PT2902846T - Composição de resina fotossensível positiva - Google Patents
Composição de resina fotossensível positivaInfo
- Publication number
- PT2902846T PT2902846T PT128847555T PT12884755T PT2902846T PT 2902846 T PT2902846 T PT 2902846T PT 128847555 T PT128847555 T PT 128847555T PT 12884755 T PT12884755 T PT 12884755T PT 2902846 T PT2902846 T PT 2902846T
- Authority
- PT
- Portugal
- Prior art keywords
- resin composition
- photosensitive resin
- positive photosensitive
- positive
- composition
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/074367 WO2014045434A1 (ja) | 2012-09-24 | 2012-09-24 | ポジ型感光性樹脂組成物 |
| EP12884755.5A EP2902846B1 (en) | 2012-09-24 | 2012-09-24 | Positive photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT2902846T true PT2902846T (pt) | 2019-12-18 |
Family
ID=50340783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT128847555T PT2902846T (pt) | 2012-09-24 | 2012-09-24 | Composição de resina fotossensível positiva |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150219991A1 (pt) |
| EP (1) | EP2902846B1 (pt) |
| JP (1) | JP6102736B2 (pt) |
| KR (1) | KR101969197B1 (pt) |
| CN (1) | CN104641291B (pt) |
| PT (1) | PT2902846T (pt) |
| SG (1) | SG11201501598TA (pt) |
| WO (1) | WO2014045434A1 (pt) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2902847B1 (en) * | 2012-09-25 | 2019-05-08 | Toray Industries, Inc. | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition |
| EP3276415A4 (en) | 2015-03-24 | 2018-09-19 | Toray Industries, Inc. | Photosensitive resin composition |
| US10451969B2 (en) | 2015-04-24 | 2019-10-22 | Toray Industries, Inc. | Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device |
| SG11201807054RA (en) * | 2016-03-28 | 2018-09-27 | Toray Industries | Resin composition, cured relief pattern thereof, and method for manufacturing semiconductor electronic component or semiconductor equipment using the same |
| TW201821280A (zh) | 2016-09-30 | 2018-06-16 | 日商富士軟片股份有限公司 | 積層體以及半導體元件的製造方法 |
| JP6810677B2 (ja) | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品 |
| KR102885086B1 (ko) * | 2020-09-25 | 2025-11-11 | 주식회사 엘지화학 | 폴리이미드 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치 |
| KR20230167345A (ko) * | 2021-04-01 | 2023-12-08 | 도레이 카부시키가이샤 | 적층체, 수지 조성물 및 반도체 장치의 제조 방법 |
| CN116414000B (zh) * | 2023-04-14 | 2024-12-20 | 江苏艾森半导体材料股份有限公司 | 感光性聚酰亚胺组合物、固化物和电子部件 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004109403A1 (ja) * | 2003-06-02 | 2004-12-16 | Toray Industries, Inc. | 感光性樹脂組成物およびそれを用いた電子部品ならびに表示装置 |
| JP4918968B2 (ja) | 2005-05-09 | 2012-04-18 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| JP4539505B2 (ja) | 2005-09-12 | 2010-09-08 | 住友ベークライト株式会社 | 感光性樹脂組成物 |
| JP5386781B2 (ja) | 2007-03-12 | 2014-01-15 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| KR101184527B1 (ko) * | 2007-06-06 | 2012-09-19 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴의 형성방법, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법 |
| US20110121435A1 (en) * | 2008-01-16 | 2011-05-26 | Kazuyuki Mitsukura | Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| JP5353064B2 (ja) * | 2008-02-19 | 2013-11-27 | 日立化成株式会社 | 感光性接着剤組成物、これを用いて得られる接着フィルム、接着シート、接着剤パターン、及び半導体装置 |
| JP5315754B2 (ja) * | 2008-03-31 | 2013-10-16 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物 |
| JP2009258471A (ja) | 2008-04-18 | 2009-11-05 | Toray Ind Inc | 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法 |
| JP5477527B2 (ja) * | 2008-09-30 | 2014-04-23 | 日産化学工業株式会社 | 末端官能基含有ポリイミドを含むポジ型感光性樹脂組成物 |
