PT3397702T - Tinta piezorresistiva, métodos e utilizações da mesma - Google Patents

Tinta piezorresistiva, métodos e utilizações da mesma

Info

Publication number
PT3397702T
PT3397702T PT177008976T PT17700897T PT3397702T PT 3397702 T PT3397702 T PT 3397702T PT 177008976 T PT177008976 T PT 177008976T PT 17700897 T PT17700897 T PT 17700897T PT 3397702 T PT3397702 T PT 3397702T
Authority
PT
Portugal
Prior art keywords
methods
piezoresistive ink
piezoresistive
ink
Prior art date
Application number
PT177008976T
Other languages
English (en)
Original Assignee
Univ Do Minho
Dynasol Elastomeros Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Do Minho, Dynasol Elastomeros Sa filed Critical Univ Do Minho
Publication of PT3397702T publication Critical patent/PT3397702T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
PT177008976T 2015-12-29 2017-01-02 Tinta piezorresistiva, métodos e utilizações da mesma PT3397702T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PT10906115 2015-12-29

Publications (1)

Publication Number Publication Date
PT3397702T true PT3397702T (pt) 2021-11-18

Family

ID=57860811

Family Applications (1)

Application Number Title Priority Date Filing Date
PT177008976T PT3397702T (pt) 2015-12-29 2017-01-02 Tinta piezorresistiva, métodos e utilizações da mesma

Country Status (4)

Country Link
US (2) USRE49626E1 (pt)
EP (1) EP3397702B1 (pt)
PT (1) PT3397702T (pt)
WO (1) WO2017114978A1 (pt)

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* Cited by examiner, † Cited by third party
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EP4183824B1 (en) 2017-12-11 2026-02-18 Feelit Technologies Ltd. Sensing using nanoparticle based strain sensors
US20210231231A1 (en) * 2018-04-27 2021-07-29 Feelit Technologies Ltd. Pinch valve monitoring
US20200104667A1 (en) * 2018-09-28 2020-04-02 Ppg Industries Ohio, Inc. Electrically Shielded Article
CN109810577B (zh) * 2019-01-17 2020-06-09 武汉大学 一种树突状纳米银导电油墨及全印制应力传感器的制备方法
EP3693419B1 (en) * 2019-02-06 2023-01-18 Biotronik Ag Strain sensor arrangement and appropriate manufacturing method
US12038312B2 (en) 2019-04-01 2024-07-16 Feelit Technologies Ltd. Methods and devices for determination of differential parameters associated with fluid flow within a conduit
CN110243276A (zh) * 2019-06-28 2019-09-17 江苏大学 一种应用于指关节的可拉伸应力应变传感器及制备方法
CN110527358A (zh) * 2019-08-19 2019-12-03 上海佳利笔业文具有限公司 一种复合材料笔芯及其制备方法
EP3865840A1 (en) * 2020-02-12 2021-08-18 The Provost, Fellows, Scholars and other Members of Board of Trinity College Dublin A nanocomposite material and uses thereof
US11740143B2 (en) * 2020-05-28 2023-08-29 Nano And Advanced Materials Institute Limited Flexible pressure sensor array and method for fabricating the same
BR102020025922A2 (pt) * 2020-07-28 2022-06-07 Universidade Federal De Minas Gerais Processo para obtenção de tinta de nanomateriais de carbono, produtos e uso em monitoramento de deformações, tensões e impacto
US11262247B1 (en) * 2020-10-14 2022-03-01 Cooper-Standard Automotive, Inc. Fluid conduit with printed sensors
CN114634736A (zh) * 2020-12-16 2022-06-17 中国科学院深圳先进技术研究院 一种压力响应型导电油墨及其制备的压阻式传感器
CN113699789A (zh) * 2021-09-23 2021-11-26 天津理工大学 一种低成本的具有褶皱结构的弹性应变传感材料的制备方法
CN113916417B (zh) * 2021-10-18 2024-06-28 天津科技大学 一种新型柔性应力传感器及其制备方法
CN114220619B (zh) * 2021-12-06 2023-11-10 厦门大学 一种柔性压阻复合材料及其制备方法
CN118613550A (zh) * 2022-01-28 2024-09-06 卡博特公司 具有碳纳米结构体的传导性墨
US12352641B2 (en) * 2022-02-11 2025-07-08 Balluff Gmbh Strain measurement device and overall device with such a strain measurement device
WO2023178462A1 (en) * 2022-03-21 2023-09-28 Super Rich Moulders Limited Smart mattress
GB2621213A (en) * 2022-05-10 2024-02-07 Ramsay Tech Ltd A sensor device and a method of forming a sensor device
WO2023218189A1 (en) 2022-05-10 2023-11-16 Ramsay Technologies Ltd A sensor device and a method of forming a sensor device
WO2023223021A1 (en) 2022-05-16 2023-11-23 Ramsay Technologies Ltd An item of protective equipment
GB202207117D0 (en) * 2022-05-16 2022-06-29 Ramsay Tech Ltd Printed sensors on protective headgear for prevention of injury and reduction of damage in trauma injuries
TR2023013224A1 (tr) * 2023-10-17 2025-04-21 Univ Sabanci Piezodirençli film üretiminde kullanıma uygun polimer bazlı mürekkep bileşimleri.
US12613151B2 (en) 2024-01-29 2026-04-28 Nano And Advanced Materials Institute Limited High sensitivity, wide range and any size printed pressure distribution monitoring ultrathin flexible mat system
FR3159166A1 (fr) 2024-02-12 2025-08-15 Touch Sensity Laque piézorésistive et son procédé de fabrication
CN118516012A (zh) * 2024-06-06 2024-08-20 中航电测仪器(西安)有限公司 一种用于高灵敏系数应变计的敏感油墨、敏感油墨印刷应变计及其制备方法

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GB2141548A (en) 1983-06-16 1984-12-19 Welwyn Electronics Ltd Strain-gauge transducer
US4708019A (en) 1984-06-27 1987-11-24 Gte Laboratories Incorporated Measurement of strain employing a piezoresistive blend of a doped acetylene polymer and an elastomer
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US20100123686A1 (en) 2008-11-19 2010-05-20 Sony Ericsson Mobile Communications Ab Piezoresistive force sensor integrated in a display
CH703737A1 (de) 2010-09-13 2012-03-15 Kistler Holding Ag Drucksensor mit piezoresistivem sensorchip-element.
WO2012033837A2 (en) * 2010-09-08 2012-03-15 Micropen Technologies Corporation Pressure sensing or force generating device
TWI446373B (zh) 2010-10-14 2014-07-21 Ind Tech Res Inst 壓阻材料的製造方法、壓阻組成物與壓力感測裝置
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CN105190923B (zh) 2013-03-15 2018-11-27 纳米复合材料公司 用作应变仪的复合材料

Also Published As

Publication number Publication date
US10590296B2 (en) 2020-03-17
EP3397702A1 (en) 2018-11-07
USRE49626E1 (en) 2023-08-29
WO2017114978A1 (en) 2017-07-06
EP3397702B1 (en) 2021-07-14
US20190023929A1 (en) 2019-01-24

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