (1) and two outer parts (2). The middle part (1) has grooves (3) arranged symmetrically on its upper surface and on the sides, while the outer parts (2) are narrowed towards the ends and have a cutout (4) at the front, and an opening (5) at the top, as shown in Fig. 1 - 3. PL PL PL

Claims (1)

1.1.
PL18495F 1999-08-09 Electronic instrument housing PL509S2 (en)

Publications (1)

Publication Number Publication Date
PL509S2 true PL509S2 (en) 2002-10-31

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