| CN102186904A (zh) * | 2008-10-20 | 2011-09-14 | 日本化药株式会社 | 聚酰亚胺树脂及其组合物 |
| JP5206977B2 (ja) * | 2009-03-12 | 2013-06-12 | 信越化学工業株式会社 | 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法 |
| WO2010137548A1 (ja) * | 2009-05-29 | 2010-12-02 | Dic株式会社 | 熱硬化性樹脂組成物およびその硬化物 |
| JP2011017898A (ja) * | 2009-07-09 | 2011-01-27 | Toray Ind Inc | 感光性カバーレイ |
| JP5483315B2 (ja) | 2009-07-09 | 2014-05-07 | Ｙｋｋ Ａｐ株式会社 | 開き戸 |
| JP5732815B2 (ja) * | 2009-10-30 | 2015-06-10 | 日立化成株式会社 | 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。 |
| KR101202012B1 (ko) * | 2009-12-08 | 2012-11-20 | 주식회사 엘지화학 | 감광성 폴리이미드 수지 조성물 |
| JP5417623B2 (ja) * | 2009-12-10 | 2014-02-19 | 信越化学工業株式会社 | ポリイミド系光硬化性樹脂組成物、パターン形成方法及び基板保護用皮膜 |
| TWI516527B (zh) * | 2009-12-10 | 2016-01-11 | 信越化學工業股份有限公司 | 光固化性樹脂組成物，圖案形成法和基板保護膜，以及使用該組成物之膜狀黏著劑及黏著片 |
| CN102985877B (zh) * | 2010-07-02 | 2015-06-10 | 东丽株式会社 | 感光性树脂组合物、感光性树脂组合物膜和使用它们的半导体器件 |
| JP5291744B2 (ja) * | 2010-11-02 | 2013-09-18 | 富士フイルム株式会社 | エッチングレジスト用感光性樹脂組成物、パターン作製方法、ｍｅｍｓ構造体及びその作製方法、ドライエッチング方法、ウェットエッチング方法、ｍｅｍｓシャッターデバイス、並びに、画像表示装置 |
| JP5742376B2 (ja) * | 2011-03-30 | 2015-07-01 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
-
2012
- 2012-09-24 SG SG11201501598TA patent/SG11201501598TA/en unknown
- 2012-09-24 CN CN201280075939.3A patent/CN104641291B/zh active Active
- 2012-09-24 KR KR1020157009233A patent/KR101969197B1/ko active Active
- 2012-09-24 PT PT128847555T patent/PT2902846T/pt unknown
- 2012-09-24 WO PCT/JP2012/074367 patent/WO2014045434A1/ja not_active Ceased
- 2012-09-24 EP EP12884755.5A patent/EP2902846B1/en active Active
- 2012-09-24 US US14/422,572 patent/US20150219991A1/en not_active Abandoned
- 2012-09-24 JP JP2013506966A patent/JP6102736B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104641291A (zh) | 2015-05-20 |
| EP2902846A4 (en) | 2016-06-01 |
| EP2902846A1 (en) | 2015-08-05 |
| KR101969197B1 (ko) | 2019-04-15 |
| SG11201501598TA (en) | 2015-04-29 |
| US20150219991A1 (en) | 2015-08-06 |
| JPWO2014045434A1 (ja) | 2016-08-18 |
| WO2014045434A1 (ja) | 2014-03-27 |
| CN104641291B (zh) | 2017-12-12 |
| EP2902846B1 (en) | 2019-11-20 |
| JP6102736B2 (ja) | 2017-03-29 |
| KR20150063424A (ko) | 2015-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201706103VA (en) | Resin composition | |
| PH12013500393A1 (en) | Resin composition | |
| PL2799489T3 (pl) | Kompozycja żywicy | |
| EP2898373A4 (en) | INK POWDER | |
| PT2871215T (pt) | Composição de resina de policarbonato | |
| EP2918636A4 (en) | METHACRYLIC RESIN COMPOSITION | |
| EP2837661A4 (en) | Resin composition | |
| SG10201709684TA (en) | Resin Composition | |
| EP2868699A4 (en) | COMPOSITION OF RESINS | |
| SG11201407090XA (en) | Positive photosensitive material | |
| EP2832795A4 (en) | Resin composition | |
| GB201200707D0 (en) | Composition | |
| EP2829574A4 (en) | LIGHT DIFFUSIBILITY RESIN COMPOSITION | |
| EP2891924A4 (en) | TONER | |
| EP2871197A4 (en) | PHENOLIC COMPOSITION | |
| EP3015523A4 (en) | RESIN COMPOSITION | |
| SG11201501598TA (en) | Positive photosensitive resin composition | |
| EP2711774A4 (en) | LIGHT-SENSITIVE RESIN COMPOSITION | |
| EP2980157A4 (en) | Resin composition | |
| GB201222958D0 (en) | Film | |
| EP2913352A4 (en) | NON-PHOTOSENSITIVE RESIN COMPOSITION | |
| EP2937731A4 (en) | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING THE SAME | |
| EP2878295A4 (en) | COMPOSITION | |
| PL2835400T3 (pl) | Kompozycja żywicy | |
| EP2891923A4 (en) | TONER |