PL99632B1 - Urzadzenie dociskowe i mocujace do elementow polprzewodnikowych - Google Patents

Urzadzenie dociskowe i mocujace do elementow polprzewodnikowych

Info

Publication number
PL99632B1
PL99632B1 PL1976193305A PL19330576A PL99632B1 PL 99632 B1 PL99632 B1 PL 99632B1 PL 1976193305 A PL1976193305 A PL 1976193305A PL 19330576 A PL19330576 A PL 19330576A PL 99632 B1 PL99632 B1 PL 99632B1
Authority
PL
Poland
Prior art keywords
semiconductors
pressure
fastening device
fastening
Prior art date
Application number
PL1976193305A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of PL99632B1 publication Critical patent/PL99632B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
PL1976193305A 1975-11-28 1976-10-27 Urzadzenie dociskowe i mocujace do elementow polprzewodnikowych PL99632B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS7500008082A CS180334B1 (en) 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment

Publications (1)

Publication Number Publication Date
PL99632B1 true PL99632B1 (pl) 1978-07-31

Family

ID=5430929

Family Applications (1)

Application Number Title Priority Date Filing Date
PL1976193305A PL99632B1 (pl) 1975-11-28 1976-10-27 Urzadzenie dociskowe i mocujace do elementow polprzewodnikowych

Country Status (9)

Country Link
US (1) US4104677A (pl)
CH (1) CH596669A5 (pl)
CS (1) CS180334B1 (pl)
DD (1) DD127720A1 (pl)
DE (1) DE2649824A1 (pl)
FR (1) FR2333351A1 (pl)
GB (1) GB1511100A (pl)
PL (1) PL99632B1 (pl)
SE (1) SE7612392L (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH616537A5 (pl) * 1978-01-17 1980-03-31 Bbc Brown Boveri & Cie
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
TW335503B (en) * 1996-02-23 1998-07-01 Semiconductor Energy Lab Kk Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL288523A (pl) * 1961-08-04 1900-01-01
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1514477C3 (de) * 1965-06-10 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
DE2224040C3 (de) * 1970-09-30 1981-07-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
DE2049012C3 (de) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
US3688159A (en) * 1970-10-28 1972-08-29 Cutler Hammer Inc Compression mounted scr clamp with heat sink means
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
SU439034A1 (ru) * 1972-06-07 1974-08-05 Предприятие П/Я Р-6517 Устройство дл охлаждени
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly

Also Published As

Publication number Publication date
DE2649824A1 (de) 1977-06-30
CH596669A5 (pl) 1978-03-15
US4104677A (en) 1978-08-01
DD127720A1 (de) 1977-10-12
CS180334B1 (en) 1977-12-30
SE7612392L (sv) 1977-05-29
GB1511100A (en) 1978-05-17
FR2333351A1 (fr) 1977-06-24

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