SE0001943L - Modul för radiokommunikation - Google Patents

Modul för radiokommunikation

Info

Publication number
SE0001943L
SE0001943L SE0001943A SE0001943A SE0001943L SE 0001943 L SE0001943 L SE 0001943L SE 0001943 A SE0001943 A SE 0001943A SE 0001943 A SE0001943 A SE 0001943A SE 0001943 L SE0001943 L SE 0001943L
Authority
SE
Sweden
Prior art keywords
card
module
pcb
radio communication
accordance
Prior art date
Application number
SE0001943A
Other languages
Unknown language ( )
English (en)
Other versions
SE520151C2 (sv
SE0001943D0 (sv
Inventor
Shaofang Gong
Johan Nilsson
Original Assignee
Bluetronics Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluetronics Ab filed Critical Bluetronics Ab
Priority to SE0001943A priority Critical patent/SE520151C2/sv
Publication of SE0001943D0 publication Critical patent/SE0001943D0/sv
Priority to PCT/SE2001/000949 priority patent/WO2001095679A1/en
Priority to AU56895/01A priority patent/AU5689501A/en
Publication of SE0001943L publication Critical patent/SE0001943L/sv
Publication of SE520151C2 publication Critical patent/SE520151C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)
SE0001943A 2000-06-07 2000-06-07 Modul för radiokommunikation SE520151C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation
PCT/SE2001/000949 WO2001095679A1 (en) 2000-06-07 2001-05-03 Module for radio communication
AU56895/01A AU5689501A (en) 2000-06-07 2001-05-03 Module for radio communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation

Publications (3)

Publication Number Publication Date
SE0001943D0 SE0001943D0 (sv) 2000-06-07
SE0001943L true SE0001943L (sv) 2001-12-08
SE520151C2 SE520151C2 (sv) 2003-06-03

Family

ID=20279824

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001943A SE520151C2 (sv) 2000-06-07 2000-06-07 Modul för radiokommunikation

Country Status (3)

Country Link
AU (1) AU5689501A (sv)
SE (1) SE520151C2 (sv)
WO (1) WO2001095679A1 (sv)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6900708B2 (en) 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US6987307B2 (en) 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
KR20040003890A (ko) * 2002-07-04 2004-01-13 (주)에이엔티테크놀러지 라디오주파수 모듈
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
DE602005002547T2 (de) * 2004-02-23 2008-06-12 Georgia Tech Research Corp. Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
DE102006007381A1 (de) * 2006-02-15 2007-08-23 Infineon Technologies Ag Halbleiterbauelement für einen Ultraweitband-Standard in der Ultrahochfrequenz-Kommunikation und Verfahren zur Herstellung desselben
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US7646255B2 (en) 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
DE102006057332B4 (de) * 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
FR2919433B1 (fr) * 2007-07-27 2010-09-17 Thales Sa Module d'antenne compact.
CN101952961B (zh) * 2008-02-25 2013-01-30 飞兆半导体公司 包括集成薄膜电感器的微模块及其制造方法
US8854277B2 (en) 2008-11-19 2014-10-07 Nxp, B.V. Millimetre-wave radio antenna module
CN102074534B (zh) * 2009-11-24 2013-05-29 上海长丰智能卡有限公司 一种微型pcb射频模块及其封装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
JP3373753B2 (ja) * 1997-03-28 2003-02-04 株式会社東芝 超高周波帯無線通信装置
TW347936U (en) * 1997-11-28 1998-12-11 Delta Electronics Inc Apparatus for oscillator
US6228196B1 (en) * 1998-06-05 2001-05-08 Murata Manufacturing Co., Ltd. Method of producing a multi-layer ceramic substrate
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same

Also Published As

Publication number Publication date
SE520151C2 (sv) 2003-06-03
WO2001095679A1 (en) 2001-12-13
SE0001943D0 (sv) 2000-06-07
AU5689501A (en) 2001-12-17

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Legal Events

Date Code Title Description
NUG Patent has lapsed