PL66155Y1 - Chipboard of reduced density - Google Patents
Chipboard of reduced densityInfo
- Publication number
- PL66155Y1 PL66155Y1 PL119201U PL11920110U PL66155Y1 PL 66155 Y1 PL66155 Y1 PL 66155Y1 PL 119201 U PL119201 U PL 119201U PL 11920110 U PL11920110 U PL 11920110U PL 66155 Y1 PL66155 Y1 PL 66155Y1
- Authority
- PL
- Poland
- Prior art keywords
- chipboard
- reduced density
- corn seeds
- board
- chips
- Prior art date
Links
- 239000011093 chipboard Substances 0.000 title claims description 5
- 240000008042 Zea mays Species 0.000 claims description 6
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 claims description 6
- 235000002017 Zea mays subsp mays Nutrition 0.000 claims description 6
- 235000005822 corn Nutrition 0.000 claims description 6
- 239000002023 wood Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
- Laminated Bodies (AREA)
Description
Opis wzoru Przedmiotem wzoru u zytkowego jest p lyta wiórowa o obni zonej g esto sci przeznaczona do sto- sowania w meblarstwie i w budownictwie do aran zacji wn etrz. We wzorze u zytkowym Ru 55536 opisana jest p lyta ocieplajaco-usztywniaj aca, w której rdze n zawiera warstwy kszta ltuj ace kanaliki powietrzne, powierzchnia kszta ltuj aca poszczególne kanaliki zawiera pow loki przyczyniaj ace si e do zwi ekszenia izolacji cieplnej. Pow loki stanowi a paski z folii re- fleksyjnej pokrywaj ace powierzchnie elementów fa ldowanych z wy laczeniem pasm ich styku. P lyta wiórowa o obni zonej g esto sci wed lug wzoru wielowarstwowa charakteryzuje si e tym, ze sk lada si e z warstw zewn etrznych zbudowanych z równomiernie rozmieszczonych wiórów drzewnych, oraz warstwy wewn etrznej stanowi acej mieszanin e wiórów drzewnych i pra zonych nasion kukurydzy. Dodatek pra zonych nasion kukurydzy w ilo sci wagowej 50% pozwala uzyska c obni zony wspó lczynnik przewodzenia ciep la na poziomie 0,13 W/mK. Wytrzyma losc na zginanie przedmiotowej p lyty wynosi oko lo 6 N/mm 2 , natomiast modu l sprezysto sci wynosi oko lo 900 N/mm 2 . P lyta wiórowa o obni zonej g esto sci jest bli zej przedstawiona na za laczonym rysunku, na którym przedstawiono p lyt e w przekroju poprzecznym. P lyta wiórowa o obni zonej g esto sci zbudowana jest z warstw zewn etrznych stanowi acych rów- nomiernie rozmieszczone wióry drzewne 1, oraz warstwy wewn etrznej stanowi acej mieszanin e wiórów drzewnych 2 i pra zonych nasion kukurydzy 3. Proces formowania p lyty o obni zonej g esto sci przebiega w nast epuj acy sposób. Klej nanosi si e osobno na poszczególne komponenty p lyty, wióry warstwy zewn etrznej, wióry warstwy wewn etrznej, pra zone nasiona kukurydzy. Po zaklejeniu wiórów warstwy srodkowej i pra zonych nasion kukurydzy sporz adza si e mieszanin e, z której nast epnie jest formowana warstwa wewn etrzna p lyty. Warstwy zewn etrzne formowane s a z zaklejonych osobno wiórów drobnych. Uformowan a p lyt e prasuje pod cisnieniem 1,5 - 3,5 MPa. PL PLDescription of the pattern The subject of the utility model is a chipboard with reduced density, intended for use in the furniture industry and in the construction industry for interior design. The functional formula Ru 55536 describes a warming and stiffening plate, in which the core contains layers that shape air channels, the surface shaping individual channels contains coats that contribute to increasing thermal insulation. The surface of the curls consists of stripes of reflective foil covering the surfaces of the folded elements, excluding the bands of their contact. Chipboard with reduced density according to the multi-layer pattern is characterized by the fact that it consists of outer outer layers made of evenly distributed wood shavings and an inner layer consisting of a mixture of wood shavings and roasted corn seeds. The addition of toasted corn seeds in the amount of 50% by weight allows to obtain a reduced thermal conductivity coefficient of 0.13 W / mK. The bending strength of the board in question is about 6 N / mm 2, while the modulus of elasticity is about 900 N / mm 2. Particle board with reduced density is presented in the attached drawing, which shows the board in cross-section. Chipboard with reduced density is composed of outer layers being evenly spaced wood chips 1, and an inner layer consisting of a mixture of wood chips 2 and roasted corn seeds 3. The process of forming a board with a reduced g esto sci proceeds as follows. The adhesive is applied separately to the individual components of the board, external layer chips, internal layer chips, roasted corn seeds. After gluing the chips of the middle layer and the roasted corn seeds, a mixture is prepared, from which the inner layer of the board is then formed. The outer layers are formed of individually glued fine chips. The formed plate is pressed under a pressure of 1.5 - 3.5 MPa. PL PL
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL119201U PL66155Y1 (en) | 2010-07-21 | 2010-07-21 | Chipboard of reduced density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL119201U PL66155Y1 (en) | 2010-07-21 | 2010-07-21 | Chipboard of reduced density |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL119201U1 PL119201U1 (en) | 2012-01-30 |
| PL66155Y1 true PL66155Y1 (en) | 2012-10-31 |
Family
ID=45510420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL119201U PL66155Y1 (en) | 2010-07-21 | 2010-07-21 | Chipboard of reduced density |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL66155Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL442767A1 (en) * | 2022-11-09 | 2024-05-13 | Politechnika Koszalińska | Chipboard |
-
2010
- 2010-07-21 PL PL119201U patent/PL66155Y1/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL442767A1 (en) * | 2022-11-09 | 2024-05-13 | Politechnika Koszalińska | Chipboard |
| PL249486B1 (en) * | 2022-11-09 | 2026-04-27 | Politechnika Koszalińska | Chipboard |
Also Published As
| Publication number | Publication date |
|---|---|
| PL119201U1 (en) | 2012-01-30 |
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